Loading...

TC233L32F200FACKXUMA1

Infineon Technologies

TC233L32F200FACKXUMA1 by Infineon Technologies

Infineon's TC233L32F200FACKXUMA1 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 24-Ch 12-Bit ADC channels. Ideal for automotive applications, it offers low power mode, ROM programmability via FLASH, and connectivity options like CAN and FLEXRAY.

Median Price

$9.563

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,894 parts In-Stock

1+ parts

$13.470

100+ parts

$9.113

1k+ parts

$7.650

10k+ parts

-

1,894

$13.470

$9.113

$7.650

-

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$7.650

1k+ parts

$6.840

10k+ parts

$6.440

4,000

-

$7.650

$6.840

$6.440

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$9.563

1k+ parts

$8.550

10k+ parts

$8.050

4,000

-

$9.563

$8.550

$8.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 145 parts In-Stock

1+ parts

$8.075

100+ parts

-

1k+ parts

-

10k+ parts

-

145

$8.075

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$14.690

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$14.690

-

-

-

Rutronik

Germany . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.340

10k+ parts

-

7,000

-

-

$8.340

-

Vyrian

USA . 3,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,272

-

-

-

-

Bristol Electronics

USA . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

172

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,894 parts In-Stock

1+ parts

$7.220

100+ parts

$7.040

1k+ parts

$7.003

10k+ parts

-

2,894

$7.220

$7.040

$7.003

-

Corphita

USA . 426 parts In-Stock

1+ parts

$7.650

100+ parts

-

1k+ parts

-

10k+ parts

-

426

$7.650

-

-

-

Continental Prestige Electronics

USA . 3,878 parts In-Stock

1+ parts

$14.690

100+ parts

-

1k+ parts

-

10k+ parts

$14.396

3,878

$14.690

-

-

$14.396

Netroflash

USA . 500 parts In-Stock

1+ parts

$14.690

100+ parts

-

1k+ parts

$13.955

10k+ parts

$13.662

500

$14.690

-

$13.955

$13.662

Corohmni

South Africa . 484 parts In-Stock

1+ parts

$15.248

100+ parts

-

1k+ parts

-

10k+ parts

-

484

$15.248

-

-

-

Ampacity Inc.

Singapore . 2,923 parts In-Stock

1+ parts

$15.730

100+ parts

-

1k+ parts

-

10k+ parts

-

2,923

$15.730

-

-

-

Aztec Data Supply Inc.

USA . 649 parts In-Stock

1+ parts

$29.400

100+ parts

-

1k+ parts

-

10k+ parts

-

649

$29.400

-

-

-

Component Stockers USA

USA . 1,129 parts In-Stock

1+ parts

$36.200

100+ parts

$28.510

1k+ parts

$24.380

10k+ parts

-

1,129

$36.200

$28.510

$24.380

-

Microchip USA

USA . 2,717 parts In-Stock

1+ parts

$60.858

100+ parts

-

1k+ parts

-

10k+ parts

-

2,717

$60.858

-

-

-

Modulus Dynamics

Lithuania . 543 parts In-Stock

1+ parts

$86.406

100+ parts

$82.950

1k+ parts

$79.494

10k+ parts

-

543

$86.406

$82.950

$79.494

-

Argo Parts USA

USA . 3,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,406

-

-

-

-

Overview

Enhance your automotive applications with the TC233L32F200FACKXUMA1 microcontroller by Infineon Technologies. Boasting top-notch quality and a wide range of peripherals like PWM, RTC, and 24 ADC channels, this microcontroller offers exceptional performance and flexibility. With low power mode, high clock frequency, and 16 DMA channels, it provides efficient operation for various automotive systems. Trust in Infineon's expertise in microcontroller technology to elevate your designs and deliver reliable solutions. Experience the value and benefits of the TC233L32F200FACKXUMA1 for your next project.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and reliability for long-term usage.

Integrated Cache:

YES - The integrated cache helps in faster data access and processing, enhancing overall performance.

Surface Mount:

YES - Surface mount capability makes it easy to integrate into various electronic devices and PCBs.

Maximum Supply Voltage:

1.43 V - Operating within this range ensures stable performance and protects the microcontroller from damage.

On Chip Data RAM Width:

8 - The wide RAM width allows for efficient data processing and storage capabilities.

Package Shape:

SQUARE - The square shape enables easier placement and routing on the circuit board.

Bit Size:

32 - The 32-bit architecture provides enhanced processing power and capabilities.

No. of Terminals:

100 - With a sufficient number of terminals, this microcontroller can accommodate various connections and interfaces.

Package Style:

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH - These package styles offer flexibility in design and application options.

Minimum Supply Voltage:

1.17 V - Operating at a low voltage helps in reducing power consumption and prolonging battery life.

Maximum Operating Temperature:

125 °C - The high operating temperature range makes it suitable for a wide range of industrial and automotive applications.

CPU Family:

TC23X - Belonging to the TC23X CPU family ensures compatibility and support for a range of features and functions.

Minimum Operating Temperature:

40 °C - The low operating temperature range allows for reliable performance even in harsh environments.

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER - This high-quality terminal finish ensures good electrical conductivity and corrosion resistance.

ADC Channels:

YES - The presence of Analog-to-Digital Converter channels expands the microcontroller's capabilities for sensor interfacing.

DMA Channels:

YES - Direct Memory Access channels enable efficient data transfer and processing without CPU intervention.

Terminal Position:

QUAD - The quad terminal position allows for easy soldering and better mechanical stability.

ROM Words:

2097152 - The large ROM capacity enables storing a significant amount of program data and instructions.

Maximum Seated Height:

1.2 mm - The low seated height makes it suitable for compact designs and space-constrained applications.

Width:

12 mm - The compact width enables easy integration into small form factor devices.

Data EEPROM Size:

131072 - The EEPROM size offers ample storage for critical data that needs to be retained during power cycles.

Boundary Scan:

YES - Boundary scan capability simplifies testing and debugging processes during development and production.

Technical Specifications

Microcontrollers TC233L32F200FACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TC23X

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

78

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.55SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

196608

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

200 rpm

Maximum Supply Current:

215 mA

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

131072

Connectivity:

ASCLIN(2), CAN(6), FLEXRAY, I2S, QSPI(4), SENT(4)

Peripherals:

DMA(16), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TC233L32F200FACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19