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APA300-FG256A

Microchip Technology

APA300-FG256A by Microchip Technology

APA300-FG256A by Microchip Technology is a CMOS FPGA with 8192 logic cells. Featuring 186 inputs and outputs, it operates at 2.5V and supports surface mount packaging. Ideal for applications requiring high-speed data processing in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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VNN

France . 800 parts In-Stock

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800

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Vyrian

USA . 573 parts In-Stock

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573

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Digiode

USA . 472 parts In-Stock

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472

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Nova Conductors

Japan . 300 parts In-Stock

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300

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AZTECH Wire

Italy . 573 parts In-Stock

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$7.080

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$6.800

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$6.660

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$6.530

573

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$6.530

Semicontronic

India . 629 parts In-Stock

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$31.000

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$30.225

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$30.070

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Aztec Data Supply Inc.

USA . 1,033 parts In-Stock

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$78.110

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Corohmni

South Africa . 123 parts In-Stock

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Vigor

Singapore . 5,950 parts In-Stock

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Microchip USA

USA . 12,680 parts In-Stock

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12,680

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Marpe Global Electronics

Taiwan . 6,980 parts In-Stock

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QualityLine Systems

Poland . 6,980 parts In-Stock

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XL Components Corporation

Australia . 6,980 parts In-Stock

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Argo Parts USA

USA . 4,851 parts In-Stock

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Continental Prestige Electronics

USA . 2,781 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Corphita

USA . 307 parts In-Stock

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307

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Overview

Unlock endless possibilities with the Microchip Technology APA300-FG256A, a top-of-the-line Field Programmable Gate Array! Boasting 8192 logic cells and 186 inputs/outputs, this FPGA is a powerhouse for your design projects. With its cutting-edge CMOS technology and durable plastic/epoxy package body, you can trust in the quality and reliability of Microchip Technology. From automotive to telecommunications, the applications are limitless. Invest in the future of innovation and experience the unparalleled value and benefits that the APA300-FG256A brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, ensuring a longer lifespan for the FPGA.

No. of Logic Cells: 8192

Having a high number of logic cells allows for complex computations and processing tasks to be executed efficiently.

Surface Mount: YES

Being surface mountable makes installation and integration of the FPGA easier and more convenient.

Technology Used: CMOS

The CMOS technology enables low power consumption and high speed performance, making it energy efficient and reliable.

No. of Inputs: 186

Having a sufficient number of inputs allows for a wide range of data to be processed and analyzed by the FPGA.

Package Shape: SQUARE

The square package shape provides symmetry and efficient use of space when integrating the FPGA into a circuit board.

Form Of Terminal: BALL

The ball terminal form offers a reliable and secure connection, ensuring stable operation of the FPGA.

Packing Method: TRAY

The tray packing method provides easy handling and storage of the FPGA, reducing the risk of damage during transportation.

Power Supplies (V): 2.5,2.5/3.3

Having multiple power supply options allows flexibility in the design and operation of the FPGA in various voltage environments.

No. of Terminals: 256

With a high number of terminals, the FPGA can accommodate a large number of connections for input and output, enhancing its versatility.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field programmable device, the FPGA can be customized and reconfigured for different applications, providing adaptability and versatility.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and efficient layout for the terminals, maximizing connectivity in a limited space.

Pitch Of Terminal: 1 mm

The small pitch of the terminals allows for high density integration of the FPGA on a circuit board, optimizing space usage.

Position Of Terminal: BOTTOM

Having terminals at the bottom provides easy access for soldering and connection, simplifying the integration process of the FPGA.

No. of Outputs: 186

With a matching number of outputs to inputs, the FPGA can effectively process and deliver results based on the input data received.

Technical Specifications

Field Programmable Gate Arrays (FPGA) APA300-FG256A attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

8192

No. of Inputs:

186

No. of Outputs:

186

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Power Supplies:

2.5,2.5/3.3 V

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Packing Method:

Tray

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

Qualified:

No

Trade Compliance

APA300-FG256A Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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