Loading...

DSPIC33EP256MU810T-E/PF

Microchip Technology

DSPIC33EP256MU810T-E/PF by Microchip Technology

DSPIC33EP256MU810T-E/PF by Microchip is a 16-bit DSP with 28672 RAM words, operating at up to 60 MHz. Ideal for automotive applications, it features 9 timers, 15 DMA channels, and low power mode support. With a package style of flatpack and thin profile, this CMOS technology-based controller offers high performance in a compact form factor.

Median Price

$9.120

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 90 parts In-Stock

1+ parts

$9.120

100+ parts

-

1k+ parts

-

10k+ parts

-

90

$9.120

-

-

-

Vyrian

USA . 4,767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,767

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,956 parts In-Stock

1+ parts

$9.120

100+ parts

-

1k+ parts

-

10k+ parts

$8.938

6,956

$9.120

-

-

$8.938

Ampacity Inc.

Singapore . 38,877 parts In-Stock

1+ parts

$10.140

100+ parts

-

1k+ parts

-

10k+ parts

-

38,877

$10.140

-

-

-

AZTECH Wire

Italy . 122 parts In-Stock

1+ parts

$13.450

100+ parts

-

1k+ parts

-

10k+ parts

-

122

$13.450

-

-

-

Lixinc

USA . 16,194 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,194

-

-

-

-

Montano Global Distributors

Canada . 7,949 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,949

-

-

-

-

LOOK Integrated Logistics

Peru . 6,947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,947

-

-

-

-

NIA Electronics

USA . 6,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,856

-

-

-

-

Ledger Components

France . 6,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,856

-

-

-

-

LMD Electronica

Estonia . 6,052 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,052

-

-

-

-

Argo Parts USA

USA . 3,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,637

-

-

-

-

iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

900

-

-

-

-

Microchip USA

USA . 364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

364

-

-

-

-

Overview

Elevate your digital signal processing capabilities with the DSPIC33EP256MU810T-E/PF by Microchip Technology. As a leader in the industry, Microchip Technology delivers unmatched quality and reliability. Ideal for a wide range of applications, this Digital Signal Processor offers exceptional value and benefits to customers looking to enhance their products with advanced technology. Experience the advantages of high performance, low power consumption, and versatile functionality with the DSPIC33EP256MU810T-E/PF. Step into the future of digital signal processing with this innovative solution at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection for the internal components of the DSP, making it durable and reliable.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, offering flexibility in power supply options.

RAM Words: 28672

Large RAM capacity enables the DSP to handle complex processing tasks efficiently and effectively.

Maximum Clock Frequency: 60 MHz

High clock frequency ensures fast processing speeds, making the DSP suitable for real-time applications.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the DSP firmware, enhancing flexibility and adaptability.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU810T-E/PF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Trade Compliance

DSPIC33EP256MU810T-E/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20