Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Intel's EPM1270T144C4 is a PLD with 980 macro cells, 116 inputs/outputs, and 8.1 ns propagation delay. Ideal for applications requiring in-system programmability, it operates at temperatures up to 85°C and has JTAG boundary scan testing capability.
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This material provides durability and protection for the PLD, making it a reliable choice for long-term use.
With a fast propagation delay, this PLD can process data quickly and efficiently, making it suitable for high-speed applications.
The surface mount capability simplifies the installation process and reduces the PCB footprint, making it ideal for compact designs.
This allows for a higher supply voltage tolerance, making the PLD suitable for a variety of power supply setups.
With a high number of macro cells, this PLD offers greater flexibility and functionality for complex logic designs.
CMOS technology provides low power consumption and high noise immunity, making this PLD energy-efficient and reliable.
The large number of inputs allows for versatile input configurations, making the PLD suitable for diverse applications.
The square package shape provides uniformity and compactness, making it easy to integrate the PLD into different systems.
The gull wing terminal design offers strong mechanical support and ease of soldering, ensuring reliable connections.
The stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.
The multiple power supply options provide flexibility in power management, adapting to various system requirements.
The high number of terminals enables versatile connectivity options, enhancing the PLD's integration capabilities.
The flash programmable IC type allows for easy reprogramming of the device, making it adaptable to changing design requirements.
The various package styles offer versatility in installation and compatibility with different PCB layouts.
The in-system programmability feature allows for convenient reprogramming without removing the PLD from the system.
The macrocell output function provides flexibility in logic operations, enhancing the PLD's versatility in different applications.
The low minimum supply voltage ensures compatibility with a wide range of power sources, increasing usability.
With a high maximum operating temperature, this PLD can withstand harsh environments and temperature fluctuations reliably.
The small pitch of terminals allows for high-density mounting, optimizing PCB space and enabling compact designs.
The dedicated inputs and numerous I/O lines offer flexibility in logic organization, enhancing the PLD's functionality.
With a low minimum operating temperature, this PLD can function reliably in a wide range of environmental conditions.
The tin-lead terminal finishing provides excellent solderability and durability, ensuring secure connections and longevity.
The quad terminal position allows for stable mounting and secure connections, enhancing the PLD's reliability in operation.
With an MSL of 3, this PLD has moderate moisture sensitivity, suitable for various storage and operating conditions.
The low maximum seated height allows for compact and slim designs, making the PLD ideal for space-constrained applications.
The moderate width provides a balance between space efficiency and ease of handling, making the PLD versatile in different layouts.
The high number of outputs allows for versatile output configurations, enhancing the PLD's functionality in diverse applications.
The moderate length offers a balance between compactness and space for connections, making the PLD suitable for different installations.
The JTAG boundary scan test capability enables easy testing and debugging, ensuring quick and efficient troubleshooting.
The extensive I/O lines provide flexibility in signal routing and communication, making the PLD versatile in various applications.
With a commercial extended temperature grading, this PLD can operate reliably in a wide range of temperature environments, ensuring compatibility with diverse systems.
Programmable Logic Devices (PLD) EPM1270T144C4 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
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EPM1270T144C4 Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - MAX II EOL-Reversal 19/Mar/2021 Mult Dev EOL 4/Dec/2020
PCN Design/Specification - Appearance Update 30/Mar/2015 Quartus SW/Web Chgs 23/Sep/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
SMBJ18CA
Concord Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V;
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
MBR130T1G
Onsemi
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
1N4148WS
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
NE555D
STMicroelectronics
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
RC0402FR-071KL
Yageo
The Yageo RC0402FR-071KL is a fixed resistor with a resistance of 1000 ohm and a tolerance of 1%. It is suitable for surface mount applications and has a max operating temperature of 155 °C.
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
EPF10K30AQC240-3N
Intel
Intel's EPF10K30AQC240-3N is a PLD with 1728 logic cells, 0.9 ns propagation delay, and 189 inputs/outputs. It operates at max clock frequency of 80 MHz and supports a variety of power supplies. Ideal for applications requiring high-speed processing and programmable logic functionality in commercial temperature environments.
XC95144XL-10TQG100C
Xilinx
Xilinx XC95144XL-10TQG100C is a 144 macrocell CMOS PLD with 81 I/O lines, 138.88 MHz clock frequency, and 10 ns propagation delay. Ideal for applications requiring in-system programmability, such as flash-based designs needing fast processing speeds and versatile I/O configurations.
XC9572XL-7VQG64C
XC9572XL-7VQG64C by Xilinx is a 3.3V FLASH PLD with 72 macro cells, 36 inputs/outputs, and 125 MHz clock frequency. Ideal for applications requiring in-system programmability, it features a propagation delay of 7.5 ns and operates within -40 to +85°C temperature range.
EPM7256SQC208-15N
Altera
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
LC4256ZE-7TN144C
Lattice Semiconductor
LC4256ZE-7TN144C by Lattice Semiconductor is a 256 macrocell EE PLD with 7.5 ns propagation delay, suitable for applications requiring in-system programmability and 111 MHz clock frequency. With 96 I/O lines, 0.5 mm terminal pitch, and matte tin finish, it offers versatile functionality in compact form factor for various electronic designs.
