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DSPIC33EP16GS202-E/SS

Microchip Technology

DSPIC33EP16GS202-E/SS by Microchip Technology

DSPIC33EP16GS202-E/SS by Microchip is a 16-bit DSP with max clock freq of 60MHz, suitable for automotive applications. Operating temp range from -40 to 125°C, with supply voltage ranging from 3-3.6V. Features flash ROM programmability and CMOS technology in a small outline package.

Median Price

$3.940

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 343,780 parts In-Stock

1+ parts

$3.940

100+ parts

$3.260

1k+ parts

$3.000

10k+ parts

$2.850

343,780

$3.940

$3.260

$3.000

$2.850

DigiKey

USA . 241 parts In-Stock

1+ parts

$3.940

100+ parts

$3.260

1k+ parts

-

10k+ parts

-

241

$3.940

$3.260

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-

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$3.940

100+ parts

$3.260

1k+ parts

-

10k+ parts

-

5

$3.940

$3.260

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 265,597 parts In-Stock

1+ parts

$4.090

100+ parts

$3.710

1k+ parts

$3.390

10k+ parts

-

265,597

$4.090

$3.710

$3.390

-

Vyrian

USA . 2,130 parts In-Stock

1+ parts

-

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2,130

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

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500

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ComSIT Distribution GmbH

Germany . 228 parts In-Stock

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228

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 283 parts In-Stock

1+ parts

$3.220

100+ parts

-

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283

$3.220

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Ampacity Inc.

Singapore . 84 parts In-Stock

1+ parts

$3.350

100+ parts

-

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84

$3.350

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Semicontronic

India . 83 parts In-Stock

1+ parts

$3.350

100+ parts

$3.266

1k+ parts

$3.250

10k+ parts

-

83

$3.350

$3.266

$3.250

-

Microchip USA

USA . 1,489 parts In-Stock

1+ parts

$25.610

100+ parts

$25.450

1k+ parts

$25.370

10k+ parts

$25.290

1,489

$25.610

$25.450

$25.370

$25.290

Lixinc

USA . 11,507 parts In-Stock

1+ parts

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11,507

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RGB Technical Solutions

Ukraine . 6,429 parts In-Stock

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6,429

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 2,623 parts In-Stock

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2,623

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Continental Prestige Electronics

USA . 412 parts In-Stock

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412

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Experience unparalleled performance and reliability with the DSPIC33EP16GS202-E/SS from Microchip Technology. As a leading manufacturer in the industry, Microchip Technology has crafted this innovative Digital Signal Processor (DSP) to exceed expectations. Whether you're in automotive applications, controller systems, or digital signal processing, this product delivers exceptional value with its high clock frequency, wide operating temperature range, and cutting-edge CMOS technology. Trust in Microchip Technology for top-quality products that enhance your designs and elevate your projects to new heights. Upgrade to the DSPIC33EP16GS202-E/SS today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures the product can withstand various environmental conditions.

Surface Mount: YES

Easy to integrate on a circuit board, reducing assembly time and cost.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs for versatile applications.

Screening Level: TS 16949

High quality assurance standard for automotive applications.

Package Shape: RECTANGULAR

Efficient use of space on the PCB for compact designs.

Bit Size: 16

High processing power for complex digital signal processing tasks.

No. of Terminals: 28

Sufficient number of terminals for connecting with other components.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without issues.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperature conditions.

Terminal Finish: MATTE TIN

Provides good solderability and corrosion resistance.

Terminal Position: DUAL

Enhances reliability and stability of connections.

Maximum Seated Height: 2 mm

Low profile design suitable for space-constrained applications.

Width: 5.3 mm

Compact size for easy integration and board space savings.

Maximum Clock Frequency: 60 MHz

High clock speed for rapid data processing and real-time applications.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly processes.

Length: 10.2 mm

Optimal length for fitting into various electronic devices.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Versatile functionality for signal processing and control applications.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Secure mechanical attachment to PCB for durability.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance.

ROM Programmability: FLASH

Allows for flexible programming and updates of the memory.

Terminal Pitch: 0.65 mm

Fine pitch for precise placement on the PCB.

Moisture Sensitivity Level (MSL): 2

Can withstand moderate moisture exposure during handling and storage.

On Chip Program ROM Width: 8

Wide ROM width for storing program data efficiently.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP16GS202-E/SS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

OPERATES UPTO 60MIPS; AEC-Q100 (PLANNED)

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.3 mm

Trade Compliance

DSPIC33EP16GS202-E/SS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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