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APA300-FG256I

Microchip Technology

APA300-FG256I by Microchip Technology

APA300-FG256I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 8192 logic cells. It operates at a max clock frequency of 180 MHz and has a wide temperature range of -40 to 85°C. This FPGA is commonly used in industrial applications requiring high-speed processing and programmability.

Median Price

$332.820

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7 parts In-Stock

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$306.500

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$304.520

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7

$306.500

$304.520

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DigiKey

USA . 90 parts In-Stock

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$332.820

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90

$332.820

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Verical

USA . 25 parts In-Stock

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$684.657

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25

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$684.657

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Distributors (In-Stock)

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Digiode

USA . 349 parts In-Stock

1+ parts

$291.935

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349

$291.935

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Nova Conductors

Japan . 47 parts In-Stock

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$342.330

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47

$342.330

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VNN

France . 2,530 parts In-Stock

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Chip Stock

USA . 1,431 parts In-Stock

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Vyrian

USA . 413 parts In-Stock

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413

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Distributors (Availability)

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AZTECH Wire

Italy . 413 parts In-Stock

1+ parts

$9.600

100+ parts

$9.220

1k+ parts

$9.040

10k+ parts

$8.850

413

$9.600

$9.220

$9.040

$8.850

Aztec Data Supply Inc.

USA . 4,930 parts In-Stock

1+ parts

$145.940

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4,930

$145.940

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Microchip USA

USA . 1,656 parts In-Stock

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$226.660

100+ parts

$225.980

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$225.640

10k+ parts

$225.300

1,656

$226.660

$225.980

$225.640

$225.300

Vigor

Singapore . 1,116 parts In-Stock

1+ parts

$234.533

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$234.533

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Ampacity Inc.

Singapore . 53 parts In-Stock

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$261.200

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53

$261.200

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Semicontronic

India . 48 parts In-Stock

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$261.200

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$254.670

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$253.364

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48

$261.200

$254.670

$253.364

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Corphita

USA . 157 parts In-Stock

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$276.570

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157

$276.570

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Argo Parts USA

USA . 3,817 parts In-Stock

1+ parts

$342.330

100+ parts

$338.907

1k+ parts

$335.483

10k+ parts

$332.060

3,817

$342.330

$338.907

$335.483

$332.060

Continental Prestige Electronics

USA . 3,299 parts In-Stock

1+ parts

$342.330

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$335.483

3,299

$342.330

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$335.483

Corohmni

South Africa . 295 parts In-Stock

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$342.330

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295

$342.330

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Advanced Electronics

New Zealand . 666 parts In-Stock

1+ parts

$430.198

100+ parts

$395.782

1k+ parts

$370.860

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666

$430.198

$395.782

$370.860

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QUARKTWIN TECHNOLOGY LTD

USA . 6,467 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$335.483

1k+ parts

$325.213

10k+ parts

$318.367

2,000

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$335.483

$325.213

$318.367

Futuretech Components

Singapore . 2,000 parts In-Stock

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Perfect Parts

USA . 1,714 parts In-Stock

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Fulton Briggs Corp.

USA . 645 parts In-Stock

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Glotronic Ltd.

UK . 40 parts In-Stock

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Overview

Experience unparalleled performance and versatility with the APA300-FG256I by Microchip Technology. As a leading manufacturer in the field, Microchip Technology brings you a state-of-the-art Field Programmable Gate Array (FPGA) that combines cutting-edge technology with exceptional reliability. With 8192 logic cells and 300,000 equivalent gates, this FPGA offers limitless possibilities for your next project. Whether you're designing advanced communication systems or high-speed digital signal processing applications, the APA300-FG256I delivers unmatched speed and efficiency. Its CMOS technology ensures low power consumption, while its square package shape and bottom terminal position make it easy to integrate into any design. Experience the future of programmable ICs with Microchip Technology's APA300-FG256I. Unlock your creativity and achieve unprecedented results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and protection for the FPGA, making it a reliable choice for demanding applications.

No. of Logic Cells: 8192

With a high number of logic cells, this FPGA enables complex and large-scale designs, making it suitable for advanced digital systems.

Surface Mount: YES

Being surface mountable, this FPGA can be easily integrated onto PCBs, allowing for a compact and space-efficient design.

Maximum Supply Voltage: 2.7 V

The FPGA's ability to operate at a maximum supply voltage of 2.7 V ensures compatibility with a wide range of power sources, enhancing its versatility.

