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11AA020-I/TO

Microchip Technology

11AA020-I/TO by Microchip Technology

11AA020-I/TO by Microchip Technology is a 256x8 EEPROM with 1-WIRE serial bus, 1000000 write/erase cycles endurance, and 2048 bit memory density. It operates at -40 to 85 °C with a max clock frequency of 1 MHz. Ideal for industrial applications requiring reliable data storage in a compact through-hole package.

Median Price

$0.320

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,703 parts In-Stock

1+ parts

$0.320

100+ parts

-

1k+ parts

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10k+ parts

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1,703

$0.320

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 18 parts In-Stock

1+ parts

$0.329

100+ parts

-

1k+ parts

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10k+ parts

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18

$0.329

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Vyrian

USA . 12,330 parts In-Stock

1+ parts

-

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-

1k+ parts

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12,330

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-

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VNN

France . 6,152 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,152

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 11,995 parts In-Stock

1+ parts

$0.255

100+ parts

-

1k+ parts

-

10k+ parts

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11,995

$0.255

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-

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Continental Prestige Electronics

USA . 5,294 parts In-Stock

1+ parts

$0.329

100+ parts

-

1k+ parts

-

10k+ parts

$0.322

5,294

$0.329

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-

$0.322

Argo Parts USA

USA . 134 parts In-Stock

1+ parts

$0.329

100+ parts

-

1k+ parts

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10k+ parts

$0.319

134

$0.329

-

-

$0.319

West Coast Incorporated

USA . 3,151 parts In-Stock

1+ parts

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100+ parts

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3,151

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Unlock a world of possibilities with the high-quality 11AA020-I/TO EEPROM from Microchip Technology. Designed with precision and reliability in mind, this versatile memory solution offers seamless integration for a wide range of applications. From industrial automation to consumer electronics, this EEPROM delivers unmatched performance and durability. Experience the value of hassle-free operation, fast data transfer speeds, and secure software write protection, all while enjoying the peace of mind that comes with Microchip Technology's trusted reputation. Upgrade your system today with the 11AA020-I/TO and elevate your technology to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the EEPROM device, making it suitable for various environments.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for efficient communication and data transfer within the EEPROM, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V provides stable power to the EEPROM, ensuring consistent operation and reliability.

No. of Terminals: 3

Having 3 terminals simplifies the connection process and makes the EEPROM easier to integrate into electronic systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this EEPROM can withstand elevated environmental temperatures without compromising performance.

Organization: 256X8

The 256x8 organization offers a good balance between memory capacity and data organization, making it suitable for various applications.

Write Protection: SOFTWARE

The software-based write protection feature ensures data security and prevents unauthorized modifications to the EEPROM contents.

Memory Density: 2048 bit

With a memory density of 2048 bits, this EEPROM provides ample storage capacity for data storage and retrieval requirements.

Endurance: 1000000 Write/Erase Cycles

The high endurance of 1,000,000 write/erase cycles ensures long-term reliability and durability for extensive use cases.

Parallel or Serial: SERIAL

The serial communication interface allows for efficient data transfer and integration within electronic systems, enhancing overall performance.

Technical Specifications

EEPROM 11AA020-I/TO attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

X-PBCY-T3

JESD-609 Code:

e3

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

3

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Output Characteristics:

TOTEM POLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SIP3,.1,50

Package Shape:

Package Style (Meter):

CYLINDRICAL

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Ready or Busy:

NO

Reverse Pinout:

NO

Screening Level:

TS 16949

Serial Bus Type:

1-WIRE

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Toggle Bit:

NO

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

SOFTWARE

Trade Compliance

11AA020-I/TO Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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