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DSPIC33CK32MC105-I/M4

Microchip Technology

DSPIC33CK32MC105-I/M4 by Microchip Technology

DSPIC33CK32MC105-I/M4 by Microchip Technology is a 16-bit digital signal processor with integrated cache and a max clock frequency of 64 MHz. It is commonly used in industrial applications due to its low power mode, wide temperature range (-40 to 85 °C), and multiple internal bus architecture.

Median Price

$1.440

Lifecycle Status

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5

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1k+

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Microchip Technology

USA . 4,563 parts In-Stock

1+ parts

$1.440

100+ parts

$1.190

1k+ parts

$1.090

10k+ parts

$1.040

4,563

$1.440

$1.190

$1.090

$1.040

Mouser Electronics

USA . 65 parts In-Stock

1+ parts

$1.440

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$1.190

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65

$1.440

$1.190

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NAC Semi

USA . 3,660 parts In-Stock

1+ parts

$1.550

100+ parts

$1.400

1k+ parts

$1.260

10k+ parts

-

3,660

$1.550

$1.400

$1.260

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.720

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500

$1.720

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Vyrian

USA . 6,951 parts In-Stock

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6,951

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Ampacity Inc.

Singapore . 2,439 parts In-Stock

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$1.220

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2,439

$1.220

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Continental Prestige Electronics

USA . 6,931 parts In-Stock

1+ parts

$1.639

100+ parts

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10k+ parts

$1.607

6,931

$1.639

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$1.607

Argo Parts USA

USA . 3,279 parts In-Stock

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$1.639

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3,279

$1.639

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$1.686

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$1.618

10k+ parts

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2,000

$1.686

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$1.618

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$1.754

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$1.754

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$1.754

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2,000

$1.754

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Microchip USA

USA . 2,017 parts In-Stock

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$10.465

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2,017

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Corohmni

South Africa . 3,013 parts In-Stock

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$17.801

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$17.801

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Aztec Data Supply Inc.

USA . 2,198 parts In-Stock

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$37.560

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LOOK Integrated Logistics

Peru . 6,694 parts In-Stock

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NIA Electronics

USA . 4,183 parts In-Stock

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Ledger Components

France . 4,183 parts In-Stock

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Montano Global Distributors

Canada . 2,243 parts In-Stock

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LMD Electronica

Estonia . 1,695 parts In-Stock

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Overview

Looking for a powerful and versatile Digital Signal Processor (DSP) that delivers unmatched performance? Look no further than the DSPIC33CK32MC105-I/M4 by Microchip Technology! As a leader in the industry, Microchip is known for its exceptional quality and reliability. The DSPIC33CK32MC105-I/M4 offers countless benefits and advantages to customers, making it the perfect choice for a wide range of applications. With its integrated cache and multiple timers, this DSP ensures lightning-fast processing and precise control. Its low power mode and flash programmability make it energy-efficient and flexible. Whether you need it for industrial automation, motor control, or audio processing, the DSPIC33CK32MC105-I/M4 will exceed your expectations. Trust Microchip to deliver top-notch quality and cutting-edge technology with this outstanding DSP!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material in the package body provides durability and strength, making it suitable for various applications.

Integrated Cache:

YES - The integrated cache enhances the performance of the digital signal processor by providing faster access to frequently used data, ensuring efficient processing.

Surface Mount:

YES - The surface mount feature allows for easy installation and integration into compact electronic systems, saving valuable space.

Maximum Supply Voltage:

3.6 V - The high maximum supply voltage ensures compatibility with different power supply systems, increasing flexibility in design and implementation.

On Chip Data RAM Width:

8 - With a wide on-chip data RAM width of 8, the product can efficiently store and process large amounts of data, enabling complex signal processing tasks.

Package Shape:

SQUARE - The square package shape provides easy handling and placement during assembly, contributing to streamlined production processes.

Bit Size:

16 - With a bit size of 16, the digital signal processor offers high processing capabilities, allowing for intricate signal analysis and manipulation.

No. of Terminals:

48 - The considerable number of terminals provides extensive connectivity options, enabling seamless integration with other components and peripherals.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - This package style offers efficient heat dissipation, ensuring optimal performance even in demanding environments with limited space.