5M80ZT100C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
5M40ZE64C4
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 64; Package Code: HTFQFP; Package Shape: SQUARE;
EPM7064AETC44-4N
EPM7064AETC44-4N by Intel is a 64 macrocell EE PLD with 36 inputs/outputs, operating at up to 222.2 MHz clock frequency. It features a propagation delay of 4.5 ns and can be in-system programmable for various applications requiring fast processing speeds and versatile I/O configurations.
5M570ZT100C4
ATF16V8BQL-15SU
Microchip Technology
ATF16V8BQL-15SU by Microchip is a PLD with 15ns propagation delay, 18 inputs, and 64 product terms. It is used in applications requiring a max clock frequency of 45MHz, such as industrial control systems and embedded designs. With surface mount capability and small outline packaging, it offers versatile integration options for various projects.
EPF10K10AQC208-3N
Intel's EPF10K10AQC208-3N is a PLD with 576 logic cells, 0.8 ns propagation delay, and 134 inputs/outputs. It operates at 80 MHz clock frequency, suitable for applications requiring high-speed processing in commercial environments. The device features a flatpack package style with gull wing terminals and matte tin finish.
EPM240T100I3
The EPM240T100I3 by Altera is a programmable logic device with 192 macro cells. It has a propagation delay of 4.7 ns and uses CMOS technology. This surface mount device comes in a QFP package with 100 terminals and is in-system programmable. Its features include JTAG boundary scan test and a peak reflow temperature of 220°C.
XC9536XL-7VQG64C
Xilinx XC9536XL-7VQG64C is a 36 macrocell FLASH PLD with 7.5 ns propagation delay and 138.88 MHz max clock frequency. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its 36 I/O lines and JTAG boundary scan test capability.
EPM570M100C4N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: BGA; Package Shape: SQUARE;
EPF8452ALI84-4N
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;
ATF22V10CQZ-20JU
ATF22V10CQZ-20JU by Microchip: 20ns Propagation Delay, 5.5V Max Supply Voltage, CMOS Tech. Ideal for PAL-TYPE applications with 22 inputs, 10 I/O lines, and a max clock frequency of 38.5MHz in industrial settings.
ATF1502AS-7AX44-T
Microchip Technology's ATF1502AS-7AX44-T is a PLD with 32 I/O lines, 7.5 ns propagation delay, and 166.7 MHz max clock frequency. Ideal for applications requiring EE PLDs in commercial environments due to its thin profile, square package shape, and GULL WING terminals.
LC4064ZE-7TN100C
LC4064ZE-7TN100C by Lattice Semiconductor is a 64-macrocell EE PLD with 7.5ns propagation delay, 111MHz clock frequency, and 1.9V max supply voltage. Ideal for applications requiring in-system programmability, it features 10 dedicated inputs and 64 I/O lines in a low-profile flatpack package with 0.5mm terminal pitch.
5M240ZT144C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EPM240GF100I5N
The Intel EPM240GF100I5N is a FLASH PLD with 192 macro cells, 80 inputs/outputs, and 7.5 ns propagation delay. It is ideal for applications requiring low-profile programmable logic devices with in-system programmability and JTAG boundary scan testing capabilities.
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EPM1270T144I5N
The Intel EPM1270T144I5N is a FLASH PLD with 980 macro cells, 116 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring in-system programmability, it operates at temperatures from -40 to 100°C and supports JTAG boundary scan testing.
EPM1270T144C5N
EPM1270T144C5N by Intel is a Flash PLD with 980 macro cells, 116 inputs/outputs, and a propagation delay of 10 ns. It is ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its low profile package style and CMOS technology.
EPM1270F256I5N
The Intel EPM1270F256I5N is a FLASH PLD with 980 macro cells, 212 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring programmable logic devices in a compact grid array package with JTAG boundary scan test capability.
EPM1270F256C5N
EPM1270F256C5N by Intel is a programmable logic device (PLD) with 980 macro cells and 212 inputs/outputs. It uses CMOS technology and has a max supply voltage of 2.625V. This PLD is suitable for applications requiring in-system programmability and a fast propagation delay of 10ns.
EPM1270T144C3N
EPM1270T144C3N by Intel is a FLASH PLD with 980 macro cells, 116 inputs/outputs, and 6.2 ns propagation delay. Ideal for applications requiring fast processing speeds and high input/output capabilities in programmable logic devices.
EPM1270T144C4N
EPM1270M256C5N
EPM1270M256C5N by Intel is a programmable logic device (PLD) with 980 macro cells and 212 inputs/outputs. It has a propagation delay of 10 ns and can operate at temperatures up to 85°C. This PLD is commonly used for in-system programming and features JTAG boundary scan testing.
EPM1270GT144C4N
EPM1270M256I5N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; No. of Macro Cells: 980;
EPM1270T144I5
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; JESD-609 Code: e0;
EPM1270GT144C5N
EPM1270F256A5N
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EPM1270T144A5N
The Intel EPM1270T144A5N is a FLASH PLD with 980 macro cells, 116 I/O lines, and 10 ns propagation delay. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 2.375V to 2.625V. This surface-mount device features JTAG boundary scan test capability and is in-system programmable for versatile use cases.
EPM1270T144C5
FLASH PLD; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EPM1270GM256I5N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; Width: 11 mm;
EPM1270T144C3
EPM1270F256C3N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EPM1270GF256I5
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.8;
EPM1270GM256C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR;
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