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DSPIC33EP256GP504-E/ML

Microchip Technology

DSPIC33EP256GP504-E/ML by Microchip Technology

DSPIC33EP256GP504-E/ML by Microchip is a 16-bit DSP with 3.3V supply, 60MHz clock frequency, and 32768 RAM words. Ideal for automotive applications, it features flash ROM programmability, low power mode, and boundary scan support for robust digital signal processing tasks in compact form factor.

Median Price

$5.415

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,535 parts In-Stock

1+ parts

$5.580

100+ parts

$4.630

1k+ parts

$4.260

10k+ parts

$4.050

1,535

$5.580

$4.630

$4.260

$4.050

Master Electronics

USA . 84 parts In-Stock

1+ parts

-

100+ parts

$5.250

1k+ parts

$5.030

10k+ parts

-

84

-

$5.250

$5.030

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Verical

USA . 80 parts In-Stock

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80

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NAC Semi

USA . 1,215 parts In-Stock

1+ parts

$5.810

100+ parts

$5.270

1k+ parts

$4.820

10k+ parts

-

1,215

$5.810

$5.270

$4.820

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Vyrian

USA . 3,475 parts In-Stock

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3,475

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Nova Conductors

Japan . 550 parts In-Stock

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550

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IBS Electronics

USA . 84 parts In-Stock

1+ parts

-

100+ parts

$7.363

1k+ parts

$7.055

10k+ parts

-

84

-

$7.363

$7.055

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 902 parts In-Stock

1+ parts

$10.890

100+ parts

-

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902

$10.890

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Corohmni

South Africa . 239 parts In-Stock

1+ parts

$59.400

100+ parts

-

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239

$59.400

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QUARKTWIN TECHNOLOGY LTD

USA . 20,064 parts In-Stock

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20,064

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XL Components Corporation

Australia . 6,860 parts In-Stock

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Argo Parts USA

USA . 5,761 parts In-Stock

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5,761

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Continental Prestige Electronics

USA . 2,417 parts In-Stock

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2,417

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QualityLine Systems

Poland . 609 parts In-Stock

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609

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Netroflash

USA . 500 parts In-Stock

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500

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Marpe Global Electronics

Taiwan . 251 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the DSPIC33EP256GP504-E/ML by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality Digital Signal Processors (DSPs) designed to meet the demands of today's applications. With a focus on innovation and reliability, this product offers customers unmatched value, benefits, and advantages. Experience seamless performance, enhanced functionality, and superior efficiency with the DSPIC33EP256GP504-E/ML. Elevate your projects to new heights with this exceptional product from Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and thermal conductivity, making the product reliable for various applications.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for better performance and flexibility in handling different input voltage levels.

Bit Size: 16

Larger bit size allows for higher precision and accuracy in signal processing tasks.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Having a digital signal processor and controller integrated into one chip simplifies the design and implementation of systems requiring both functionalities.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, making the product efficient and reliable.

No. of DMA Channels: 4

Multiple DMA channels allow for efficient data transfer between memory and peripherals, improving overall system performance.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256GP504-E/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.32SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC33EP256GP504-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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