Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M2S150-FCV484I by Microchip Technology is a CMOS FPGA with 146124 logic cells, 273 inputs/outputs, and operates at supply voltages b/w 1.14V to 1.26V. It is used in applications requiring high-density programmable logic solutions with a grid array package style and fine pitch terminals for compact designs.
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Plastic/epoxy material provides durability and protection for the FPGA, making it a reliable choice for electronic applications.
With a large number of logic cells, this FPGA is capable of handling complex and high-performance computing tasks efficiently.
Surface mount technology makes the FPGA easy to integrate onto circuit boards, saving space and simplifying assembly processes.
The maximum supply voltage of 1.26V ensures safe and reliable operation of the FPGA within specified limits.
CMOS technology offers low power consumption and high speed performance, making this FPGA suitable for a wide range of applications.
Having a high number of inputs allows for versatile connectivity and input options, enhancing the flexibility of the FPGA.
The square package shape provides a compact form factor, making it easy to integrate the FPGA into various electronic designs.
Ball terminals offer reliable and secure connections, ensuring robust performance of the FPGA in different operating conditions.
The nominal supply voltage of 1.2V is a common standard, making it compatible with many power sources and electronic systems.
Tray packing method facilitates easy handling and storage of the FPGA during transportation and assembly processes.
Having a single power supply voltage of 1.2V simplifies the power management and design aspects of the FPGA system.
A high number of terminals enable versatile connectivity options and signal routing capabilities, enhancing the usability of the FPGA.
Being a field programmable gate array allows for flexibility in reconfiguring the logic functions of the FPGA as needed, making it adaptable for various applications.
The grid array with fine pitch package style offers high connection density and precise alignment, improving the overall performance and reliability of the FPGA.
The minimum supply voltage of 1.14V ensures reliable operation even under low power conditions, enhancing the robustness of the FPGA system.
The high maximum operating temperature of 100°C enables the FPGA to function effectively in demanding environments and industrial applications.
Having a small terminal pitch of 0.8mm allows for high-density integration and efficient signal routing, optimizing the overall performance of the FPGA.
The low minimum operating temperature of -40°C ensures reliable functionality even in extreme cold conditions, making the FPGA suitable for a wide range of environments.
Using tin/lead finishing on the terminals provides good solderability and conductivity, ensuring reliable connections and long-term performance of the FPGA.
Having terminals positioned at the bottom facilitates easy installation and soldering of the FPGA onto circuit boards, simplifying the assembly process.
The maximum seated height of 3.15mm allows for a low-profile design, making the FPGA suitable for compact electronic devices and applications.
With a width of 19mm, the FPGA offers a balance between compactness and connectivity options, making it suitable for a wide range of electronic designs.
A high number of outputs allow for versatile signal routing and output options, enhancing the flexibility and functionality of the FPGA.
Having a maximum time of 30 seconds at peak reflow temperature allows for reliable soldering and rework processes during assembly, ensuring robust connections.
A peak reflow temperature of 240°C ensures proper soldering and component mounting, meeting industry standards for assembly and manufacturing processes.
With a length of 19mm, the FPGA offers a compact form factor, making it suitable for space-constrained electronic applications.
Field Programmable Gate Arrays (FPGA) M2S150-FCV484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology
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M2S150-FCV484I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Datasheet 11/Jan/2023 Datasheet Rev 16/Jun/2022
PCN Assembly/Origin - Manufacturing Change 23/Feb/2021
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SS14
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
BAV99-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ST3485EBDR
STMicroelectronics
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
Cheng-yi Electronic
FDN306P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358N
LL4148GS08
Temic Semiconductors
LL4148GS08 by Temic Semiconductors is a glass diode with a max reverse recovery time of 0.008 us and max forward voltage of 1 V. It is a rectifier diode with a max output current of 0.15 A, ideal for applications requiring fast switching speeds and low power dissipation in electronic circuits.
