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EPM1270GF256I5

Intel

EPM1270GF256I5 by Intel

The Intel EPM1270GF256I5 is a FLASH PLD with 980 macro cells, 212 inputs/outputs, and 10 ns propagation delay. Ideal for applications requiring programmable logic devices with in-system programmability and JTAG boundary scan testing capabilities.

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Digiode

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Ampacity Inc.

Singapore . 1,489 parts In-Stock

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Semicontronic

India . 999 parts In-Stock

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One Stop Electronics

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Vigor

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Texas Native Microelectronics

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Modulus Dynamics

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MARBEL Systems

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Supply Digital

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Kenton Components

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Qasali Group International

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Overview

Experience the power and versatility of the EPM1270GF256I5 by Intel, a cutting-edge Programmable Logic Device that offers unmatched performance and reliability. With 980 macro cells and 212 inputs/outputs, this device is perfect for a wide range of applications, from industrial automation to consumer electronics. Intel's reputation for quality and innovation shines through in every aspect of this product, providing customers with the value and flexibility they need to stay ahead in today's fast-paced market. Upgrade your designs and take your projects to the next level with the EPM1270GF256I5 - the ultimate choice for professionals who demand nothing but the best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and reliability for the product.

Propagation Delay: 10 ns

Low propagation delay ensures fast operation and response times.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs.

Maximum Supply Voltage: 1.89 V

Efficient power usage with a relatively low maximum supply voltage.

No. of Macro Cells: 980

A high number of macro cells provide flexibility and customization in programming.

Technology Used: CMOS

CMOS technology ensures low power consumption and high noise immunity.

No. of Inputs: 212

Plenty of input channels for versatile input configurations.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

Form Of Terminal: BALL

Ball terminals offer good electrical connectivity and are suitable for grid array packages.

Nominal Supply Voltage (V): 1.8

Stable nominal supply voltage for consistent performance.

Power Supplies (V): 1.5/3.3,1.8

Supports multiple power supply options for compatibility with different systems.

No. of Terminals: 256

Ample terminals for connectivity and integration with other components.

Programmable IC Type: FLASH PLD

FLASH PLD technology allows for reprogramming of logic functions as needed.

Package Style (Meter): GRID ARRAY

Grid array package style offers high terminal density and reliability.

In-System Programmable: YES

In-system programmability provides flexibility for on-the-fly reconfiguration.

Output Function: MACROCELL

Macrocell output function enables complex logic operations and signal processing.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage for efficient power usage.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance for reliable performance in various environments.

Pitch Of Terminal: 1 mm

1 mm terminal pitch for easy soldering and PCB assembly.

Organization: 0 DEDICATED INPUTS, 212 I/O

Dedicated inputs and numerous I/O lines for versatile programming options.

Minimum Operating Temperature: -40 °C

Wide operating temperature range suitable for both industrial and commercial applications.

Finishing Of Terminal Used: TIN LEAD

TIN LEAD terminal finishing offers good solderability and electrical conductivity.

Position Of Terminal: BOTTOM

Bottom terminal position for easy PCB mounting and connectivity.

Moisture Sensitivity Level (MSL): 3

MSL level 3 ensures resistance to moisture and environmental factors.

Maximum Seated Height: 2.2 mm

Low maximum seated height for compact and space-saving designs.

Width: 17 mm

Compact 17 mm width for efficient PCB layout and space utilization.

No. of Outputs: 212

Equal number of output lines as input lines for balanced logic functions.

Length: 17 mm

Symmetrical 17 mm length for uniform and streamlined PCB design.

JTAG Boundary Scan Test: YES

Support for JTAG boundary scan testing for easy debugging and verification of designs.

No. of I/O Lines: 212

Plenty of I/O lines for connecting to external devices and peripherals.

Technical Specifications

Programmable Logic Devices (PLD) EPM1270GF256I5 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 212 I/O

No. of Outputs:

212

Output Function:

Macrocell

No. of Inputs:

212

No. of Macro Cells:

980

No. of Dedicated Inputs:

0

No. of I/O Lines:

212

Propagation Delay:

10 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.71 V

Maximum Supply Voltage:

1.89 V

Power Supplies (V):

1.5/3.3,1.8 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

100 °C (212 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA256,16X16,40

Width:

17 mm

Length:

17 mm

Maximum Seated Height:

2.2 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

256

Terminal Pitch:

1 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

EPM1270GF256I5 Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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