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DSPIC33EV32GM006-E/MR

Microchip Technology

DSPIC33EV32GM006-E/MR by Microchip Technology

DSPIC33EV32GM006-E/MR by Microchip Technology is a 16-bit DSP with 40 MHz clock frequency, 4096 RAM words, and 7 timers. Ideal for automotive applications, it operates b/w -40 to 125 °C with low power mode and FLASH ROM programmability.

Median Price

$4.760

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 180 parts In-Stock

1+ parts

$4.760

100+ parts

$4.150

1k+ parts

$3.940

10k+ parts

-

180

$4.760

$4.150

$3.940

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,038

-

-

-

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

450

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 3,162 parts In-Stock

1+ parts

$3.996

100+ parts

-

1k+ parts

-

10k+ parts

-

3,162

$3.996

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-

-

Ampacity Inc.

Singapore . 180 parts In-Stock

1+ parts

$4.050

100+ parts

-

1k+ parts

-

10k+ parts

-

180

$4.050

-

-

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RGB Technical Solutions

Ukraine . 4,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,911

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-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

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50

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Overview

Discover the power and precision of the Microchip Technology DSPIC33EV32GM006-E/MR Digital Signal Processor. Known for their superior quality and innovative technology, Microchip delivers a cutting-edge solution for a variety of applications in the automotive industry. With its advanced features and high-performance capabilities, this DSP offers unmatched value and benefits to customers seeking reliable and efficient processing solutions. Experience the difference with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and helps protect the internal components of the DSP.

Surface Mount: YES

Surface mount capability allows for easy placement and soldering on PCBs, making it suitable for automated assembly processes.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in different application scenarios.

On Chip Data RAM Width: 8

Wide data RAM width allows for efficient data processing and storage within the DSP.

Package Shape: SQUARE

Square package shape helps in compact integration on PCBs, optimizing space utilization in electronic devices.

Bit Size: 16

16-bit processing capability enables handling of complex digital signals with high precision and accuracy.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy efficient and stable.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption during idle or low processing load situations, enhancing energy efficiency.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of digital signal processing and controller features provides versatility in applications requiring signal processing and control functions.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV32GM006-E/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

4096

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

DSPIC33EV32GM006-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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