Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M2S150-FCV484I by Microchip Technology is a CMOS FPGA with 146124 logic cells, 273 inputs/outputs, and operates at supply voltages b/w 1.14V to 1.26V. It is used in applications requiring high-density programmable logic solutions with a grid array package style and fine pitch terminals for compact designs.
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Plastic/epoxy material provides durability and protection for the FPGA, making it a reliable choice for electronic applications.
With a large number of logic cells, this FPGA is capable of handling complex and high-performance computing tasks efficiently.
Surface mount technology makes the FPGA easy to integrate onto circuit boards, saving space and simplifying assembly processes.
The maximum supply voltage of 1.26V ensures safe and reliable operation of the FPGA within specified limits.
CMOS technology offers low power consumption and high speed performance, making this FPGA suitable for a wide range of applications.
Having a high number of inputs allows for versatile connectivity and input options, enhancing the flexibility of the FPGA.
The square package shape provides a compact form factor, making it easy to integrate the FPGA into various electronic designs.
Ball terminals offer reliable and secure connections, ensuring robust performance of the FPGA in different operating conditions.
The nominal supply voltage of 1.2V is a common standard, making it compatible with many power sources and electronic systems.
Tray packing method facilitates easy handling and storage of the FPGA during transportation and assembly processes.
Having a single power supply voltage of 1.2V simplifies the power management and design aspects of the FPGA system.
A high number of terminals enable versatile connectivity options and signal routing capabilities, enhancing the usability of the FPGA.
Being a field programmable gate array allows for flexibility in reconfiguring the logic functions of the FPGA as needed, making it adaptable for various applications.
The grid array with fine pitch package style offers high connection density and precise alignment, improving the overall performance and reliability of the FPGA.
The minimum supply voltage of 1.14V ensures reliable operation even under low power conditions, enhancing the robustness of the FPGA system.
The high maximum operating temperature of 100°C enables the FPGA to function effectively in demanding environments and industrial applications.
Having a small terminal pitch of 0.8mm allows for high-density integration and efficient signal routing, optimizing the overall performance of the FPGA.
The low minimum operating temperature of -40°C ensures reliable functionality even in extreme cold conditions, making the FPGA suitable for a wide range of environments.
Using tin/lead finishing on the terminals provides good solderability and conductivity, ensuring reliable connections and long-term performance of the FPGA.
Having terminals positioned at the bottom facilitates easy installation and soldering of the FPGA onto circuit boards, simplifying the assembly process.
The maximum seated height of 3.15mm allows for a low-profile design, making the FPGA suitable for compact electronic devices and applications.
With a width of 19mm, the FPGA offers a balance between compactness and connectivity options, making it suitable for a wide range of electronic designs.
A high number of outputs allow for versatile signal routing and output options, enhancing the flexibility and functionality of the FPGA.
Having a maximum time of 30 seconds at peak reflow temperature allows for reliable soldering and rework processes during assembly, ensuring robust connections.
A peak reflow temperature of 240°C ensures proper soldering and component mounting, meeting industry standards for assembly and manufacturing processes.
With a length of 19mm, the FPGA offers a compact form factor, making it suitable for space-constrained electronic applications.
Field Programmable Gate Arrays (FPGA) M2S150-FCV484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology
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M2S150-FCV484I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Datasheet 11/Jan/2023 Datasheet Rev 16/Jun/2022
PCN Assembly/Origin - Manufacturing Change 23/Feb/2021
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
1N4148
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 200 Cel; No. of Elements: 1;
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
2N7002
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
Shandong Yiguang Electronic Joint Stock
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Config: SINGLE;
BAV99
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
Vishay Intertechnology's 1N4148WS is a single rectifier diode with a max forward voltage of 1V and output current of 0.15A. With a fast reverse recovery time of 0.004us, it operates up to 150°C. Ideal for applications requiring high-speed switching and low power consumption in surface mount configurations.
USB2514BI-AEZG
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Sangdest Microelectronics (Nanjing)
LL4148
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
SMBJ18CA
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
06035C103KAT2A
KYOCERA AVX
06035C103KAT2A by KYOCERA AVX is a SMT ceramic capacitor with 0.01uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and 10% tolerance. Ideal for applications requiring compact surface mount capacitors with stable performance in a wide temperature range.
