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TC234LP32F200NACKXUMA1

Infineon Technologies

TC234LP32F200NACKXUMA1 by Infineon Technologies

Infineon's TC234LP32F200NACKXUMA1 microcontroller features 32-bit architecture, 196608 bytes of RAM, and a max clock frequency of 200 MHz. Ideal for automotive applications, it offers connectivity options like CAN(6), DMA(16) peripherals, and on-chip FLASH ROM programmability.

Median Price

$18.165

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 5 parts In-Stock

1+ parts

$10.960

100+ parts

$10.680

1k+ parts

$10.440

10k+ parts

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5

$10.960

$10.680

$10.440

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Chip1Stop

Japan . 1,023 parts In-Stock

1+ parts

$18.600

100+ parts

$13.800

1k+ parts

-

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1,023

$18.600

$13.800

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Mouser Electronics

USA . 2,549 parts In-Stock

1+ parts

$18.730

100+ parts

$12.920

1k+ parts

$11.870

10k+ parts

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2,549

$18.730

$12.920

$11.870

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DigiKey

USA . 1,320 parts In-Stock

1+ parts

$18.730

100+ parts

$12.919

1k+ parts

$11.872

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1,320

$18.730

$12.919

$11.872

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Newark

USA . 143 parts In-Stock

1+ parts

$22.130

100+ parts

$17.940

1k+ parts

$16.070

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143

$22.130

$17.940

$16.070

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Farnell

UK . 709 parts In-Stock

1+ parts

$38.784

100+ parts

$31.520

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-

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709

$38.784

$31.520

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Flip Electronics (Authorized)

USA . 99,000 parts In-Stock

1+ parts

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Verical

USA . 1,000 parts In-Stock

1+ parts

-

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$11.840

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1,000

-

-

$11.840

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Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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$11.840

10k+ parts

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1,000

-

-

$11.840

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Element14

Singapore . 691 parts In-Stock

1+ parts

-

100+ parts

$17.730

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691

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$17.730

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Rochester

USA . 617 parts In-Stock

1+ parts

-

100+ parts

$10.980

1k+ parts

$9.830

10k+ parts

$9.250

617

-

$10.980

$9.830

$9.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 999 parts In-Stock

1+ parts

$11.600

100+ parts

-

1k+ parts

-

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999

$11.600

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Bristol Electronics

USA . 190 parts In-Stock

1+ parts

$16.800

100+ parts

$14.861

1k+ parts

$14.216

10k+ parts

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190

$16.800

$14.861

$14.216

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$30.827

100+ parts

-

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150

$30.827

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Tomark Electronics Ltd

UK . 1,000 parts In-Stock

1+ parts

$33.030

100+ parts

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1,000

$33.030

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Flip Electronics

USA . 99,000 parts In-Stock

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99,000

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TME

Poland . 11,000 parts In-Stock

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$17.013

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11,000

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$17.013

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Vyrian

USA . 9,726 parts In-Stock

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9,726

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,938 parts In-Stock

1+ parts

$9.520

100+ parts

-

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9,938

$9.520

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Semicontronic

India . 10,808 parts In-Stock

1+ parts

$9.800

100+ parts

$9.555

1k+ parts

$9.506

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10,808

$9.800

$9.555

$9.506

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Corphita

USA . 437 parts In-Stock

1+ parts

$10.989

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-

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437

$10.989

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Modulus Dynamics

Lithuania . 934 parts In-Stock

1+ parts

$23.936

100+ parts

$22.979

1k+ parts

$22.021

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934

$23.936

$22.979

$22.021

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$28.602

100+ parts

$27.172

1k+ parts

$27.172

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200

$28.602

$27.172

$27.172

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$30.827

100+ parts

-

1k+ parts

$29.286

10k+ parts

$28.670

2,000

$30.827

-

$29.286

$28.670

Corohmni

South Africa . 172 parts In-Stock

1+ parts

$47.334

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172

$47.334

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Aztec Data Supply Inc.

