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TC233LP32F200NACLXUMA1

Infineon Technologies

TC233LP32F200NACLXUMA1 by Infineon Technologies

Infineon's TC233LP32F200NACLXUMA1 is a 32-bit microcontroller with 24-Ch 12-Bit ADC, 196608 bytes RAM, and 2048 ROM words. Ideal for automotive applications, it offers connectivity options like CAN(6), FLEXRAY(2), LIN(2), QSPI(4) and peripherals including DMA(16), RTC, WDT. Operating at up to 200 MHz with a temperature range of -40 to 125 °C, this CMOS technology-based MCU is designed for high-speed performance in automotive systems.

Median Price

$12.611

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,033 parts In-Stock

1+ parts

-

100+ parts

$11.210

1k+ parts

$10.030

10k+ parts

$9.440

1,033

-

$11.210

$10.030

$9.440

Verical

USA . 939 parts In-Stock

1+ parts

-

100+ parts

$14.012

1k+ parts

$12.537

10k+ parts

$11.800

939

-

$14.012

$12.537

$11.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 665 parts In-Stock

1+ parts

$11.828

100+ parts

-

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-

10k+ parts

-

665

$11.828

-

-

-

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$27.761

100+ parts

-

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-

10k+ parts

-

900

$27.761

-

-

-

Cyclops Electronics Ltd

UK . 26,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

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26,000

-

-

-

-

Vyrian

USA . 7,616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

7,616

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 887 parts In-Stock

1+ parts

$10.580

100+ parts

-

1k+ parts

-

10k+ parts

-

887

$10.580

-

-

-

Corphita

USA . 808 parts In-Stock

1+ parts

$11.205

100+ parts

-

1k+ parts

-

10k+ parts

-

808

$11.205

-

-

-

Corohmni

South Africa . 1,105 parts In-Stock

1+ parts

$15.329

100+ parts

-

1k+ parts

-

10k+ parts

-

1,105

$15.329

-

-

-

AZTECH Wire

Italy . 840 parts In-Stock

1+ parts

$19.000

100+ parts

-

1k+ parts

-

10k+ parts

-

840

$19.000

-

-

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Modulus Dynamics

Lithuania . 3,007 parts In-Stock

1+ parts

$20.608

100+ parts

$19.784

1k+ parts

$18.959

10k+ parts

-

3,007

$20.608

$19.784

$18.959

-

Continental Prestige Electronics

USA . 3,112 parts In-Stock

1+ parts

$27.761

100+ parts

-

1k+ parts

-

10k+ parts

$27.206

3,112

$27.761

-

-

$27.206

Netroflash

USA . 100 parts In-Stock

1+ parts

$27.761

100+ parts

-

1k+ parts

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100

$27.761

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Microchip USA

USA . 2,546 parts In-Stock

1+ parts

$60.858

100+ parts

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2,546

$60.858

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QUARKTWIN TECHNOLOGY LTD

USA . 23,038 parts In-Stock

1+ parts

-

100+ parts

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23,038

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Argo Parts USA

USA . 3,425 parts In-Stock

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3,425

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Overview

Unlock limitless possibilities with the TC233LP32F200NACLXUMA1 by Infineon Technologies. This cutting-edge microcontroller offers unparalleled quality and reliability, making it the go-to choice for automotive applications. With a wide range of peripherals, high clock frequency, and advanced connectivity options, this microcontroller empowers you to create innovative solutions with ease. Trust in Infineon's expertise and elevate your projects to new heights with the TC233LP32F200NACLXUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use in various applications.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital signals, enabling it to interact with the external world and process sensor data.

Maximum Clock Frequency: 200 MHz

The high clock frequency allows for efficient and fast processing of tasks, making the microcontroller suitable for applications that require high-speed data processing.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is designed to be a compact and integrated solution for embedded systems, making it suitable for applications where space is limited.

RAM Bytes: 196608

With a large RAM size, the microcontroller can store and process a significant amount of data, making it suitable for multitasking and complex applications.

Connectivity: CAN(6), FLEXRAY(2), LIN(2), QSPI(4)

The multiple connectivity options such as CAN, FLEXRAY, LIN, and QSPI provide flexibility in communication protocols, allowing the microcontroller to interface with a wide range of devices and systems.

Technical Specifications

Microcontrollers TC233LP32F200NACLXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

200 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

196608

ROM Words:

2048

ROM Programmability:

FLASH

Speed:

200 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), FLEXRAY(2), LIN(2), QSPI(4)

Peripherals:

DMA(16), RTC, WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TC233LP32F200NACLXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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