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DSPIC33FJ16GS402-E/SO

Microchip Technology

DSPIC33FJ16GS402-E/SO by Microchip Technology

DSPIC33FJ16GS402-E/SO by Microchip is a 16-bit DSP with 3.6V max supply voltage, 40MHz clock frequency, and 2048 RAM words. Ideal for automotive applications, it features AEC-Q100 screening, flash ROM programmability, and low power mode for efficient performance in digital signal processing tasks.

Median Price

$4.591

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$4.591

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-

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52

$4.591

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Vyrian

USA . 6,242 parts In-Stock

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6,242

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 947 parts In-Stock

1+ parts

$4.170

100+ parts

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947

$4.170

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$4.499

100+ parts

-

1k+ parts

$4.319

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1,000

$4.499

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$4.319

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Continental Prestige Electronics

USA . 238 parts In-Stock

1+ parts

$4.591

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$4.499

238

$4.591

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$4.499

AZTECH Wire

Italy . 647 parts In-Stock

1+ parts

$12.840

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647

$12.840

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Corohmni

South Africa . 922 parts In-Stock

1+ parts

$53.021

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922

$53.021

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Lixinc

USA . 13,190 parts In-Stock

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13,190

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West Coast Incorporated

USA . 3,920 parts In-Stock

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3,920

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Argo Parts USA

USA . 485 parts In-Stock

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485

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Overview

Elevate your projects with the Microchip Technology DSPIC33FJ16GS402-E/SO, a top-of-the-line Digital Signal Processor for all your processing needs. Manufactured with precision and expertise, this DSP offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial automation, unlock endless possibilities with its advanced features, low power consumption, and high-speed operation. Experience superior quality and value with Microchip's cutting-edge technology at your fingertips. Choose excellence, choose the DSPIC33FJ16GS402-E/SO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

The surface mount feature allows for easy integration onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage of 3.6V, this product can handle a wide range of input power levels, making it versatile for different power requirements.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient data processing and storage, enhancing the performance of the DSP.

Screening Level: AEC-Q100; TS 16949

Meeting AEC-Q100 and TS 16949 screening standards ensures the product's reliability and durability, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact form factor, making it easy to integrate into electronic devices with limited space.

Bit Size: 16

A 16-bit processing capability enables high-speed data processing and complex calculations, making this product suitable for demanding signal processing tasks.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources, making it easy to power up and operate.

No. of Terminals: 28

With 28 terminals, this product offers plenty of I/O options, allowing for versatile connectivity and functionality in various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices and systems.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ16GS402-E/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

3

No. of I/O Lines:

21

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

2048

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

160 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

DSPIC33FJ16GS402-E/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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