USA . 285 parts In-Stock

1+ parts

$63.925

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285

$63.925

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QUARKTWIN TECHNOLOGY LTD

USA . 19,159 parts In-Stock

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Argo Parts USA

USA . 3,055 parts In-Stock

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GreenTree Electronics

Israel . 2,675 parts In-Stock

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2,675

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Microchip USA

USA . 2,304 parts In-Stock

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Formix International (Excess)

India . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 852 parts In-Stock

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852

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

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100+ parts

$0.632

1k+ parts

$0.632

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$0.632

100

-

$0.632

$0.632

$0.632

Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.632

1k+ parts

$0.632

10k+ parts

$0.632

100

-

$0.632

$0.632

$0.632

Overview

Unlock the power of cutting-edge technology with the TC234LP32F200NACKXUMA1 microcontroller from Infineon Technologies. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. With its advanced features such as ADC channels, DMA channels, and peripherals like RTC and WDT, this product is a game-changer in the automotive industry. Experience seamless connectivity with CAN, high-speed operation at 200 MHz, and a robust ROM programmability that sets it apart from the competition. Elevate your projects to new heights with the TC234LP32F200NACKXUMA1 - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and reliability of the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards.

Maximum Supply Voltage: 1.43 V

Supports a maximum supply voltage of 1.43 V for versatile usage in various applications.

Package Shape: SQUARE

Square package shape provides a compact form factor for space-saving designs.

Bit Size: 32

32-bit architecture enables high-performance computing and processing capabilities.

No. of Terminals: 144

The high number of terminals allows for versatile connectivity options and interface capabilities.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Multiple package styles offer flexibility in design and application requirements.

Minimum Supply Voltage: 1.17 V

Supports a minimum supply voltage of 1.17 V for efficient power management.

Maximum Operating Temperature: 125 °C

Operates efficiently in high-temperature environments up to 125°C.

Minimum Operating Temperature: -40 °C

Capable of functioning in harsh cold conditions down to -40°C.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

Quality terminal finish ensures reliable electrical connections and long-term performance.

ADC Channels: YES

Integrated ADC channels for analog signal processing and conversion.

DMA Channels: YES

Supports Direct Memory Access channels for efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal position for easy and secure mounting on circuit boards.

ROM Words: 2097152

Large ROM capacity of 2097152 words for storing program data and instructions.

Maximum Seated Height: 1.2 mm

Low seated height of 1.2 mm for compact and slim device designs.

Width: 16 mm

Compact width of 16 mm for space-saving integration in electronic devices.

Peripherals: DMA(16), RTC, WDT

Includes multiple peripherals such as DMA, RTC, and WDT for enhanced functionality and performance.

Maximum Clock Frequency: 200 MHz

High maximum clock frequency of 200 MHz for fast and efficient data processing.

Length: 16 mm

Compact length of 16 mm for small form factor device designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance for reliable performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller with integrated peripherals for all-in-one processing capabilities.

RAM Bytes: 196608

Large RAM capacity of 196608 bytes for data storage and fast access during operation.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and electrical connections.

Nominal Supply Voltage: 1.3 V

Nominal supply voltage of 1.3 V for optimal performance and power efficiency.

Connectivity: CAN(6)

Supports CAN connectivity with 6 channels for communication in automotive and industrial applications.

ROM Programmability: FLASH

Flash ROM programmability for easy and fast updates of program code and data.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4 mm for high-density mounting and compact PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 for reliable performance in moderate humidity conditions.

Speed: 200 rpm

High-speed operation up to 200 rpm for fast data processing and real-time applications.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits for efficient program execution and data storage.

No. of I/O Lines: 120

Large number of I/O lines (120) for versatile connectivity and input/output capabilities.

Technical Specifications

Microcontrollers TC234LP32F200NACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

A/D INPUT LINES 24 CHANNELS (2 MODULES) AVAILABLE

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

200 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

120

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

196608

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6)

Peripherals:

DMA(16), RTC, WDT

Trade Compliance

TC234LP32F200NACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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