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APA300-FG256M

Microchip Technology

APA300-FG256M by Microchip Technology

APA300-FG256M by Microchip Technology is a CMOS FPGA with 8192 logic cells and 300,000 equivalent gates. It operates at a max clock frequency of 180 MHz and has a package style of grid array. Ideal for military-grade applications requiring high-speed processing in harsh environments.

Median Price

$607.848

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 73 parts In-Stock

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$607.848

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Chip Stock

USA . 1,332 parts In-Stock

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Vyrian

USA . 892 parts In-Stock

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VNN

France . 889 parts In-Stock

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Nova Conductors

Japan . 63 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 892 parts In-Stock

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$11.190

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$10.750

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$10.530

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$10.320

892

$11.190

$10.750

$10.530

$10.320

Semicontronic

India . 666 parts In-Stock

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$13.000

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$12.675

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$12.610

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666

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$12.610

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Advanced Electronics

New Zealand . 700 parts In-Stock

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$43.415

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$39.508

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$35.600

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700

$43.415

$39.508

$35.600

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Corohmni

South Africa . 99 parts In-Stock

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$139.113

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Aztec Data Supply Inc.

USA . 4,453 parts In-Stock

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$181.830

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Vigor

Singapore . 1,343 parts In-Stock

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$450.892

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Corphita

USA . 50 parts In-Stock

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Component Stockers USA

USA . 71 parts In-Stock

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$631.860

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Microchip USA

USA . 12,893 parts In-Stock

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RGB Technical Solutions

Ukraine . 7,645 parts In-Stock

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Futuretech Components

Singapore . 5,759 parts In-Stock

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Argo Parts USA

USA . 2,392 parts In-Stock

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Continental Prestige Electronics

USA . 1,816 parts In-Stock

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Perfect Parts

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the APA300-FG256M by Microchip Technology. As a leader in the field programmable gate arrays (FPGA) category, Microchip Technology delivers top-notch quality and reliability. This versatile product offers customers a wide range of applications, providing unmatched value and benefits. With 300,000 equivalent gates and 8,192 logic cells, the APA300-FG256M is designed to exceed expectations. Experience the advantages of this FPGA with its high clock frequency of 180 MHz, military-grade temperature rating, and innovative design that sets it apart from the rest. Elevate your projects with the APA300-FG256M and embrace the future of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good durability for the FPGA.

No. of Logic Cells: 8192

With a high number of logic cells, this FPGA can handle complex logic functions efficiently.

Surface Mount: YES

Easy to mount on a PCB, making it convenient for assembly.

Maximum Supply Voltage: 2.7 V

Operates within a safe voltage range, ensuring reliability.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Inputs: 186

Provides flexibility in accepting a variety of input signals.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB.

Form Of Terminal: BALL

Ball terminals enable reliable connections and easy rework if needed.

No. of Equivalent Gates: 300000

High number of gates allows for complex digital designs to be implemented.

Nominal Supply Voltage (V): 2.5

Operates at a common voltage level, making it compatible with a wide range of systems.

Packing Method: TRAY

Tray packing ensures safe transportation and storage of the FPGA.

Power Supplies (V): 2.5,2.5/3.3

Supports multiple power supply options for different system requirements.

No. of Terminals: 256

Sufficient terminals for connecting to external components and circuits.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being field-programmable allows for customization and reconfiguration of logic functions.

Package Style (Meter): GRID ARRAY

Grid array package style offers easy soldering and robust mechanical connections.

Minimum Supply Voltage: 2.3 V

Operates within a wide voltage range to accommodate different power sources.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments without compromising performance.

Pitch Of Terminal: 1 mm

Close terminal pitch allows for high-density mounting on the PCB.

Organization: 300000 GATES

High gate count enables the implementation of complex digital designs.

Minimum Operating Temperature: -55 °C

Can withstand extreme cold temperatures for use in varied environmental conditions.

Finishing Of Terminal Used: TIN LEAD

Tin lead terminal finishing provides good solderability and conductivity.

Position Of Terminal: BOTTOM

Bottom terminal position allows for efficient PCB layout and routing.

Moisture Sensitivity Level (MSL): 3

MSL level indicates the moisture resistance of the FPGA during storage and handling.

Maximum Seated Height: 1.8 mm

Low profile design for space-saving and compatibility with compact electronic devices.

Width: 17 mm

Compact width for fitting into tight spaces on the PCB.

Maximum Clock Frequency: 180 MHz

High clock frequency for fast processing of digital signals.

No. of Outputs: 186

Ample number of outputs for driving external components and circuits.

Maximum Time At Peak Reflow Temperature (s): 20

Can withstand peak reflow temperatures for a specified duration during assembly.

Peak Reflow Temperature °C: 225

Capable of withstanding high reflow temperatures during soldering processes.

Length: 17 mm

Compact length for space-saving and efficient PCB layout.

Grading Of Temperature: MILITARY

Designed to meet military-grade temperature specifications for rugged applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) APA300-FG256M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

8192

No. of Inputs:

186

No. of Outputs:

186

No. of Equivalent Gates:

300000

Maximum Clock Frequency:

180 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

300000 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.3 V

Maximum Supply Voltage:

2.7 V

Power Supplies:

2.5,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

20 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.8 mm

Packing Method:

Tray

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

APA300-FG256M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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