Technology Used: CMOS

Utilizing CMOS technology, this FPGA offers low power consumption, high noise immunity, and faster switching speeds, resulting in efficient and reliable performance.

No. of Inputs: 186

With a generous number of inputs, this FPGA can accommodate a wide range of input signals, enabling versatile and flexible system designs.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and facilitates easy placement and alignment of the FPGA in electronic systems.

Form Of Terminal: BALL

The use of ball terminals ensures reliable electrical connections and easy soldering, contributing to a robust and reliable system design.

No. of Equivalent Gates: 300000

With a high number of equivalent gates, this FPGA supports the implementation of complex and large-scale digital circuits, making it suitable for demanding applications.

Nominal Supply Voltage (V): 2.5

The FPGA's nominal supply voltage of 2.5 V provides compatibility with standard power sources, allowing for seamless integration into various electronic systems.

Packing Method: TRAY

The tray packing method offers secure and organized storage and transportation of the FPGA, preventing any damage during handling and shipping.

Power Supplies (V): 2.5,2.5/3.3

The FPGA's compatibility with multiple power supply voltages (2.5 V and 2.5/3.3 V) ensures flexibility in system design and integration with different power sources.

No. of Terminals: 256

With a sufficient number of terminals, this FPGA supports easy connectivity and integration with other components, simplifying system design and implementation.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this IC allows for customization and reconfiguration of digital circuitry, providing adaptability and versatility in system designs.

Package Style (Meter): GRID ARRAY

The use of a grid array package style allows for efficient routing of signals and reduces the risk of signal interference, enhancing overall system reliability.

Minimum Supply Voltage: 2.3 V

The FPGA's ability to operate at a minimum supply voltage of 2.3 V ensures compatibility with low-power applications, making it suitable for energy-efficient designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this FPGA can withstand demanding environmental conditions, increasing its reliability and lifespan.

Pitch Of Terminal: 1 mm

The 1 mm pitch of the terminals enables compact PCB layouts and optimized signal routing, facilitating efficient system design and reducing signal interference.

Organization: 300000 GATES

With an organization of 300,000 gates, this FPGA supports the implementation of complex and intricate digital logic designs, making it suitable for high-performance applications.

Minimum Operating Temperature: -40 °C

The FPGA's ability to operate at a minimum temperature of -40°C enables reliable performance even in extreme cold environments, making it suitable for a wide range of applications.

Finishing Of Terminal Used: TIN LEAD

The use of tin lead for terminal finishing ensures excellent electrical conductivity and solderability, contributing to a robust and reliable system design.

Position Of Terminal: BOTTOM

The positioning of the terminals at the bottom of the FPGA simplifies PCB routing and allows for efficient space utilization, enhancing overall system design flexibility.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA can withstand moderate levels of moisture exposure during manufacturing and assembly processes, ensuring reliable performance.

Maximum Seated Height: 1.8 mm

The FPGA's low maximum seated height of 1.8 mm enables compact and slim system designs, ideal for space-constrained applications.

Width: 17 mm

With a width of 17 mm, this FPGA offers compatibility with standard PCB widths, facilitating easy integration into electronic systems and reducing design complexity.

Maximum Clock Frequency: 180 MHz

Supporting a high maximum clock frequency of 180 MHz, this FPGA enables fast and efficient data processing, making it suitable for real-time applications.

No. of Outputs: 186

With a generous number of outputs, this FPGA facilitates communication and data exchange with other components, allowing for versatile system designs.

Maximum Time At Peak Reflow Temperature (s): 20

The FPGA can withstand a maximum time of 20 seconds at peak reflow temperature, ensuring proper soldering and component integrity during manufacturing processes.

Peak Reflow Temperature °C: 225

The peak reflow temperature of 225°C ensures reliable soldering and component attachment during manufacturing, contributing to a robust system design.

Length: 17 mm

With a length of 17 mm, this FPGA offers compatibility with standard PCB dimensions, promoting easy integration into electronic systems and simplifying design considerations.

Grading Of Temperature: INDUSTRIAL

Designed for industrial applications, this FPGA can operate within a wide temperature range, providing reliable performance even in harsh environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) APA300-FG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

8192

No. of Inputs:

186

No. of Outputs:

186

No. of Equivalent Gates:

300000

Maximum Clock Frequency:

180 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

300000 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.3 V

Maximum Supply Voltage:

2.7 V

Power Supplies:

2.5,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

20 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.8 mm

Packing Method:

Tray

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

APA300-FG256I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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