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DSPIC33EP256MU810T-I/PT

Microchip Technology

DSPIC33EP256MU810T-I/PT by Microchip Technology

DSPIC33EP256MU810T-I/PT by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 60 MHz. It features 28672 RAM words, 3.3V power supplies, and 9 timers. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$10.880

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$10.880

100+ parts

-

1k+ parts

-

10k+ parts

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500

$10.880

-

-

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Vyrian

USA . 8,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

8,820

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-

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Chip Stock

USA . 4,949 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,949

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 420 parts In-Stock

1+ parts

$5.039

100+ parts

-

1k+ parts

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10k+ parts

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420

$5.039

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Continental Prestige Electronics

USA . 357 parts In-Stock

1+ parts

$10.880

100+ parts

-

1k+ parts

-

10k+ parts

$10.662

357

$10.880

-

-

$10.662

Ampacity Inc.

Singapore . 1,026 parts In-Stock

1+ parts

$24.000

100+ parts

-

1k+ parts

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1,026

$24.000

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Aztec Data Supply Inc.

USA . 4,268 parts In-Stock

1+ parts

$51.280

100+ parts

-

1k+ parts

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10k+ parts

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4,268

$51.280

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Corohmni

South Africa . 270 parts In-Stock

1+ parts

$78.249

100+ parts

-

1k+ parts

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270

$78.249

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Lixinc

USA . 14,948 parts In-Stock

1+ parts

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100+ parts

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14,948

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Argo Parts USA

USA . 3,434 parts In-Stock

1+ parts

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100+ parts

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3,434

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Fulton Briggs Corp.

USA . 2,552 parts In-Stock

1+ parts

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100+ parts

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2,552

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$10.662

1k+ parts

$10.336

10k+ parts

$10.118

2,000

-

$10.662

$10.336

$10.118

Overview

Experience the power of innovation with the DSPIC33EP256MU810T-I/PT by Microchip Technology. As a leader in digital signal processors, Microchip Technology sets the standard for quality and reliability. Ideal for a wide range of applications, this product offers unmatched performance and efficiency. With its cutting-edge technology and advanced features, customers can expect superior value and benefits. Elevate your projects to the next level with the DSPIC33EP256MU810T-I/PT from Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and compact placement on PCBs, saving space and improving reliability.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options.

Bit Size: 16

A 16-bit architecture provides improved processing power and accuracy compared to lower bit sizes.

RAM Words: 28672

A large RAM capacity enables the processing of complex algorithms and data sets efficiently.

Maximum Clock Frequency: 60 MHz

A high clock frequency allows for fast processing speeds and real-time signal handling.

ROM Programmability: FLASH

Flash ROM allows for easy and quick reprogramming of the device without the need for external tools, enhancing flexibility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU810T-I/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.55SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Trade Compliance

DSPIC33EP256MU810T-I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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