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DSPIC33EP128GS702-E/MM

Microchip Technology

DSPIC33EP128GS702-E/MM by Microchip Technology

DSPIC33EP128GS702-E/MM by Microchip Technology is a 16-bit DSP with 3.6V max supply voltage, suitable for automotive applications. It features 11-Ch 12-bit ADCs, 1-Ch 12-bit DAC, and operates at up to 60MHz clock frequency. Ideal for digital signal processing tasks in automotive systems due to its low power mode and extensive peripheral support.

Median Price

$7.110

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 438 parts In-Stock

1+ parts

$7.110

100+ parts

$5.900

1k+ parts

$5.430

10k+ parts

$5.170

438

$7.110

$5.900

$5.430

$5.170

Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

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$6.356

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750

$6.356

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NAC Semi

USA . 366 parts In-Stock

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$7.400

100+ parts

$6.710

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$6.130

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366

$7.400

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$6.130

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Vyrian

USA . 3,089 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 1,317 parts In-Stock

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Greenchips

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Distributors (Availability)

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Corohmni

South Africa . 362 parts In-Stock

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$5.810

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362

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Ampacity Inc.

Singapore . 345 parts In-Stock

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$6.040

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Continental Prestige Electronics

USA . 2,909 parts In-Stock

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$6.356

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$6.229

2,909

$6.356

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$6.229

Netroflash

USA . 100 parts In-Stock

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$6.356

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$6.229

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AZTECH Wire

Italy . 700 parts In-Stock

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$6.375

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Lixinc

USA . 7,237 parts In-Stock

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Montano Global Distributors

Canada . 6,484 parts In-Stock

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LMD Electronica

Estonia . 6,418 parts In-Stock

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NIA Electronics

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Ledger Components

France . 4,907 parts In-Stock

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Argo Parts USA

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LOOK Integrated Logistics

Peru . 3,663 parts In-Stock

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Overview

Unlock the full potential of your digital signal processing projects with the DSPIC33EP128GS702-E/MM by Microchip Technology. Trusted for its quality and reliability, this digital signal processor offers unmatched performance in a compact package. Ideal for automotive applications and more, this product delivers precision and efficiency like no other. Experience the value of cutting-edge technology with the DSPIC33EP128GS702-E/MM and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the DSP from external damage, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this DSP can handle higher voltage inputs without the risk of damage, providing flexibility in power supply requirements.

RAM Words: 8192

With a large RAM capacity of 8192 words, this DSP can handle complex data processing tasks efficiently, making it ideal for applications requiring high-speed data processing.

ADC Channels: YES

The presence of Analog to Digital Converter channels allows the DSP to interface with analog signals, enabling it to process a wide range of input signals for diverse applications.

Maximum Clock Frequency: 60 MHz

With a maximum clock frequency of 60 MHz, this DSP can execute instructions at a high speed, making it suitable for real-time signal processing and control applications.

Connectivity: I2C(2), IRDA, SPI(3), UART(2)

The multiple connectivity options including I2C, SPI, and UART enable seamless communication with external devices, enhancing the versatility of this DSP for various system integration needs.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GS702-E/MM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

PIC

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

4

No. of I/O Lines:

20

No. of Serial I/Os:

4

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

43690

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Speed:

70 rpm

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA, SPI(3), UART(2)

Peripherals:

ANALOG COMPARATOR(4), BOR, POR, PWM(8), TIMER(5), WDT

Analog To Digital Convertors:

11-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-bit

Trade Compliance

DSPIC33EP128GS702-E/MM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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