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DSPIC30F2012-20I/SP

Microchip Technology

DSPIC30F2012-20I/SP by Microchip Technology

DSPIC30F2012-20I/SP by Microchip Technology is a 16-bit digital signal processor with 1024 RAM words and flash ROM programmability. It operates at a max clock frequency of 40 MHz, making it suitable for industrial applications requiring high-speed processing and low power consumption. With 3 external interrupts and 5 timers, this CMOS technology device offers versatile functionality in a compact package style.

Median Price

$5.837

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 23 parts In-Stock

1+ parts

$4.603

100+ parts

-

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23

$4.603

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Bristol Electronics

USA . 30 parts In-Stock

1+ parts

$7.070

100+ parts

$3.535

1k+ parts

-

10k+ parts

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30

$7.070

$3.535

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-

Vyrian

USA . 4,689 parts In-Stock

1+ parts

-

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4,689

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-

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ACDS - Activité Composants Distribution Service

France . 30 parts In-Stock

1+ parts

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30

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Dan-Mar Components

USA . 30 parts In-Stock

1+ parts

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 478 parts In-Stock

1+ parts

$4.600

100+ parts

-

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478

$4.600

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Bastille Electronics

Australia . 28 parts In-Stock

1+ parts

$4.603

100+ parts

$4.373

1k+ parts

$4.154

10k+ parts

$4.097

28

$4.603

$4.373

$4.154

$4.097

Continental Prestige Electronics

USA . 1,998 parts In-Stock

1+ parts

$4.603

100+ parts

-

1k+ parts

-

10k+ parts

$4.511

1,998

$4.603

-

-

$4.511

Semicontronic

India . 810 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

10k+ parts

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810

$6.000

$5.850

$5.820

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Andel Nordic

Denmark . 2,350 parts In-Stock

1+ parts

$7.763

100+ parts

-

1k+ parts

$7.452

10k+ parts

$7.452

2,350

$7.763

-

$7.452

$7.452

AZTECH Wire

Italy . 551 parts In-Stock

1+ parts

$17.304

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551

$17.304

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Lixinc

USA . 12,891 parts In-Stock

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12,891

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Marpe Global Electronics

Taiwan . 5,048 parts In-Stock

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5,048

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QualityLine Systems

Poland . 4,864 parts In-Stock

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4,864

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XL Components Corporation

Australia . 3,132 parts In-Stock

1+ parts

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3,132

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Argo Parts USA

USA . 2,116 parts In-Stock

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2,116

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Overview

Unlock the power of advanced digital signal processing with the Microchip Technology DSPIC30F2012-20I/SP. Crafted by a trusted industry leader, this top-quality device offers unparalleled performance in a compact package. Ideal for a wide range of applications, this DSP boasts impressive features and benefits that will elevate your projects to new heights. Experience the innovation and reliability of Microchip Technology with the DSPIC30F2012-20I/SP - the perfect choice for all your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, ensuring a longer lifespan.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options and can accommodate higher voltage inputs.

On Chip Data RAM Width: 8

Provides ample memory width for processing and storing data efficiently.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement within electronic devices.

Bit Size: 16

Higher bit size allows for more complex calculations and processing capabilities.

Internal Bus Architecture: MULTIPLE

Multiple bus architecture enhances data transfer speed and efficiency within the DSP.

Maximum Clock Frequency: 40 MHz

High clock frequency ensures fast processing speed and responsiveness.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient.

ROM Programmability: FLASH

Programmable ROM allows for easy updates and modifications to the DSP's firmware.

Low Power Mode: YES

Low power mode option helps in conserving energy and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F2012-20I/SP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e3

Length:

34.671 mm

Low Power Mode:

YES

No. of External Interrupts:

3

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Words:

1024

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

5.08 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

DSPIC30F2012-20I/SP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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