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TC234LP32F200FACKXUMA1

Infineon Technologies

TC234LP32F200FACKXUMA1 by Infineon Technologies

Infineon's TC234LP32F200FACKXUMA1 is a 32-bit microcontroller with 144 terminals, operating at up to 200 MHz. Ideal for automotive applications, it features CAN connectivity, DMA and RTC peripherals, and a flash ROM programmability. With a temperature range of -40 to 125 °C, this CMOS technology chip offers high-speed performance in a compact thin profile package.

Median Price

$15.050

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 899 parts In-Stock

1+ parts

$13.020

100+ parts

$8.430

1k+ parts

-

10k+ parts

-

899

$13.020

$8.430

-

-

DigiKey

USA . 80 parts In-Stock

1+ parts

$17.080

100+ parts

$11.719

1k+ parts

$10.753

10k+ parts

-

80

$17.080

$11.719

$10.753

-

Newark

USA . 899 parts In-Stock

1+ parts

$17.590

100+ parts

$12.070

1k+ parts

$11.310

10k+ parts

-

899

$17.590

$12.070

$11.310

-

Element14

Singapore . 899 parts In-Stock

1+ parts

$23.090

100+ parts

$16.970

1k+ parts

-

10k+ parts

-

899

$23.090

$16.970

-

-

Flip Electronics (Authorized)

USA . 119,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

119,000

-

-

-

-

Rochester

USA . 20,443 parts In-Stock

1+ parts

-

100+ parts

$9.930

1k+ parts

$8.880

10k+ parts

$8.360

20,443

-

$9.930

$8.880

$8.360

Verical

USA . 12,531 parts In-Stock

1+ parts

-

100+ parts

$12.412

1k+ parts

$11.100

10k+ parts

$10.450

12,531

-

$12.412

$11.100

$10.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 61 parts In-Stock

1+ parts

$10.478

100+ parts

-

1k+ parts

-

10k+ parts

-

61

$10.478

-

-

-

Vyrian

USA . 761 parts In-Stock

1+ parts

$11.030

100+ parts

-

1k+ parts

-

10k+ parts

-

761

$11.030

-

-

-

Flip Electronics

USA . 119,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

119,000

-

-

-

-

Chip Stock

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,500

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 20,230 parts In-Stock

1+ parts

$9.380

100+ parts

-

1k+ parts

-

10k+ parts

-

20,230

$9.380

-

-

-

Semicontronic

India . 19,983 parts In-Stock

1+ parts

$9.380

100+ parts

$9.146

1k+ parts

$9.099

10k+ parts

-

19,983

$9.380

$9.146

$9.099

-

Corphita

USA . 595 parts In-Stock

1+ parts

$9.927

100+ parts

-

1k+ parts

-

10k+ parts

-

595

$9.927

-

-

-

Modulus Dynamics

Lithuania . 4,587 parts In-Stock

1+ parts

$16.506

100+ parts

$15.846

1k+ parts

$15.186

10k+ parts

-

4,587

$16.506

$15.846

$15.186

-

Corohmni

South Africa . 450 parts In-Stock

1+ parts

$16.506

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$16.506

-

-

-

Continental Prestige Electronics

USA . 1,000 parts In-Stock

1+ parts

$29.260

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$29.260

-

-

-

Microchip USA

USA . 1,875 parts In-Stock

1+ parts

$60.858

100+ parts

-

1k+ parts

-

10k+ parts

-

1,875

$60.858

-

-

-

Argo Parts USA

USA . 5,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,369

-

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

-

-

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-

Overview

Unlock the power of cutting-edge technology with the TC234LP32F200FACKXUMA1 by Infineon Technologies. As a leader in microcontroller manufacturing, Infineon delivers top-notch quality and reliability. This microcontroller boasts a wide range of applications, offering customers unparalleled value and benefits. From automotive to industrial use, its high-performance capabilities, advanced peripherals, and efficient connectivity make it the ideal choice for any project. Experience innovation at its best with the TC234LP32F200FACKXUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the microcontroller, making it suitable for various applications and environments.

Maximum Supply Voltage: 1.43 V

Having a high maximum supply voltage allows for flexibility in power supply options and compatibility with different voltage levels.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle more data at once and execute complex instructions efficiently.

ADC Channels: YES

The presence of ADC (Analog-to-Digital Converter) channels allows the microcontroller to interface with analog sensors and signals, expanding its range of possible applications.

ROM Words: 2097152

The large ROM capacity of 2097152 words enables the storage of a significant amount of program code and data, making this microcontroller suitable for advanced tasks.

Maximum Clock Frequency: 200 MHz

A high maximum clock frequency of 200 MHz enables fast processing speeds and real-time performance, making it ideal for time-sensitive applications.

Connectivity: CAN(6)

The CAN (Controller Area Network) connectivity with 6 channels allows for efficient communication in automotive and industrial applications, enhancing the versatility of this microcontroller.

Technical Specifications

Microcontrollers TC234LP32F200FACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

200 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

120

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Bytes:

196608

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6)

Peripherals:

DMA(16), RTC, WDT

Trade Compliance

TC234LP32F200FACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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