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TC234L32F200NACKXUMA1

Infineon Technologies

TC234L32F200NACKXUMA1 by Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: HTFQFP; Package Shape: SQUARE;

Median Price

$15.845

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 999 parts In-Stock

1+ parts

$15.610

100+ parts

$10.654

1k+ parts

$9.761

10k+ parts

-

999

$15.610

$10.654

$9.761

-

Mouser Electronics

USA . 99 parts In-Stock

1+ parts

$15.610

100+ parts

$10.640

1k+ parts

$8.990

10k+ parts

-

99

$15.610

$10.640

$8.990

-

Newark

USA . 879 parts In-Stock

1+ parts

$16.080

100+ parts

$10.970

1k+ parts

$10.270

10k+ parts

-

879

$16.080

$10.970

$10.270

-

Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$24.300

100+ parts

-

1k+ parts

-

10k+ parts

-

30

$24.300

-

-

-

Element14

Singapore . 988 parts In-Stock

1+ parts

$53.730

100+ parts

$42.310

1k+ parts

-

10k+ parts

-

988

$53.730

$42.310

-

-

Rochester

USA . 1,351 parts In-Stock

1+ parts

-

100+ parts

$9.010

1k+ parts

$8.060

10k+ parts

$7.580

1,351

-

$9.010

$8.060

$7.580

Farnell

UK . 988 parts In-Stock

1+ parts

-

100+ parts

$23.540

1k+ parts

-

10k+ parts

-

988

-

$23.540

-

-

Verical

USA . 761 parts In-Stock

1+ parts

-

100+ parts

$11.262

1k+ parts

$10.075

10k+ parts

$9.475

761

-

$11.262

$10.075

$9.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 467 parts In-Stock

1+ parts

$9.500

100+ parts

-

1k+ parts

-

10k+ parts

-

467

$9.500

-

-

-

Vyrian

USA . 980 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

980

$10.000

-

-

-

Rutronik

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.570

10k+ parts

-

3,000

-

-

$10.570

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 732 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

-

10k+ parts

-

732

$9.000

-

-

-

Modulus Dynamics

Lithuania . 3,973 parts In-Stock

1+ parts

$11.970

100+ parts

$11.491

1k+ parts

$11.012

10k+ parts

-

3,973

$11.970

$11.491

$11.012

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$44.793

100+ parts

$40.762

1k+ parts

$36.730

10k+ parts

-

5,000

$44.793

$40.762

$36.730

-

Microchip USA

USA . 2,290 parts In-Stock

1+ parts

$60.858

100+ parts

-

1k+ parts

-

10k+ parts

-

2,290

$60.858

-

-

-

GreenTree Electronics

Israel . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Continental Prestige Electronics

USA . 988 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

988

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Technical Specifications

Microcontrollers TC234L32F200NACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

24 ADC INPUT LINES AVAILABLE

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

196608

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

200 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6)

Peripherals:

DMA(16), RTC, WDT

Trade Compliance

TC234L32F200NACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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