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APA300-FG256

Microchip Technology

APA300-FG256 by Microchip Technology

Microchip Technology's APA300-FG256 is a CMOS FPGA with 8192 logic cells, 186 inputs/outputs, and 300000 equivalent gates. Operating at up to 180 MHz clock frequency, it suits applications requiring high-speed processing in commercial-grade environments. The package features a square shape with ball terminals on a grid array style for surface mounting.

Median Price

$253.497

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 76 parts In-Stock

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$243.428

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Nova Conductors

Japan . 50 parts In-Stock

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$263.565

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$263.565

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VNN

France . 3,126 parts In-Stock

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Vyrian

USA . 642 parts In-Stock

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Chip Stock

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Component Sense

UK . 19 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 642 parts In-Stock

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$11.710

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$11.250

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$11.020

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$10.800

642

$11.710

$11.250

$11.020

$10.800

Aztec Data Supply Inc.

USA . 1,001 parts In-Stock

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$50.010

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Vigor

Singapore . 4,578 parts In-Stock

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$180.570

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Ampacity Inc.

Singapore . 249 parts In-Stock

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$217.800

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Semicontronic

India . 221 parts In-Stock

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$217.800

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$212.355

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$211.266

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Corphita

USA . 293 parts In-Stock

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$230.616

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Aranea Global

USA . 500 parts In-Stock

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$258.294

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$247.962

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$258.294

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Modulus Dynamics

Lithuania . 936 parts In-Stock

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$263.565

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$263.565

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936

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Corohmni

South Africa . 336 parts In-Stock

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Continental Prestige Electronics

USA . 406 parts In-Stock

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CPlus Electronics

USA . 23,500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,016 parts In-Stock

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Microchip USA

USA . 8,279 parts In-Stock

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Glotronic Ltd.

UK . 3,140 parts In-Stock

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Fulton Briggs Corp.

USA . 2,731 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Argo Parts USA

USA . 249 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the APA300-FG256 by Microchip Technology. As a leader in the field programmable gate arrays (FPGA) category, this product boasts 300,000 equivalent gates and 8,192 logic cells, providing unparalleled performance for a wide range of applications. With a maximum clock frequency of 180 MHz and a package body material of plastic/epoxy, this FPGA offers reliability and versatility. Experience seamless integration, high-speed operation, and exceptional value with the APA300-FG256. Elevate your projects to new heights with Microchip Technology's innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this FPGA lightweight and durable, which is ideal for portable devices.

No. of Logic Cells: 8192

With 8192 logic cells, this FPGA offers a high level of computational power and flexibility for complex digital designs.

Technology Used: CMOS

The CMOS technology used in this FPGA provides low power consumption and high noise immunity, making it efficient for various applications.

Maximum Clock Frequency: 180 MHz

The maximum clock frequency of 180 MHz ensures fast processing speeds, making this FPGA suitable for applications requiring quick data processing.

Nominal Supply Voltage (V): 2.5

The nominal supply voltage of 2.5V offers a standard operating range for the FPGA, ensuring compatibility with common power sources.

No. of Terminals: 256

With 256 terminals, this FPGA provides ample connectivity options for interfacing with other components in a system.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this FPGA has a moderate level of moisture sensitivity, suitable for standard manufacturing and storage conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) APA300-FG256 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

8192

No. of Inputs:

186

No. of Outputs:

186

No. of Equivalent Gates:

300000

Maximum Clock Frequency:

180 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

300000 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.3 V

Maximum Supply Voltage:

2.7 V

Power Supplies:

2.5,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.8 mm

Packing Method:

Tray

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

Qualified:

No

Trade Compliance

APA300-FG256 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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