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IS25LP256D-JMLE

Integrated Silicon Solution

IS25LP256D-JMLE by Integrated Silicon Solution

IS25LP256D-JMLE by Integrated Silicon Solution is a 32MX8 NOR flash memory with 268MB density. It operates at 133MHz clock frequency, has 100K write/erase cycles endurance, and supports SPI serial bus. Ideal for industrial applications requiring high-speed data storage in compact devices.

Median Price

$3.937

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$3.937

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10

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Chip Stock

USA . 49,331 parts In-Stock

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Vyrian

USA . 7,192 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,391 parts In-Stock

1+ parts

$3.710

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Continental Prestige Electronics

USA . 1,172 parts In-Stock

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$3.937

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$3.858

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$3.858

Argo Parts USA

USA . 916 parts In-Stock

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$3.937

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916

$3.937

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Netroflash

USA . 50 parts In-Stock

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$3.937

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$3.740

10k+ parts

$3.661

50

$3.937

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$3.740

$3.661

Advanced Electronics

New Zealand . 87 parts In-Stock

1+ parts

$4.015

100+ parts

$4.015

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$4.015

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87

$4.015

$4.015

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Corohmni

South Africa . 1,223 parts In-Stock

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$4.570

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AZTECH Wire

Italy . 245 parts In-Stock

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$15.494

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Lixinc

USA . 17,922 parts In-Stock

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Perfect Parts

USA . 7,820 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Kepictronics

USA . 466 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the IS25LP256D-JMLE by Integrated Silicon Solution. This high-quality flash memory device boasts a range of applications, from industrial to consumer electronics. With a focus on reliability and performance, this product offers customers unparalleled value and benefits. Say goodbye to slow data transfer speeds and hello to seamless operations with the IS25LP256D-JMLE. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material can provide good insulation and durability, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space in the design.

Nominal Temperature Coefficient: 35 ppm/°C

Low temperature coefficient ensures stable and accurate performance over a wide range of temperatures.

Package Shape: SQUARE

Square package shape can help with efficient layout and space utilization on the PCB.

Control Interface: 2-WIRE SERIAL

2-wire serial interface enables easy digital control and communication with other devices in the system.

Resistance Law: LINEAR

Linear resistance law allows for precise and predictable adjustments in resistance values.

Nominal Total Resistance: 200000 ohm

High total resistance value offers flexibility in adjusting the circuit parameters.

Maximum Resistor Terminal Voltage: 5 V

High maximum terminal voltage support allows for compatibility with various voltage levels in the system.

Power Supplies (V): 3/5

Support for multiple power supply options provides versatility in system integration.

No. of Terminals: 8

8 terminals allow for more precise control and adjustment options in the circuit.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact package style with heat sink/slug design and thin profile enables efficient heat dissipation and space-saving in the application.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position offers more flexibility in circuit connections and configurations.

Maximum Seated Height: 0.8 mm

Low seated height helps in space-constrained designs and minimizes PCB footprint.

Width: 3 mm

Compact width dimension contributes to the overall space-saving design.

No. of Positions: 256

High number of positions provides finer adjustment granularity for precise circuit tuning.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature support ensures proper solder reflow for robust connections.

Length: 3 mm

Compact length dimension contributes to space savings on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments.

Technology: BICMOS

BiCMOS technology offers a combination of the advantages of both bipolar and CMOS technologies, providing high performance and efficiency.

Nominal Bandwidth: 0.025 kHz

High nominal bandwidth allows for fast response and precise adjustment capabilities in the circuit.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes sustainability.

Converter Type: DIGITAL POTENTIOMETER

Digital potentiometer technology enables digital control and adjustment of resistance values, offering convenience and accuracy.

Nominal Supply Voltage: 5 V

Support for a 5V nominal supply voltage ensures compatibility with standard voltage levels in many applications.

Terminal Pitch: 0.65 mm

Close terminal pitch allows for compact design and efficient use of PCB space.

Minimum Resistor Terminal Voltage: 0 V

Support for 0V minimum terminal voltage ensures compatibility with systems where low voltage operation is required.

Technical Specifications

Flash Memory IS25LP256D-JMLE attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

Length:

10.31 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

16

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

3

Maximum Seated Height:

2.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00003 Amp

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

NOR TYPE

Width:

7.49 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

IS25LP256D-JMLE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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