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
XC7A35T-2FTG256I
Xilinx
Xilinx XC7A35T-2FTG256I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption. Package style: Grid Array, Low Profile, Fine Pitch.
LFXP2-8E-5TN144C
Lattice Semiconductor
LFXP2-8E-5TN144C by Lattice Semiconductor is a 1.2V FPGA with 8000 logic cells, 1000 CLBs, and 100 inputs/outputs. It operates at up to 435MHz clock frequency and can withstand temperatures from 0 to 85°C. Ideal for applications requiring high-speed processing in compact designs.
LFE5U-25F-8BG381I
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
XC7A15T-2CPG236C
Xilinx XC7A15T-2CPG236C FPGA features 16640 logic cells, 1300 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data center infrastructure.
XCAU10P-1UBVA368I
FIELD PROGRAMMABLE GATE ARRAY;
EP4CE15E22C8N
Altera
The EP4CE15E22C8N by Altera is a field programmable gate array (FPGA) with 15408 logic cells and 963 configurable logic blocks (CLBs). It operates at a maximum supply voltage of 1.25V and has 81 inputs and outputs. This FPGA is surface mountable and has a package shape of square, with a gull wing form of terminal. It is suitable for applications that require high-speed processing and programmability.
5CEFA7F23I7N
The Altera 5CEFA7F23I7N is a field programmable gate array (FPGA) with 149500 logic cells. It has a maximum supply voltage of 1.13V and uses CMOS technology. The package style is a grid array with 484 terminals, and it has 240 inputs and outputs. This FPGA is suitable for applications requiring high-level customization and versatility.
LCMXO640C-3TN100C
LCMXO640C-3TN100C by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 74 Inputs/Outputs. Operating at 1.8V, it's ideal for applications requiring low power consumption and high performance in a compact form factor like IoT devices or industrial control systems.
5CEBA2F23C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
ICE40HX1K-VQ100
ICE40HX1K-VQ100 by Lattice Semiconductor is a 1280 logic cell FPGA with 160 CLBs, operating at max 133 MHz. Ideal for industrial applications, it features a max supply voltage of 1.26 V and combinatorial delay of 7.3 ns, making it suitable for high-performance systems requiring fast processing speeds.
EP3C25F324I7N
EP3C25F324I7N by Altera is a 1.2V CMOS FPGA with 24,624 logic cells, 215 inputs/outputs, and a maximum clock frequency of 472.5MHz. It is a versatile programmable IC suitable for industrial applications.
EP2C8Q208I8N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Minimum Supply Voltage: 1.15 V;
10M08SAU169C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
M7A3P1000-PQG208I
M7A3P1000-PQG208I by Microchip Technology is a CMOS FPGA with 24576 logic cells and 1000000 equivalent gates. It operates at a max clock frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a package style of FLATPACK and fine pitch, it offers versatility in design while maintaining a compact form factor.
XC6SLX16-2CSG225I
Xilinx XC6SLX16-2CSG225I FPGA features 14579 logic cells, 1139 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
10AX016C3U19E2LG
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;
XC7S15-1FTGB196I
Xilinx XC7S15-1FTGB196I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. The package style is grid array, low profile, fine pitch with matte tin finishing.
XC3S50AN-4TQG144C
XC3S50AN-4TQG144C by Xilinx is a CMOS-based FPGA with 1584 logic cells and 176 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.
XC6SLX9-2CSG225C
Xilinx XC6SLX9-2CSG225C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.
LFE5U-25F-8MG285I
Lattice Semiconductor's LFE5U-25F-8MG285I FPGA features 3000 CLBs, operates at -40 to 100 °C, with a supply voltage range of 1.045V to 1.155V. Ideal for industrial applications requiring high-performance and low-profile grid array packaging with fine pitch terminals.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M2S150TS-1FCV484I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 240;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
M2S150TS-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
M2S150T-1FCG1152
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.26 V;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
M2S150-1FCS536I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.2;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
M2S150-FCV484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
M2S150-FC1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 574;
M2S150-FCS536I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
M2S150-FCV484
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; JESD-609 Code: e0;
M2S150-FCVG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;
M2S150-FCVG484
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA484,22X22,32;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1152;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA536,30X30,20;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Power Supplies (V): 1.2;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 3.15 mm;
M2S150TS-FCVG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Packing Method: TRAY;
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