Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M2S150TS-FCG1152I by Microchip Technology is a CMOS FPGA with 146124 logic cells, 574 inputs/outputs, and operates at 1.2V. It is used in applications requiring high-density programmable logic solutions with a max operating temperature of 100°C.
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Netroflash
The plastic/epoxy material used in the package body makes the FPGA lightweight and durable, suitable for a wide range of applications.
With a high number of logic cells, this FPGA offers great flexibility and processing power for complex digital designs.
Being surface mountable makes the FPGA easy to integrate into PCB designs, saving space and enabling automated assembly processes.
The low maximum supply voltage requirement of 1.26V helps in reducing power consumption and heat generation, making the FPGA more energy-efficient.
The CMOS technology used in the FPGA ensures low power consumption and high noise immunity, making it ideal for battery-operated devices and high-speed applications.
With a high number of inputs, the FPGA can accommodate a large number of external signals and data inputs, making it suitable for complex processing tasks.
The square package shape offers uniformity in size and allows for easy placement and alignment on the PCB, simplifying the manufacturing process.
The use of ball terminals provides a reliable and secure connection, ensuring good electrical contact and signal integrity in the FPGA.
The nominal supply voltage of 1.2V is a common standard, making it compatible with existing power supplies and circuits, simplifying integration.
Packaging the FPGA in trays allows for efficient storage, handling, and transportation, reducing the risk of damage and ensuring reliable delivery to customers.
The consistent power supply requirement of 1.2V ensures stable and reliable operation of the FPGA, minimizing the risk of voltage fluctuations affecting performance.
With a high number of terminals, the FPGA offers ample interfacing options for external connections, enabling versatile and customizable circuit designs.
Being a field-programmable gate array allows for reconfigurability and flexibility in implementing custom logic functions and algorithms, making it suitable for prototyping and rapid development.
The grid array package style provides a high terminal count in a compact form factor, optimizing the use of space on the PCB and enabling high-density designs.
The low minimum supply voltage requirement of 1.14V allows for operation in low-power scenarios, extending battery life and enabling energy-efficient applications.
The high maximum operating temperature of 100°C ensures reliable performance in harsh environments and industrial applications where temperature fluctuations are common.
The 1mm pitch of terminals allows for accurate and precise mounting on the PCB, ensuring proper alignment and reliable electrical connections in the FPGA.
The wide range of minimum operating temperature of -40°C makes the FPGA suitable for use in extreme cold environments and industrial applications requiring temperature resilience.
The use of tin, silver, and copper finishing on the terminals ensures good conductivity, corrosion resistance, and durability, enhancing the reliability and longevity of the FPGA.
Having terminals positioned at the bottom allows for easy access to soldering points during assembly, facilitating efficient and reliable soldering of the FPGA onto the PCB.
With a moisture sensitivity level of 4, the FPGA requires careful handling and storage in dry conditions to prevent moisture-related issues during assembly and operation.
The low maximum seated height of 2.9mm allows for compact and slim PCB designs, saving space and enabling the integration of the FPGA in space-constrained applications.
The width of 35mm provides a good balance between size and functionality, making the FPGA suitable for a wide range of applications without compromising on performance.
With a high number of outputs, the FPGA can drive multiple external devices and circuits, enabling complex signal processing and control capabilities in electronic systems.
The maximum time allowed at peak reflow temperature of 250°C for 40 seconds ensures proper soldering and component bonding during assembly, leading to reliable and durable connections.
The high peak reflow temperature tolerance of 250°C allows for assembly processes that require elevated temperatures, ensuring secure attachment of the FPGA to the PCB.
The length of 35mm provides a compact and space-saving form factor for the FPGA, making it suitable for miniaturized electronic devices and applications with size constraints.
Field Programmable Gate Arrays (FPGA) M2S150TS-FCG1152I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology
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M2S150TS-FCG1152I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Datasheet 11/Jan/2023 Mult Dev 10/Mar/2023
PCN Assembly/Origin - Manufacturing Change 30/Jun/2021
PCN Other - Logistics 16/Nov/2016
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
1N4148
Dc Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CC0603KRX7R9BB104
Yageo
Yageo's CC0603KRX7R9BB104 is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. With X7R temperature characteristics, it operates b/w -55 to 125°C. Ideal for surface mount applications in electronics due to its compact size of 1.6mm x 0.8mm x 0.8mm and wraparound terminals.
