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LE58QL063HVCT

Microchip Technology

LE58QL063HVCT by Microchip Technology

PCM CODEC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Montano Global Distributors

Canada . 5,825 parts In-Stock

1+ parts

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5,825

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NIA Electronics

USA . 5,810 parts In-Stock

1+ parts

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5,810

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Ledger Components

France . 5,810 parts In-Stock

1+ parts

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5,810

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LMD Electronica

Estonia . 4,580 parts In-Stock

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4,580

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LOOK Integrated Logistics

Peru . 1,780 parts In-Stock

1+ parts

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1,780

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ChipstoGo Electronic ltd

UK . 903 parts In-Stock

1+ parts

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903

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Microchip USA

USA . 494 parts In-Stock

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494

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Technical Specifications

Audio Codecs LE58QL063HVCT attributes and parameters. Explore more Audio Codecs devices from Microchip Technology

Specs

Maximum Analog Input:

3.465 V

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

14 mm

Linear Coding:

16-BIT

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.56SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LE58QL063HVCT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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