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TC233LP32F200NACKXUMA1

Infineon Technologies

TC233LP32F200NACKXUMA1 by Infineon Technologies

Infineon's TC233LP32F200NACKXUMA1 is a 32-bit microcontroller with 2097152 ROM words, 196608 RAM bytes, and max clock frequency of 200 MHz. Ideal for automotive applications due to its temperature grade, CAN connectivity, and on-chip program ROM width of 8 bits.

Median Price

$17.765

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 890 parts In-Stock

1+ parts

$17.400

100+ parts

$11.400

1k+ parts

$10.700

10k+ parts

-

890

$17.400

$11.400

$10.700

-

DigiKey

USA . 879 parts In-Stock

1+ parts

$17.500

100+ parts

$12.022

1k+ parts

$11.035

10k+ parts

-

879

$17.500

$12.022

$11.035

-

Mouser Electronics

USA . 516 parts In-Stock

1+ parts

$17.500

100+ parts

$12.030

1k+ parts

$11.030

10k+ parts

-

516

$17.500

$12.030

$11.030

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Newark

USA . 3,803 parts In-Stock

1+ parts

$18.030

100+ parts

$12.390

1k+ parts

$11.250

10k+ parts

-

3,803

$18.030

$12.390

$11.250

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Farnell

UK . 1,941 parts In-Stock

1+ parts

$33.210

100+ parts

$26.150

1k+ parts

-

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1,941

$33.210

$26.150

-

-

Element14

Singapore . 3,871 parts In-Stock

1+ parts

-

100+ parts

$41.680

1k+ parts

-

10k+ parts

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3,871

-

$41.680

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RS (Exports)

UK . 1,000 parts In-Stock

1+ parts

-

100+ parts

$35.890

1k+ parts

$32.421

10k+ parts

-

1,000

-

$35.890

$32.421

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Verical

USA . 890 parts In-Stock

1+ parts

-

100+ parts

$12.500

1k+ parts

$12.175

10k+ parts

-

890

-

$12.500

$12.175

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 697 parts In-Stock

1+ parts

$15.580

100+ parts

-

1k+ parts

-

10k+ parts

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697

$15.580

-

-

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$30.827

100+ parts

-

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-

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150

$30.827

-

-

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Chip Stock

USA . 11,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,500

-

-

-

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Semtec, LLC

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

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7,000

-

-

-

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ComSIT Distribution GmbH

Germany . 5,154 parts In-Stock

1+ parts

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100+ parts

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5,154

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-

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Rutronik

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$11.800

10k+ parts

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4,000

-

-

$11.800

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Vyrian

USA . 1,569 parts In-Stock

1+ parts

-

100+ parts

-

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1,569

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-

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Elcom Components

USA . 1,000 parts In-Stock

1+ parts

-

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1,000

-

-

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Contempo Components LLC

USA . 5 parts In-Stock

1+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,491 parts In-Stock

1+ parts

$10.630

100+ parts

$10.364

1k+ parts

$10.311

10k+ parts

-

1,491

$10.630

$10.364

$10.311

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Ampacity Inc.

Singapore . 1,256 parts In-Stock

1+ parts

$10.630

100+ parts

-

1k+ parts

-

10k+ parts

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1,256

$10.630

-

-

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Corphita

USA . 871 parts In-Stock

1+ parts

$14.760

100+ parts

-

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-

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871

$14.760

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-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$30.827

100+ parts

-

1k+ parts

$29.286

10k+ parts

$28.670

2,000

$30.827

-

$29.286

$28.670

Continental Prestige Electronics

USA . 2,000 parts In-Stock

1+ parts

$31.870

100+ parts

-

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2,000

$31.870

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Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$37.812

100+ parts

$34.409

1k+ parts

$31.006

10k+ parts

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870

$37.812

$34.409

$31.006

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Modulus Dynamics

Lithuania . 2,531 parts In-Stock

1+ parts

$38.858

100+ parts

$37.304

1k+ parts

$35.749

10k+ parts

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2,531

$38.858

$37.304

$35.749

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Corohmni

South Africa . 821 parts In-Stock

1+ parts

$43.556

100+ parts

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821

$43.556

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Aztec Data Supply Inc.

USA . 2,722 parts In-Stock

1+ parts

$81.530

100+ parts

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2,722

$81.530

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Argo Parts USA

USA . 3,102 parts In-Stock

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3,102

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Robosynatics

Brazil . 2,969 parts In-Stock

1+ parts

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100+ parts

$49.510

1k+ parts

$48.499

10k+ parts

$48.499

2,969

-

$49.510

$48.499

$48.499

Lucentia Tech

USA . 2,969 parts In-Stock

1+ parts

-

100+ parts

$49.510

1k+ parts

$48.499

10k+ parts

$48.499

2,969

-

$49.510

$48.499

$48.499

Microchip USA

USA . 1,479 parts In-Stock

1+ parts

-

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1,479

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GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Experience the next level of innovation with the TC233LP32F200NACKXUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-notch quality microcontrollers for various applications. Whether you're in automotive, industrial, or consumer electronics, this product offers exceptional value with its advanced features such as ADC channels, DMA channels, and peripherals like RTC and WDT. Trust in the reliability and performance of Infineon Technologies to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to environmental factors, making the product suitable for a variety of operating conditions.

Surface Mount: YES

The surface mount feature allows for easy and efficient assembly on circuit boards, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 1.43 V

The maximum supply voltage of 1.43 V ensures safe operation and protects the microcontroller from potential damage due to overvoltage.

Bit Size: 32

With a 32-bit size, the microcontroller can process data and instructions quickly and efficiently, making it suitable for complex applications.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options and interfaces, enabling the microcontroller to interact with various external devices and peripherals.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 125°C ensures the microcontroller can function reliably in harsh environmental conditions, such as automotive or industrial applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data, expanding its capability to interface with sensors and other analog devices.

ROM Words: 2097152

With a large ROM size of 2097152 words, the microcontroller can store a significant amount of program instructions and data, making it suitable for complex applications that require extensive memory capacity.

Speed: 200 rpm

The high operating speed of 200 rpm allows the microcontroller to execute instructions rapidly, ensuring efficient performance in time-critical applications.

Technical Specifications

Microcontrollers TC233LP32F200NACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

IT HAS 24 ADC AND FADC I/P LINES ,2 ADC MODULE

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

200 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

0

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

196608

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6)

Peripherals:

DMA(16), RTC, WDT

Trade Compliance

TC233LP32F200NACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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