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DSPIC33FJ16GP102-I/SO

Microchip Technology

DSPIC33FJ16GP102-I/SO by Microchip Technology

DSPIC33FJ16GP102-I/SO by Microchip is a 16-bit DSP with max clock freq of 32MHz, operating temp range -40 to 85°C, and supply voltage of 3.3V. Ideal for industrial applications requiring a digital signal processor/controller with flash ROM programmability and CMOS technology.

Median Price

$3.180

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 77 parts In-Stock

1+ parts

$3.180

100+ parts

$2.930

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77

$3.180

$2.930

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Distributors (In-Stock)

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Bristol Electronics

USA . 189 parts In-Stock

1+ parts

$5.040

100+ parts

$2.352

1k+ parts

$2.184

10k+ parts

-

189

$5.040

$2.352

$2.184

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Vyrian

USA . 4,017 parts In-Stock

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4,017

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 240 parts In-Stock

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$2.700

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240

$2.700

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AZTECH Wire

Italy . 739 parts In-Stock

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$19.678

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739

$19.678

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Aztec Data Supply Inc.

USA . 3,708 parts In-Stock

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$40.928

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3,708

$40.928

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Corohmni

South Africa . 1,048 parts In-Stock

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$68.621

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1,048

$68.621

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Lixinc

USA . 3,439 parts In-Stock

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3,439

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Argo Parts USA

USA . 3,256 parts In-Stock

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Fulton Briggs Corp.

USA . 3,140 parts In-Stock

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3,140

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 580 parts In-Stock

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580

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Continental Prestige Electronics

USA . 518 parts In-Stock

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518

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Bastille Electronics

Australia . 56 parts In-Stock

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56

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Overview

Get ready to revolutionize your digital signal processing projects with the DSPIC33FJ16GP102-I/SO by Microchip Technology. Crafted with precision and expertise, this powerful digital signal processor offers unmatched performance and reliability in a compact package. Whether you're working on industrial automation, motor control, or audio processing applications, this DSP will take your projects to the next level. With a maximum clock frequency of 32 MHz and a flash ROM for programmability, the possibilities are endless. Trust Microchip Technology to deliver quality and innovation in every product they create. Upgrade your projects today with the DSPIC33FJ16GP102-I/SO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a cost-effective and durable packaging solution for the DSP, making it suitable for a wide range of applications.

Surface Mount: YES

Enables easy and efficient PCB assembly, reducing manufacturing time and costs.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltage options, providing flexibility in power supply design.

Bit Size: 16

Offers precision and accuracy in signal processing, making it suitable for complex digital processing tasks.

Maximum Clock Frequency: 32 MHz

Provides high-speed processing capability, making it ideal for applications requiring real-time data processing.

Technology: CMOS

Utilizes low power consumption and high noise immunity, enhancing the overall performance of the DSP.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in high-temperature environments, making it suitable for industrial applications.

ROM Programmability: FLASH

Allows for flexible and easy reprogramming of the DSP, facilitating customization and updates in the field.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ16GP102-I/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

16

Format:

FIXED POINT

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

21 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

DSPIC33FJ16GP102-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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