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11AA010-I/MS

Microchip Technology

11AA010-I/MS by Microchip Technology

11AA010-I/MS by Microchip Tech is an EEPROM with 128x8 organization, 1-WIRE serial bus type, and 1 MHz clock frequency. It operates at -40 to 85 °C, has a 5 mA supply current, and offers software write protection. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact form factor.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 23,000 parts In-Stock

1+ parts

$0.300

100+ parts

$0.270

1k+ parts

$0.260

10k+ parts

$0.250

23,000

$0.300

$0.270

$0.260

$0.250

DigiKey

USA . 1,944 parts In-Stock

1+ parts

$0.300

100+ parts

$0.270

1k+ parts

-

10k+ parts

-

1,944

$0.300

$0.270

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.306

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$0.306

-

-

-

NAC Semi

USA . 18,400 parts In-Stock

1+ parts

$0.340

100+ parts

$0.310

1k+ parts

$0.270

10k+ parts

-

18,400

$0.340

$0.310

$0.270

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Vyrian

USA . 8,334 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,334

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-

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VNN

France . 4,873 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,873

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-

-

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Cyclops Electronics Ltd

UK . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,462 parts In-Stock

1+ parts

$0.255

100+ parts

-

1k+ parts

-

10k+ parts

-

8,462

$0.255

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-

-

Continental Prestige Electronics

USA . 2,524 parts In-Stock

1+ parts

$0.306

100+ parts

-

1k+ parts

-

10k+ parts

$0.300

2,524

$0.306

-

-

$0.300

Argo Parts USA

USA . 1,036 parts In-Stock

1+ parts

$0.306

100+ parts

-

1k+ parts

-

10k+ parts

$0.297

1,036

$0.306

-

-

$0.297

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.306

100+ parts

$0.300

1k+ parts

$0.291

10k+ parts

$0.284

500

$0.306

$0.300

$0.291

$0.284

Fulton Briggs Corp.

USA . 3,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,572

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Overview

Unlock unlimited possibilities with the 11AA010-I/MS EEPROM by Microchip Technology. Designed with precision and reliability, this small yet powerful memory chip offers endless applications in various industries. From enhancing system performance to storing critical data securely, this EEPROM delivers unmatched value and benefits to customers. Trust in the quality and expertise of Microchip Technology to bring innovation to your projects with the 11AA010-I/MS. Step into the future of technology with this advanced memory solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides a durable and cost-effective solution for housing the EEPROM.

Surface Mount: YES

The ability to be surface mounted allows for easy installation and integration into various circuit boards.

Screening Level: TS 16949

This high screening level ensures the EEPROM meets stringent quality standards, making it reliable for automotive applications.

Package Shape: SQUARE

The square package shape offers a compact design, saving space in electronic devices.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for efficient communication with other components in the system.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with most standard power systems.

Power Supplies (V): 2/5

The option for 2V or 5V power supplies provides flexibility in voltage requirements for different applications.

No. of Terminals: 8

With 8 terminals, the EEPROM can easily connect to other components in the circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space and offers ease of assembly.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance makes the EEPROM suitable for harsh environments.

Organization: 128X8

The 128X8 organization allows for efficient memory storage and retrieval.

Output Characteristics: TOTEM POLE

The totem pole output characteristics provide strong signal output capabilities.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance ensures functionality even in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers corrosion resistance and a reliable connection.

Terminal Position: DUAL

The dual terminal position provides flexibility in board layout and connections.

Write Protection: SOFTWARE

The software write protection feature adds an extra layer of security to prevent accidental data loss.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a slim and compact design.

Maximum Clock Frequency (fCLK): 1 MHz

The high maximum clock frequency enables fast data transfer speeds.

Width: 3 mm

The 3mm width offers a compact form factor for space-constrained applications.

Minimum Supply Voltage (Vsup): 1.8 V

The 1.8V minimum supply voltage allows for low-power operation.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering processes.

Length: 3 mm

The 3mm length offers a compact form factor for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of temperatures.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity.

Parallel or Serial: SERIAL

The serial communication interface allows for easy integration with microcontrollers and other serial devices.

Terminal Form: GULL WING

The gull wing terminal form offers easy soldering and secure connections.

Maximum Supply Current: 5 mA

The low maximum supply current consumption helps to minimize power usage.

No. of Words: 128 words

The 128-word memory capacity provides ample storage for data.

Memory Width: 8

The 8-bit memory width allows for efficient data handling and storage.

Minimum Data Retention Time: 200

The 200-year minimum data retention time ensures long-term data integrity.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch allows for high-density mounting on circuit boards.

No. of Words Code: 128

The 128-word code capacity provides flexibility in storing different data types.

Maximum Supply Voltage (Vsup): 5.5 V

The 5.5V maximum supply voltage tolerance ensures compatibility with various power sources.

Endurance: 1000000 Write/Erase Cycles

The high endurance rating allows for frequent read/write operations without degradation.

Serial Bus Type: 1-WIRE

The 1-WIRE serial bus type simplifies communication and integration with other devices.

Maximum Write Cycle Time (tWC): 10 ms

The short 10ms maximum write cycle time allows for fast data recording.

Memory Density: 1024 bit

The 1024-bit memory density offers ample storage space for data.

Memory IC Type: EEPROM

The EEPROM memory IC type provides non-volatile data storage capabilities.

Maximum Standby Current: 0.000005 Amp

The low maximum standby current consumption helps to conserve power when the device is not in use.

Technical Specifications

EEPROM 11AA010-I/MS attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Output Characteristics:

TOTEM POLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Ready or Busy:

NO

Reverse Pinout:

NO

Screening Level:

TS 16949

Maximum Seated Height:

1.1 mm

Serial Bus Type:

1-WIRE

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

NO

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

SOFTWARE

Trade Compliance

11AA010-I/MS Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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