Minimum Supply Voltage:

3 V - The low minimum supply voltage requirement makes the product suitable for applications with limited power availability or those requiring lower power consumption.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature allows the product to function reliably in demanding industrial environments with elevated temperatures.

No. of External Interrupts:

4 - The presence of four external interrupts enables the DSP to respond to external events swiftly and efficiently, enhancing its versatility in real-time applications.

Minimum Operating Temperature:

40 °C - The wide temperature range of operation, down to -40°C, ensures the product's reliability even in extreme cold conditions.

Terminal Position:

QUAD - The quad terminal position facilitates easy connectivity and reduces the risk of errors during installation, enhancing the overall reliability of the product.

Maximum Seated Height:

0.6 mm - The low maximum seated height makes the product suitable for compact electronic systems, ensuring efficient space utilization and easy integration.

RAM Words:

8192 - With a generous capacity of 8192 RAM words, the DSP can handle and process large volumes of data efficiently, enabling complex signal processing tasks.

Width:

6 mm - The compact width of 6 mm allows for easy integration into space-constrained electronic systems, providing flexibility in design and layout.

Boundary Scan:

YES - The presence of boundary scan capabilities simplifies testing and debugging during the manufacturing process, ensuring high-quality and reliable products.

Maximum Clock Frequency:

64 MHz - The high maximum clock frequency of 64 MHz enables fast and efficient signal processing, making the product ideal for applications with stringent timing requirements.

Internal Bus Architecture:

MULTIPLE - The multiple internal bus architecture enhances data flow and interconnectivity within the DSP, optimizing processing efficiency and minimizing latency.

Length:

6 mm - The compact length of 6 mm allows for easy integration into space-constrained electronic systems, providing flexibility in design and layout.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures the DSP's reliability and performance even in harsh industrial environments with extreme temperature variations.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, CONTROLLER - This product combines the capabilities of a digital signal processor and a controller, making it suitable for diverse applications that require both functionalities.

No. of Timers:

3 - The presence of three timers enables the DSP to handle various time-sensitive operations, facilitating precise timing control in diverse applications.

Technology:

CMOS - The use of CMOS technology offers low power consumption, reducing energy requirements and heat dissipation, making the product suitable for battery-powered and portable devices.

Terminal Form:

NO LEAD - The no-lead terminal form simplifies the manufacturing and assembly process, ensuring reliable solder joints and minimizing the risk of component damage.

Maximum Supply Current:

29.6 mA - The low maximum supply current requirement allows for efficient use of power resources, making the DSP suitable for low-power and energy-efficient applications.

Nominal Supply Voltage:

3.3 V - The nominal supply voltage of 3.3 V offers compatibility with standard power supply systems, simplifying integration into existing electronic systems.

No. of DMA Channels:

4 - The presence of four DMA channels facilitates efficient data transfer between peripherals and memory, improving overall system performance and reducing processor load.

No. of Serial I/Os:

3 - The presence of three serial I/Os enables the DSP to easily interface with external devices, expanding its connectivity options for diverse applications.

ROM Programmability:

FLASH - The use of flash memory for ROM programmability allows for easy and flexible firmware updates, ensuring adaptability and scalability for evolving application requirements.

Terminal Pitch:

0.4 mm - The narrow terminal pitch of 0.4 mm allows for high-density integration, making the DSP suitable for applications where space efficiency is essential.

Format:

FIXED POINT - The fixed-point format provides accurate and precise arithmetic calculations, enabling reliable and high-quality signal processing operations.

Low Power Mode:

YES - The presence of a low power mode enables power-saving operation, prolonging battery life and reducing overall power consumption in energy-conscious applications.

Barrel Shifter:

YES - The integrated barrel shifter enhances data manipulation capabilities, allowing for efficient shifting and rotation operations, crucial for complex signal processing tasks.

On Chip Program ROM Width:

24 - With a generous width of 24, the on-chip program ROM can store a significant amount of program instructions, enabling versatile and extensive software functionality.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK32MC105-I/M4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N48

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Maximum Supply Current:

29.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

DSPIC33CK32MC105-I/M4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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