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DSPIC33FJ64GS406-I/MR

Microchip Technology

DSPIC33FJ64GS406-I/MR by Microchip Technology

DSPIC33FJ64GS406-I/MR by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 85°C. Ideal for industrial applications, it features flash ROM programmability, operates at 3.3V supply voltage, and has a compact square package style.

Median Price

$6.420

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 840 parts In-Stock

1+ parts

$6.420

100+ parts

$5.300

1k+ parts

$4.870

10k+ parts

$4.640

840

$6.420

$5.300

$4.870

$4.640

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$5.712

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$5.712

-

-

-

NAC Semi

USA . 680 parts In-Stock

1+ parts

$6.650

100+ parts

$6.030

1k+ parts

$5.510

10k+ parts

-

680

$6.650

$6.030

$5.510

-

Vyrian

USA . 5,274 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,274

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$5.598

100+ parts

-

1k+ parts

$5.374

10k+ parts

-

500

$5.598

-

$5.374

-

Continental Prestige Electronics

USA . 38 parts In-Stock

1+ parts

$5.712

100+ parts

-

1k+ parts

-

10k+ parts

$5.598

38

$5.712

-

-

$5.598

AZTECH Wire

Italy . 791 parts In-Stock

1+ parts

$6.414

100+ parts

-

1k+ parts

-

10k+ parts

-

791

$6.414

-

-

-

Ampacity Inc.

Singapore . 386 parts In-Stock

1+ parts

$11.320

100+ parts

-

1k+ parts

-

10k+ parts

-

386

$11.320

-

-

-

Aztec Data Supply Inc.

USA . 24 parts In-Stock

1+ parts

$64.234

100+ parts

-

1k+ parts

-

10k+ parts

-

24

$64.234

-

-

-

Argo Parts USA

USA . 4,332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,332

-

-

-

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Lixinc

USA . 3,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,805

-

-

-

-

Marpe Global Electronics

Taiwan . 2,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,128

-

-

-

-

QualityLine Systems

Poland . 2,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,128

-

-

-

-

XL Components Corporation

Australia . 2,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,128

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the DSPIC33FJ64GS406-I/MR by Microchip Technology. As a top-tier manufacturer in the digital signal processors (DSPs) category, Microchip delivers unparalleled quality and reliability. This innovative product offers customers a world of possibilities in various applications, all while providing exceptional value, benefits, and advantages. Dive into a realm of endless opportunities and elevate your projects to new heights with the DSPIC33FJ64GS406-I/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the DSP lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy assembly and integration into various devices, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a range of input voltages.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easier to design and layout circuits efficiently.

Bit Size: 16

With a 16-bit architecture, the DSP can handle complex processing tasks and calculations with precision, suitable for demanding applications.

Power Supplies (V): 3.3

The standard power supply voltage of 3.3V ensures compatibility with common power sources, making it easier to integrate into existing systems.

No. of Terminals: 64

Having 64 terminals allows for a wide range of connectivity options, enabling efficient data transfer and communication with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides excellent thermal management and space-saving benefits for compact designs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures energy efficiency and extends battery life in portable devices, making it an economical choice.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the DSP can withstand demanding environmental conditions, ensuring reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C to 85°C enables the DSP to function in extreme cold and hot conditions, suitable for a variety of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a reliable and corrosion-resistant connection, ensuring long-term durability and signal integrity.

Terminal Position: QUAD

The quad terminal position offers multiple connection points for efficient routing and reduced signal interference, optimizing circuit performance.

Maximum Seated Height: 1 mm

The low maximum seated height allows for slim and compact device designs, saving space and enabling sleek product aesthetics.

Width: 9 mm

The 9mm width provides a balance between compact size and ease of handling during assembly, making it suitable for various form factors.

Maximum Clock Frequency: 40 MHz

With a maximum clock frequency of 40MHz, the DSP can process data at high speeds, ensuring quick response times and efficient operation.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature ensures proper soldering and component reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable solder joints and secure connections, preventing assembly defects and ensuring operational stability.

Length: 9 mm

The 9mm length complements the width and height dimensions, providing a well-balanced and compact form factor for versatile integration.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the DSP can operate reliably in harsh industrial environments, making it suitable for industrial control and automation systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combining digital signal processing capabilities with controller functions, the DSP offers versatile functionality for a wide range of applications, from audio processing to motor control.

Technology: CMOS

The CMOS technology used in the DSP ensures low power consumption and high integration density, making it energy-efficient and cost-effective for various uses.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and reduces potential soldering defects, ensuring reliable connections and consistent performance.

Maximum Supply Current: 170 mA

With a maximum supply current of 170mA, the DSP consumes minimal power, reducing energy costs and extending battery life in portable devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides a stable power source for the DSP, ensuring consistent performance and reliable operation in various conditions.

ROM Programmability: FLASH

The FLASH ROM programmability enables firmware updates and configuration changes without requiring external memory, allowing for versatile and adaptable functionality.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides precise and compact connections, enabling high-density packaging and efficient signal routing for optimized circuit design.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the DSP can withstand moderate exposure to moisture during assembly and operation, ensuring long-term reliability in various environments.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ64GS406-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Microcontrollers

Maximum Supply Current:

170 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33FJ64GS406-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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