BAV99
Comchip Technology
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
2N7002
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
LL4148-GS08
Telefunken Microelectronics
RECTIFIER DIODE; Surface Mount: YES; JESD-609 Code: e0; No. of Elements: 1; Maximum Operating Temperature: 175 Cel; Maximum Non Repetitive Peak Forward Current: 2 A;
10M50SAE144I7G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;
XCAU25P-2FFVB676I
Xilinx
Xilinx XCAU25P-2FFVB676I FPGA features 308437 logic cells, 17625 CLBs, and 280 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V.
M2GL090-FGG484I
M2GL090-FGG484I by Microchip Technology is a CMOS FPGA with 86316 logic cells, 267 inputs/outputs, and operates at 1.2V. It comes in a square grid array package suitable for industrial applications requiring high-performance programmable ICs.
M1AGL250V5-FGG144I
M1AGL250V5-FGG144I by Microchip Technology is a CMOS FPGA with 6144 logic cells and 97 inputs/outputs. Operating b/w -40 to 100°C, it has a max supply voltage of 1.575 V and offers 250000 equivalent gates. Ideal for industrial applications requiring high gate count and low profile grid array packaging.
EP4CE6F17I8LN
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Surface Mount: YES;
EP3C25E144I7N
Intel
EP3C25E144I7N by Intel is a CMOS FPGA with 24624 logic cells and CLBs. It operates at a max clock frequency of 472.5 MHz, making it ideal for industrial applications requiring high-speed processing in compact designs. With a package style including flatpack and low profile options, this FPGA offers versatility for various electronic systems.
EP4CGX30CF23C7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
EP1S25F672C7N
EP1S25F672C7N by Intel is a FPGA with 25660 logic cells, 2852 CLBs, and 706 inputs/outputs. It operates at voltages ranging from 1.425V to 1.575V and temperatures b/w 0°C to 85°C. Ideal for commercial applications requiring high-performance programmable ICs in a compact grid array package.
EP1C3T144C8N
EP1C3T144C8N by Intel is a Field Programmable Gate Array (FPGA) with 2910 logic cells, 291 CLBs, and a max clock frequency of 275 MHz. It is ideal for applications requiring high-speed processing and customizable logic circuits in compact electronic designs.
M2GL005-TQG144I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
M1A3P250-VQG100I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC7A35T-1CSG324I
The Xilinx XC7A35T-1CSG324I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and low power consumption. With a package style of grid array and low profile, it offers versatile integration options for various electronic systems.
EP4CE15F23C8N
EP4CE15F23C8N by Intel is a FPGA with 15408 logic cells, 963 CLBs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable IC functionality. With a package style of GRID ARRAY and surface mount capability, it offers versatility in design implementations.
LFE5U-25F-8BG381I
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MPF100T-1FCG484I
Microchip Technology's MPF100T-1FCG484I is a CMOS FPGA with 244 inputs/outputs, operating b/w -40 to 100°C. Its grid array package has 484 terminals on a 23x23mm square body, suitable for applications requiring programmable gate arrays in surface-mount technology.
EP3C25F324C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: RECTANGULAR;
XC7S25-1CSGA225C
The Xilinx XC7S25-1CSGA225C is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. The package style is grid array, low profile, fine pitch with PLASTIC/EPOXY material.
EP3C25F324C8NES
EP3C25F324C8NES by Intel is a FPGA with 24624 CLBs, operating at max frequency of 472.5 MHz. It has a package style of GRID ARRAY and can handle temperatures from 0 to 85 °C. Ideal for applications requiring high-speed processing and programmable logic in compact form factor.
XC6SLX16-3CSG324I
The Xilinx XC6SLX16-3CSG324I is a FPGA with 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. It operates at a max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factors due to its low profile grid array package style.
XC7S50-1FGGA484C
The Xilinx XC7S50-1FGGA484C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
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M2S150TS-1FCV484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 240;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
M2S150TS-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
M2S150T-1FCG1152
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.26 V;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
M2S150-1FCS536I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.2;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
M2S150-FCV484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
M2S150-FC1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 574;
M2S150-FCS536I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
M2S150-FCV484
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; JESD-609 Code: e0;
M2S150-FCVG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;
M2S150-FCVG484
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA484,22X22,32;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1152;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA536,30X30,20;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Power Supplies (V): 1.2;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 3.15 mm;
M2S150TS-FCVG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Packing Method: TRAY;
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