Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Intel's EPM1270F256C3N is a FLASH PLD with 980 macro cells and 212 I/O lines. It features a propagation delay of 6.2 ns, operates at a max supply voltage of 2.625 V, and has JTAG boundary scan test capability. Ideal for applications requiring high-speed processing and programmable logic functions in compact electronic systems.
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Durable and cost-effective material for packaging.
Fast propagation delay for efficient performance.
Easily mountable on PCBs for streamlined assembly.
Low maximum supply voltage for power efficiency.
Large number of macro cells for complex logic operations.
CMOS technology offers low power consumption and high noise immunity.
Abundance of inputs for versatile input configurations.
Square package shape for efficient use of space on PCBs.
Ideal nominal supply voltage for stable operation.
Support for multiple power supply voltages for flexibility.
Sufficient terminals for connectivity and interfacing.
Flash programmability allows for easy reprogramming.
Grid array package style for easy layout and connection.
In-system programmability for convenient updates and modifications.
Dedicated macrocells for specific logic functions.
Low minimum supply voltage for efficient power usage.
High maximum operating temperature for reliability in various environments.
Compact terminal pitch for space-saving design.
Dedicated inputs and abundant I/O options for versatile logic configurations.
Low minimum operating temperature for wide temperature range operation.
Tin, silver, and copper finishing for optimal conductivity and reliability.
Bottom terminal position for easy PCB mounting and connectivity.
MSL 3 rating indicates moderate moisture sensitivity.
Low-profile maximum seated height for compact designs.
Moderate width for balanced PCB space utilization.
Equal number of outputs to inputs for balanced logic operations.
30 seconds maximum time at peak reflow temperature for efficient soldering.
High peak reflow temperature for secure solder joints.
Moderate length for balanced PCB space utilization.
JTAG boundary scan test capability for easy debugging and testing.
Abundant I/O lines for versatile connectivity options.
Programmable Logic Devices (PLD) EPM1270F256C3N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
Programmable IC Type:
In-System Programmable:
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Propagation Delay:
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Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Power Supplies (V):
Maximum Operating Temperature:
Minimum Operating Temperature:
Temprature Grade:
Peak Reflow Temperature:
Moisture Sensitivity Level (MSL):
Maximum Time At Peak Reflow Temperature:
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Width:
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Maximum Seated Height:
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JESD-30 Code:
JESD-609 Code:
JTAG Boundary Scan Test:
Qualified:
EPM1270F256C3N Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - MAX II EOL-Reversal 19/Mar/2021 Mult Dev EOL 4/Dec/2020
PCN Design/Specification - Quartus SW/Web Chgs 23/Sep/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
LM358N
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
Weitron Technology
SMBJ18CA
Taiwan Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT3904-7-F
Diodes Incorporated
Diodes Inc. MMBT3904-7-F is a NPN BJT transistor for switching applications. Features include VCEsat of 0.3V, hFE of 30, and IC of 0.2A. With a max operating temp of 150°C, it's ideal for small outline SMT designs in automotive electronics.
1N4148
Unitrode
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Bkc Semiconductors
LM7805CT
Silicon Group
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Package Body Material: PLASTIC/EPOXY; Maximum Load Regulation: .05 %;
MMSZ5245BT1G
Onsemi
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
LM7805CT/NOPB
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Max): 125 Cel; Maximum Output Voltage-1: 5.25 V;
EPF10K30ATC144-3N
Intel
EPF10K30ATC144-3N by Intel is a PLD with 1728 logic cells, 0.9 ns propagation delay, and 102 inputs. It operates at a max frequency of 80 MHz and is ideal for applications requiring high-speed processing in commercial environments. With a low profile package style and fine pitch terminals, it offers versatility in design while maintaining reliable performance.
EPF10K50RC240-3N
EPF10K50RC240-3N by Intel is a PLD with 2880 logic cells, 0.6 ns propagation delay, and 66.67 MHz max clock frequency. Ideal for applications requiring high-speed data processing and complex logic operations in commercial-grade environments.
5M80ZT100I5N
Altera
The Altera 5M80ZT100I5N is a programmable logic device with 64 macro cells. It has a maximum clock frequency of 118.3 MHz and can operate at temperatures up to 100°C. With 79 I/O lines, it is suitable for industrial applications.
XC95144XL-7TQ144C
Xilinx
The Xilinx XC95144XL-7TQ144C is a 144 macrocell FLASH PLD with 117 inputs/outputs. It operates at a max clock frequency of 125 MHz, with a propagation delay of 7.5 ns. Ideal for applications requiring in-system programmability and high-speed data processing in commercial-grade environments.
EPF10K50VRI240-4
Intel's EPF10K50VRI240-4 is a PLD with 2880 logic cells, 0.6 ns propagation delay, and 3.6 V max supply voltage. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities in a compact 32mm square package.
ATF1502ASV-15AU44
Atmel
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
EP1K50QC208-3
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
ATF1504AS-7AX100
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
5M1270ZF256A5N
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EPM570ZM144C7N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: BGA; Package Shape: RECTANGULAR;
5M40ZM64C5N
Intel's 5M40ZM64C5N is a FLASH PLD with 30 I/O lines, 118.3 MHz clock frequency, and 14 ns propagation delay. Ideal for applications requiring programmable logic devices with high-speed processing capabilities in compact form factors.