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
Semiconductors
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
STMicroelectronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
LM358ADR
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
MMBT3904LT1G
Onsemi
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
XC3S50AN-4TQG144C
Xilinx
XC3S50AN-4TQG144C by Xilinx is a CMOS-based FPGA with 1584 logic cells and 176 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.
M1A3P1000-PQG208I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
ICE40HX4K-CB132
Lattice Semiconductor
ICE40HX4K-CB132 by Lattice Semiconductor is a FPGA with 3520 logic cells, 440 CLBs, and 95 inputs/outputs. Operating at max frequency of 133 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and very thin profile, it offers versatility in design while maintaining reliability.
XCAU10P-2UBVA368I
Xilinx XCAU10P-2UBVA368I FPGA features 96250 logic cells, 5500 CLBs, and 128 inputs/outputs. Ideal for applications requiring high-density programmable ICs in a compact GRID ARRAY package with low supply voltage and wide operating temperature range.
XC6SLX16-2CSG225I
Xilinx XC6SLX16-2CSG225I FPGA features 14579 logic cells, 1139 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
ICE5LP4K-SG48ITR50
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
LCMXO2-2000HC-4MG132I
LCMXO2-2000HC-4MG132I by Lattice Semiconductor is a 2112 logic cell FPGA with 104 inputs/outputs, operating at max 133 MHz. Suitable for applications requiring high-speed processing and programmable ICs in various industries like telecommunications and consumer electronics.
LCMXO2-256ZE-1UMG64I
LCMXO2-256ZE-1UMG64I by Lattice Semiconductor is a 256 logic cell FPGA with 44 inputs/outputs, operating at 1.2V. It comes in a square grid array package suitable for applications requiring high-density programmable ICs and operates b/w -40 to 100°C.
LCMXO2-4000HC-4TG144I
LCMXO2-4000HC-4TG144I by Lattice Semiconductor is a FPGA with 4320 logic cells, 114 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring high-density programmable ICs in compact spaces with temperature range of -40 to 100°C.
A3P250-FGG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC7S6-1CSGA225I
Xilinx XC7S6-1CSGA225I FPGA features 6000 logic cells, 469 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a low profile grid array package style.
10M08DCF256C8G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
LFXP2-5E-5TN144I
LFXP2-5E-5TN144I by Lattice Semiconductor is a 5000 logic cell FPGA with 625 CLBs, operating at max 435 MHz. It has 100 inputs/outputs, uses CMOS tech, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like IoT devices or industrial automation systems.
LFE5U-25F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
Intel
The Intel 10M08DCF256C8G is a Field Programmable Gate Array (FPGA) with 8000 logic cells and 500 configurable logic blocks (CLBs). It operates at a max supply voltage of 1.25V and is suitable for applications requiring programmable ICs in various industries.
LCMXO2-7000HC-4BG256I
LCMXO2-7000HC-4BG256I by Lattice Semiconductor is a FPGA with 6864 logic cells, 206 inputs/outputs, and operates at 2.375V to 3.465V. Ideal for applications requiring high-density programmable ICs in a compact grid array package with low profile and fine pitch terminals.
EP4CGX15BF14I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: LBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
XC7A75T-2FGG484I
The Xilinx XC7A75T-2FGG484I is a FPGA with 75520 logic cells, 5900 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
M2GL005-TQG144
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
M7A3P1000-FG256I
Actel
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M2S150TS-1FCV484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
M2S150TS-1FCV484M
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN LEAD;
M2S150-1FCS536I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.2;
M2S150-FCV484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Length: 19 mm;
M2S150T-1FC1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 574;
M2S150T-1FCG1152
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
M2S150TS-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
M2S150TS-1FC1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
M2S150TS-1FC1152M
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 125 Cel;
M2S150TS-1FC1152
M2S150TS-1FCG1152M
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;
M2S150TS-1FCG1152
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
M2S150TS-FC1152I
M2S150TS-FC1152
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn/Pb);
M2S150TS-FCG1152
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
M2S150TS-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Width: 35 mm;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 574;
Supply Digital Components
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