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10AS027E2F27I1HG

Intel

10AS027E2F27I1HG by Intel

SoC; Terminal Form: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA672,26X26,40;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 985 parts In-Stock

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985

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Vyrian

USA . 490 parts In-Stock

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490

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Digiode

USA . 319 parts In-Stock

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319

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Native Microelectronics

USA . 450 parts In-Stock

1+ parts

$123.546

100+ parts

$118.604

1k+ parts

$114.898

10k+ parts

$108.720

450

$123.546

$118.604

$114.898

$108.720

Vigor

Singapore . 899 parts In-Stock

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$1,503.000

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899

$1,503.000

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Microchip USA

USA . 963 parts In-Stock

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$1,532.157

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963

$1,532.157

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MARBEL Systems

Belgium . 33,180 parts In-Stock

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33,180

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Qasali Group International

UK . 968 parts In-Stock

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$320.231

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$293.545

968

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$293.545

Corphita

USA . 167 parts In-Stock

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167

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Kenton Components

USA . 40 parts In-Stock

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$137.877

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40

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$137.877

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs 10AS027E2F27I1HG attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Intel

Specs

JESD-30 Code:

S-PBGA-B672

Length:

27 mm

No. of Terminals:

672

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA672,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.35 mm

Surface Mount:

YES

Technology:

TSMC

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

SoC

Trade Compliance

10AS027E2F27I1HG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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