Loading...

M2S150T-1FCG1152

Microchip Technology

M2S150T-1FCG1152 by Microchip Technology

M2S150T-1FCG1152 by Microchip Technology is a CMOS FPGA with 146124 logic cells, 574 inputs/outputs, and 1152 terminals. It operates b/w 0-85°C, has a supply voltage of 1.14-1.26V, and uses Tin/Silver/Copper finishing. Ideal for applications requiring high-density programmable logic in compact spaces.

Median Price

$479.080

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 10 parts In-Stock

1+ parts

$479.080

100+ parts

$472.140

1k+ parts

$250.600

10k+ parts

-

10

$479.080

$472.140

$250.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 8 parts In-Stock

1+ parts

$434.370

100+ parts

$407.220

1k+ parts

-

10k+ parts

-

8

$434.370

$407.220

-

-

Digiode

USA . 472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

472

-

-

-

-

Vyrian

USA . 397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

397

-

-

-

-

Nova Conductors

Japan . 37 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,080 parts In-Stock

1+ parts

$15.000

100+ parts

$14.625

1k+ parts

$14.550

10k+ parts

-

1,080

$15.000

$14.625

$14.550

-

Ampacity Inc.

Singapore . 725 parts In-Stock

1+ parts

$34.000

100+ parts

-

1k+ parts

-

10k+ parts

-

725

$34.000

-

-

-

Corohmni

South Africa . 199 parts In-Stock

1+ parts

$82.873

100+ parts

-

1k+ parts

-

10k+ parts

-

199

$82.873

-

-

-

Component Stockers USA

USA . 19 parts In-Stock

1+ parts

$4,464.130

100+ parts

-

1k+ parts

-

10k+ parts

-

19

$4,464.130

-

-

-

Marpe Global Electronics

Taiwan . 5,998 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,998

-

-

-

-

QualityLine Systems

Poland . 5,998 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,998

-

-

-

-

XL Components Corporation

Australia . 5,998 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,998

-

-

-

-

Argo Parts USA

USA . 3,988 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,988

-

-

-

-

Continental Prestige Electronics

USA . 3,135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,135

-

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Corphita

USA . 378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

378

-

-

-

-

Akira Global LLC

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Overview

Unlock unparalleled performance and versatility with the M2S150T-1FCG1152 by Microchip Technology! As a leader in FPGA technology, Microchip ensures top-notch quality and reliability in every product. Ideal for a variety of applications, this FPGA offers customers the value of customization, high-speed processing, and low power consumption. Elevate your projects with the cutting-edge features and benefits that the M2S150T-1FCG1152 brings to the table. Experience innovation like never before with Microchip Technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the FPGA, making it suitable for a variety of environments.

No. of Logic Cells: 146124

With a high number of logic cells, this FPGA can handle complex algorithms and computations efficiently.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic systems.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26V ensures safe operation and prevents damage to the FPGA.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the performance of the FPGA.

No. of Inputs: 574

With a high number of inputs, this FPGA can process a large amount of data simultaneously.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy arrangement in circuit layouts.

Form Of Terminal: BALL

Ball terminal design simplifies the soldering process and improves connectivity in the circuit.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures stable and consistent power delivery to the FPGA.

Packing Method: TRAY

Tray packing method provides secure storage and transportation for the FPGA, minimizing the risk of damage.

Power Supplies (V): 1.2

The power supply voltage of 1.2V ensures compatibility with standard power sources for easy integration into existing systems.

No. of Terminals: 1152

The high number of terminals allows for versatile connections and flexibility in circuit configurations.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array allows for customization and reconfigurability of the FPGA for different applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and electrical conductivity, enhancing the performance of the FPGA.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for operation in a wide range of environments and applications.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for fine spacing and compact design, optimizing the use of available space.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in cold environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of Tin/Silver/Copper finishing on terminals provides good solderability and conductivity for stable connections.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom simplifies the PCB layout and ensures ease of connection in the circuit.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level of 4 indicates resistance to moisture and humidity, enhancing the reliability of the FPGA in various environments.

Maximum Seated Height: 2.9 mm

The maximum seated height of 2.9mm allows for compact and slim designs in electronic systems.

Width: 35 mm

The width of 35mm offers a balance between compactness and ease of handling during installation and maintenance of the FPGA.

No. of Outputs: 574

With a high number of outputs, this FPGA can drive multiple devices and sensors, making it suitable for complex applications.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time of 40 seconds at peak reflow temperature, this FPGA can undergo temperature cycling during manufacturing processes without compromising its performance.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, this FPGA can withstand high-temperature soldering processes for reliable connections.

Length: 35 mm

The length of 35mm offers a compact form factor for easy integration into electronic systems with limited space.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2S150T-1FCG1152 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

146124

No. of Inputs:

574

No. of Outputs:

574

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

40 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

2.9 mm

Packing Method:

Tray

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

M2S150T-1FCG1152 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20