Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M2S150T-1FCG1152 by Microchip Technology is a CMOS FPGA with 146124 logic cells, 574 inputs/outputs, and 1152 terminals. It operates b/w 0-85°C, has a supply voltage of 1.14-1.26V, and uses Tin/Silver/Copper finishing. Ideal for applications requiring high-density programmable logic in compact spaces.
Median Price
$479.080
Lifecycle Status
Suppliers In-Stock
5
In-Stock Inventory
< 1k
Microchip Technology
1+ parts
100+ parts
$472.140
1k+ parts
$250.600
10k+ parts
-
NAC Semi
$434.370
$407.220
Digiode
Vyrian
Nova Conductors
Semicontronic
$15.000
$14.625
$14.550
Ampacity Inc.
$34.000
Corohmni
$82.873
Component Stockers USA
$4,464.130
Marpe Global Electronics
QualityLine Systems
XL Components Corporation
Argo Parts USA
Continental Prestige Electronics
Netroflash
Corphita
Akira Global LLC
PLASTIC/EPOXY material provides durability and protection for the FPGA, making it suitable for a variety of environments.
With a high number of logic cells, this FPGA can handle complex algorithms and computations efficiently.
Surface mount capability allows for easy installation and integration into electronic systems.
The maximum supply voltage of 1.26V ensures safe operation and prevents damage to the FPGA.
CMOS technology offers low power consumption and high noise immunity, enhancing the performance of the FPGA.
With a high number of inputs, this FPGA can process a large amount of data simultaneously.
The square package shape allows for efficient use of space and easy arrangement in circuit layouts.
Ball terminal design simplifies the soldering process and improves connectivity in the circuit.
The nominal supply voltage of 1.2V ensures stable and consistent power delivery to the FPGA.
Tray packing method provides secure storage and transportation for the FPGA, minimizing the risk of damage.
The power supply voltage of 1.2V ensures compatibility with standard power sources for easy integration into existing systems.
The high number of terminals allows for versatile connections and flexibility in circuit configurations.
Being a field programmable gate array allows for customization and reconfigurability of the FPGA for different applications.
The grid array package style offers efficient heat dissipation and electrical conductivity, enhancing the performance of the FPGA.
The minimum supply voltage of 1.14V ensures reliable operation even under low power conditions.
The high maximum operating temperature of 85°C allows for operation in a wide range of environments and applications.
The 1mm pitch of terminals allows for fine spacing and compact design, optimizing the use of available space.
The minimum operating temperature of 0°C ensures reliable performance even in cold environments.
The use of Tin/Silver/Copper finishing on terminals provides good solderability and conductivity for stable connections.
Having terminals positioned at the bottom simplifies the PCB layout and ensures ease of connection in the circuit.
Moisture sensitivity level of 4 indicates resistance to moisture and humidity, enhancing the reliability of the FPGA in various environments.
The maximum seated height of 2.9mm allows for compact and slim designs in electronic systems.
The width of 35mm offers a balance between compactness and ease of handling during installation and maintenance of the FPGA.
With a high number of outputs, this FPGA can drive multiple devices and sensors, making it suitable for complex applications.
With a maximum time of 40 seconds at peak reflow temperature, this FPGA can undergo temperature cycling during manufacturing processes without compromising its performance.
With a peak reflow temperature of 250°C, this FPGA can withstand high-temperature soldering processes for reliable connections.
The length of 35mm offers a compact form factor for easy integration into electronic systems with limited space.
Field Programmable Gate Arrays (FPGA) M2S150T-1FCG1152 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology
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M2S150T-1FCG1152 Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
1N4148WS
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SN6505BDBVR
Texas Instruments
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
MMSZ5245BT1G
Onsemi
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
LM317LMX/NOPB
LM317LMX/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max input-output voltage differential of 40V. It operates in temperatures ranging from -40°C to 125°C and has a max output current of 0.1A, making it suitable for various applications requiring precise voltage regulation.
EU2B-YS303C
Idec
ROTARY SWITCH;
1N4148WT
Jiangsu Changjiang Electronics Technology
Sensitron Semiconductor
MBR0530T1G
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
BAV99
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Daco Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
M39029/58-360
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
LM358D-T
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
International Semiconductor
Hy Electronic
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M7A3P1000-FG256I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC6SLX16-3CSG324C
Xilinx
The Xilinx XC6SLX16-3CSG324C is a FPGA with 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for applications requiring high-speed processing in compact form factors like telecommunications equipment and industrial automation systems.
