Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 144; Package Shape: SQUARE; No. of DMA Channels: 16;
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Microcontrollers TC234L32F200FABKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies
ADC Channels:
Address Bus Width:
Bit Size:
Boundary Scan:
CPU Family:
DAC Channels:
DMA Channels:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Low Power Mode:
No. of DMA Channels:
No. of Terminals:
No. of Timers:
On Chip Data RAM Width:
On Chip Program ROM Width:
Maximum Operating Temperature:
Minimum Operating Temperature:
PWM Channels:
Package Body Material:
Package Shape:
RAM Bytes:
ROM Words:
ROM Programmability:
Speed:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Position:
Peripheral IC Type:
Data EEPROM Size:
Connectivity:
Peripherals:
Analog To Digital Convertors:
TC234L32F200FABKXUMA1 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SMBJ18CA
Shenzhen Socay Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
Nte Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
FDV304P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
OPA2277UA/2K5E4
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
BAV99
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1554216004
Molex
WIRE AND CABLE;
SS14
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FT232RL-REEL
FTDI
FTDI's FT232RL-REEL is a bus controller with 28 terminals, operating at 3.3V to 5.25V. It supports USB, VBUS, and UART buses with a data transfer rate of 60MBps. Ideal for industrial applications due to its CMOS technology and compatibility with RS232, RS422, and RS485 standards.
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
Vishay Semiconductors
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
ATSAMD21G18A-AUT
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TFQFP; Package Shape: SQUARE;
STM32H747XIH6
STMicroelectronics
STM32H747XIH6 by STMicroelectronics is a 32-bit microcontroller with 26-bit address bus width, 36-Ch 16-Bit ADC channels, and 22 timers. It is ideal for industrial applications requiring CAN, I2C, SPI connectivity and operates at a max clock frequency of 48 MHz. With low power mode and integrated cache, it offers efficient performance in compact square package.
ATXMEGA128A1-AU
Microchip Technology
ATXMEGA128A1-AU by Microchip Technology is a 16-bit microcontroller with 131072 ROM words and 2048 data EEPROM size. It features 8 ADC channels, 78 external interrupts, and operates at a max clock frequency of 32 MHz. Ideal for industrial applications requiring high-speed processing and multiple analog-to-digital converters.
PIC16F877A-I/PT
PIC16F877A-I/PT by Microchip: 8-bit microcontroller, 5V supply, 20MHz clock speed. Ideal for industrial applications with ADC, PWM, USART connectivity and low power mode.
ATMEGA2560-16AUR
ATMEGA2560-16AUR by Microchip Technology is a microcontroller with 16 MHz clock frequency, 131072 ROM words, and 86 I/O lines. It is ideal for industrial applications requiring a max supply voltage of 5.5 V and operating temperatures ranging from -40 to 85 °C. The device features SPI, TWI, USART connectivity and low power mode for efficient performance.
STM32F777BIT6
STM32F777BIT6 by STMicroelectronics is a 32-bit microcontroller with 24-bit address bus width, 208 terminals, and 3.6V max supply voltage. It features ADC and DMA channels, suitable for applications requiring high-speed processing and precision analog-to-digital conversion. With a clock frequency of up to 26MHz, it is ideal for industrial automation and robotics.
ATMEGA324PA-AUR
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
ATMEGA2560-16CUR
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: TFBGA; Package Shape: SQUARE;
STM32H755ZIT6
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
STM32F205VET6TR
STM32F205VET6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 524288 ROM words, and 131072 RAM bytes. It features 16 ADC channels, 2 DAC channels, and 16 DMA channels. Ideal for industrial applications requiring high-speed processing and low power consumption.
STM32H7B0IBK6Q
STM32H7B0IBK6Q by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 3-Ch 12-Bit DAC, and 24-Ch 16-Bit ADC. It features 18 timers, CAN/I2C/I2S/UART/USB connectivity, and operates at up to 50 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral support.
MSP430F5342IRGZR
MSP430F5342IRGZR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 10 RAM words, and 9-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features 3 DMA channels, 19 timers, and various peripherals like BOR and CRC.
TM4C1230H6PMI
TM4C1230H6PMI by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It operates at a max clock frequency of 25 MHz and has 64 terminals, suitable for industrial applications requiring high-speed processing and low power consumption. With features like ADC and DMA channels, it offers versatile functionality in compact dimensions (10mm x 10mm).
STM32H735VGH3
MICROCONTROLLER, RISC;
ATSAMD21G18A-MF
MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
STM32L452CEU6
ATXMEGA128A1U-C7U
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: VFBGA; Package Shape: SQUARE;
ATXMEGA256A3-AU
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
ATMEGA162-16AU
PIC32MX795F512LT-80V/PT
PIC32MX795F512LT-80V/PT by Microchip: 32-bit RISC CPU, 50 MHz clock, 536576 ROM words. Ideal for industrial applications with Ethernet, USB connectivity and low power mode. Features 16-Ch ADC, 8 DMA channels, and 83 I/O lines for versatile design options.
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TC234L32F200NACKXUMA1
Infineon
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: HTFQFP; Package Shape: SQUARE;
TC233LP32F200NACKXUMA1
Infineon Technologies
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: HTFQFP; Package Shape: SQUARE;
TC237LP32F200NACKXUMA1
Infineon's TC237LP32F200NACKXUMA1 is a 32-bit microcontroller with 292 terminals, operating from -40 to 125°C. It features 196KB RAM, CAN connectivity, and Flash ROM programmability. Ideal for automotive applications requiring low-profile components with PWM and DMA capabilities.
TC234LP32F200NACKXUMA1
Infineon's TC234LP32F200NACKXUMA1 microcontroller features 32-bit architecture, 196608 bytes of RAM, and a max clock frequency of 200 MHz. Ideal for automotive applications, it offers connectivity options like CAN(6), DMA(16) peripherals, and on-chip FLASH ROM programmability.
TC233L32F200FACKXUMA1
Infineon's TC233L32F200FACKXUMA1 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 24-Ch 12-Bit ADC channels. Ideal for automotive applications, it offers low power mode, ROM programmability via FLASH, and connectivity options like CAN and FLEXRAY.
TC233L32F200NACKXUMA1
TC233LP32F200FABKXUMA1
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: HLFQFP; Package Shape: SQUARE;
TC233LP32F200NACLXUMA1
TC234LP32F200FACKXUMA1
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: TFQFP; Package Shape: SQUARE;
TC237LP32F200NACLXUMA1
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 292; Package Code: LFBGA; Package Shape: SQUARE;
TC234LP32F200FABKXUMA1
TC233LP32F200FABLXUMA1
TC234LP32F200NACKXUMA1/SAMPLE
MICROCONTROLLER;
TC233LP16F200FABKXUMA1
TC233LC24F133FACKXUMA1
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: HTFQFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G100;
TC233LP16F200NACKXUMA1
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
TC233L32F200FABKXUMA1
TC233LP32F200FAAKXUMA1
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: HLFQFP; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;
TC234LP32F200FAAKXUMA1
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: TFQFP; Package Shape: SQUARE; DAC Channels: NO;
Supply Digital Components
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