LCMXO640C-3TN100C4W
Lattice Semiconductor
LCMXO640C-3TN100C4W by Lattice Semiconductor is a PLD with 640 logic cells, 74 I/O lines, and 4.9 ns propagation delay. Ideal for applications requiring high-speed processing and low power consumption in compact designs.
LC4064ZC-75TN48C
LC4064ZC-75TN48C by Lattice Semiconductor is a 1.8V EE PLD with 64 macro cells, 36 inputs, and 32 I/O lines. With a propagation delay of 7.5ns and max clock frequency of 111MHz, it's ideal for applications requiring fast processing speeds in programmable logic devices. The device features JTAG boundary scan test capability and is suitable for surface mount assembly due to its thin profile flatpack package style.
ATF1504ASVL-20AU100
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC2C32A-6VQ44C
XC2C32A-6VQ44C by Xilinx is a 32 macrocell FLASH PLD with 300 MHz clock frequency, 6 ns propagation delay, and 33 I/O lines. It is used in applications requiring programmable logic devices with in-system programmability and JTAG boundary scan testing capabilities.
XC2C64A-7CPG56I
XC2C64A-7CPG56I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at 200 MHz clock frequency. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan test capability, with a package style of grid array and low profile design.
XC2C256-7CPG132C
XC2C256-7CPG132C by Xilinx is a 256 macrocell FLASH PLD with 106 I/O lines, operating at up to 300 MHz. It features a propagation delay of 7.5 ns and can be in-system programmable. Ideal for applications requiring high-speed processing and versatile I/O capabilities in commercial-grade environments.
GAL22V10D-25QJ
GAL22V10D-25QJ by Lattice Semiconductor is a 5.25V EE PLD with 132 product terms, 11 dedicated inputs, and 10 I/O lines. It features a propagation delay of 25ns, operates at up to 33.3MHz clock frequency, and is ideal for PAL-type applications requiring programmable logic devices in commercial extended temperature environments.
EPF10K200SRC240-3N
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
EPF10K20RC240-4N
Intel's EPF10K20RC240-4N is a PLD with 1152 logic cells, 0.6 ns propagation delay, and 67.11 MHz max clock frequency. Ideal for applications requiring high-speed processing and complex logic functions in commercial-grade environments.
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EPM1270T144I5N
The Intel EPM1270T144I5N is a FLASH PLD with 980 macro cells, 116 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring in-system programmability, it operates at temperatures from -40 to 100°C and supports JTAG boundary scan testing.
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Finishing Of Terminal Used: MATTE TIN;
EPM1270T144C5N
EPM1270T144C5N by Intel is a Flash PLD with 980 macro cells, 116 inputs/outputs, and a propagation delay of 10 ns. It is ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its low profile package style and CMOS technology.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EPM1270F256I5N
The Intel EPM1270F256I5N is a FLASH PLD with 980 macro cells, 212 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring programmable logic devices in a compact grid array package with JTAG boundary scan test capability.
The EPM1270F256I5N by Altera is a programmable logic device with 980 macro cells. It has a maximum supply voltage of 2.625V and uses CMOS technology. It is a flash PLD that is in-system programmable. The package style is grid array, with 256 terminals. Its top application is as a macrocell output function.
EPM1270F256C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EPM1270F256C5N by Intel is a programmable logic device (PLD) with 980 macro cells and 212 inputs/outputs. It uses CMOS technology and has a max supply voltage of 2.625V. This PLD is suitable for applications requiring in-system programmability and a fast propagation delay of 10ns.
EPM1270T144C3N
EPM1270T144C3N by Intel is a FLASH PLD with 980 macro cells, 116 inputs/outputs, and 6.2 ns propagation delay. Ideal for applications requiring fast processing speeds and high input/output capabilities in programmable logic devices.
The EPM1270T144C3N by Altera is a programmable logic device (PLD) with 980 macro cells. It has a propagation delay of 6.2 ns and can operate at a maximum supply voltage of 2.625 V. This device is surface mountable and uses CMOS technology. Its package shape is square with gull wing terminals. It is an in-system programmable flash PLD with a minimum supply voltage of 2.375 V. The EPM1270T144C3N is commonly used for applications that require the output function of a macrocell, such as digital signal processing and control systems.
EPM1270GT144C4N
The Altera EPM1270GT144C4N is a programmable logic device with 980 macro cells, CMOS technology, and a propagation delay of 8.1 ns. It can operate at a maximum supply voltage of 1.89V and has a package shape of square. This PLD is commonly used for applications requiring in-system programmability and output functions like macrocell.
EPM1270T144C4N
EPM1270M256C5N
EPM1270M256C5N by Intel is a programmable logic device (PLD) with 980 macro cells and 212 inputs/outputs. It has a propagation delay of 10 ns and can operate at temperatures up to 85°C. This PLD is commonly used for in-system programming and features JTAG boundary scan testing.
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR;
EPM1270M256I5N
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; No. of Macro Cells: 980;
FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR; JTAG Boundary Scan Test: YES;
EPM1270GT144C5N
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