5CEFA5F23I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
ICE40HX8K-BG121TR
Lattice Semiconductor
ICE40HX8K-BG121TR by Lattice Semiconductor is a CMOS-based FPGA with 7680 logic cells and 960 CLBs. It operates at a nominal voltage of 1.2V and can withstand temperatures up to 100°C. This programmable IC is commonly used in industrial applications requiring high-performance digital logic circuits.
10M50SCE144C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
A3P1000-FGG484I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
10M08SAE144C8GES
FIELD PROGRAMMABLE GATE ARRAY;
10M25DAF256I7G
The 10M25DAF256I7G by Altera is a PLASTIC/EPOXY FPGA with 25000 logic cells, CMOS technology, and 178 inputs/outputs. It comes in a BGA package with 256 terminals and a pitch of 1mm. This FPGA operates at a nominal supply voltage of 1.2V and is suitable for various applications requiring programmable ICs.
LCMXO2-1200HC-4TG100C
LCMXO2-1200HC-4TG100C by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133MHz. Operating at 85°C, it has 79 inputs/outputs and uses PLASTIC/EPOXY package material. Ideal for applications requiring high-speed processing in compact designs.
10CL006YE144I7G
Intel
The Intel 10CL006YE144I7G is a Field Programmable Gate Array with 392 CLBs, operating at 1.2V nominal voltage and supporting a max supply voltage of 1.25V. Ideal for industrial applications requiring high performance in a compact form factor with a package style including flatpack, heat sink/slug, low profile, and fine pitch.
XC7K325T-2FF900I
Xilinx XC7K325T-2FF900I FPGA features 326080 logic cells, 25475 CLBs, and max clock freq of 1818 MHz. Ideal for industrial applications requiring high-speed processing with a wide range of power supplies (1V, 1.8V, 3.3V) and operating temperatures (-40°C to 100°C).
XC6SLX4-2TQG144C
Xilinx XC6SLX4-2TQG144C is a FPGA with 3840 logic cells, 300 CLBs, and max clock frequency of 667 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing like telecommunications and industrial automation.
M2GL025TS-1FGG484I
M2GL025TS-1FGG484I by Microchip Technology is a 27696 logic cell FPGA with 267 inputs/outputs. Operating at 1.2V, it has a temperature range of -40 to 100°C and comes in a square grid array package suitable for industrial applications.
M1A3P1000-PQG208M
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
M1A3P1000-FG256I
M1A3P1000-FG256I by Microchip Technology is a FPGA with 24576 CLBs and 1000000 gates, operating at max frequency of 350 MHz. It has a supply voltage range of 1.425V to 1.575V, suitable for industrial applications requiring high gate count and clock speed in a compact grid array package.
EP4CE15F17I7N
EP4CE15F17I7N by Intel is a FPGA with 15408 logic cells, 963 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
10M08SAE144C8G
Intel 10M08SAE144C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-performance processing in commercial extended temperature environments.
10CX150YF672E6G
Intel's 10CX150YF672E6G FPGA boasts 150,000 logic cells and 54,770 CLBs. Operating b/w 0-100°C with a supply voltage range of 0.87-0.93V, it offers 236 inputs/outputs for various applications requiring high-performance programmable ICs in a square grid array package.
XC7A50T-L2CSG325E
Xilinx XC7A50T-L2CSG325E FPGA features 52160 logic cells, 4075 CLBs, and operates at a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
LFE5UM-85F-8BG381I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M2S150TS-1FCV484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 240;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
M2S150TS-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
M2S150T-1FCG1152
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.26 V;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
M2S150-1FCS536I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.2;
M2S150-FCV484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Length: 19 mm;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
M2S150T-1FC1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
M2S150T-1FC1152M
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.2;
M2S150T-1FC1152
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
M2S150T-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1152;
M2S150T-1FCG1152M
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Length: 35 mm;
M2S150T-1FCVG484
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B484;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 574;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1152,34X34,40;
M2S150T-1FCSG536
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 293;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; JESD-609 Code: e1;
Supply Digital Components
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