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TC237LP32F200NACKXUMA1

Infineon Technologies

TC237LP32F200NACKXUMA1 by Infineon Technologies

Infineon's TC237LP32F200NACKXUMA1 is a 32-bit microcontroller with 292 terminals, operating from -40 to 125°C. It features 196KB RAM, CAN connectivity, and Flash ROM programmability. Ideal for automotive applications requiring low-profile components with PWM and DMA capabilities.

Median Price

$14.090

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,000 parts In-Stock

1+ parts

$20.440

100+ parts

$14.168

1k+ parts

$12.086

10k+ parts

-

1,000

$20.440

$14.168

$12.086

-

Avnet

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$13.066

10k+ parts

$12.444

2,000

-

-

$13.066

$12.444

Rochester

USA . 669 parts In-Stock

1+ parts

-

100+ parts

$12.090

1k+ parts

$10.820

10k+ parts

$10.180

669

-

$12.090

$10.820

$10.180

Verical

USA . 669 parts In-Stock

1+ parts

-

100+ parts

$15.113

1k+ parts

$13.525

10k+ parts

$12.725

669

-

$15.113

$13.525

$12.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 455 parts In-Stock

1+ parts

$12.758

100+ parts

-

1k+ parts

-

10k+ parts

-

455

$12.758

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$25.035

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$25.035

-

-

-

Chip Stock

USA . 15,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,420

-

-

-

-

Vyrian

USA . 7,777 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,777

-

-

-

-

Rutronik

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$13.890

10k+ parts

-

5,000

-

-

$13.890

-

Bristol Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 879 parts In-Stock

1+ parts

$10.480

100+ parts

$10.218

1k+ parts

$10.166

10k+ parts

-

879

$10.480

$10.218

$10.166

-

Ampacity Inc.

Singapore . 814 parts In-Stock

1+ parts

$10.480

100+ parts

-

1k+ parts

-

10k+ parts

-

814

$10.480

-

-

-

Corphita

USA . 878 parts In-Stock

1+ parts

$12.087

100+ parts

-

1k+ parts

-

10k+ parts

-

878

$12.087

-

-

-

Aztec Data Supply Inc.

USA . 3,872 parts In-Stock

1+ parts

$16.970

100+ parts

-

1k+ parts

-

10k+ parts

-

3,872

$16.970

-

-

-

Continental Prestige Electronics

USA . 3,736 parts In-Stock

1+ parts

$25.035

100+ parts

-

1k+ parts

-

10k+ parts

$24.534

3,736

$25.035

-

-

$24.534

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$31.429

100+ parts

$29.858

1k+ parts

$29.858

10k+ parts

-

1,000

$31.429

$29.858

$29.858

-

Modulus Dynamics

Lithuania . 4,129 parts In-Stock

1+ parts

$39.248

100+ parts

$37.678

1k+ parts

$36.108

10k+ parts

-

4,129

$39.248

$37.678

$36.108

-

Corohmni

South Africa . 974 parts In-Stock

1+ parts

$45.110

100+ parts

-

1k+ parts

-

10k+ parts

-

974

$45.110

-

-

-

Microchip USA

USA . 1,404 parts In-Stock

1+ parts

$60.860

100+ parts

$59.800

1k+ parts

$59.270

10k+ parts

$58.740

1,404

$60.860

$59.800

$59.270

$58.740

Argo Parts USA

USA . 3,558 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,558

-

-

-

-

Robosynatics

Brazil . 3,361 parts In-Stock

1+ parts

-

100+ parts

$30.794

1k+ parts

$30.165

10k+ parts

$30.165

3,361

-

$30.794

$30.165

$30.165

Lucentia Tech

USA . 3,361 parts In-Stock

1+ parts

-

100+ parts

$30.794

1k+ parts

$30.165

10k+ parts

$30.165

3,361

-

$30.794

$30.165

$30.165

GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$24.534

1k+ parts

$23.783

10k+ parts

$23.283

500

-

$24.534

$23.783

$23.283

Overview

Experience the next level of performance and reliability with the TC237LP32F200NACKXUMA1 microcontroller from Infineon Technologies. As a trusted leader in the industry, Infineon delivers cutting-edge technology with a focus on quality and innovation. This versatile microcontroller is perfect for automotive applications, offering advanced features such as ADC channels, DMA channels, and connectivity options like CAN. With its compact design and low profile package, this microcontroller provides unmatched value and benefits to customers looking for superior performance in their projects. Trust Infineon to power your next generation of products with the TC237LP32F200NACKXUMA1 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort in the manufacturing process.

Bit Size: 32

A 32-bit architecture provides higher performance and processing capabilities compared to lower bit sizes, making this microcontroller suitable for complex applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with a low profile and fine pitch, allowing for space-saving integration in devices with limited space.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product combines a CPU, RAM, ROM, I/O ports, and timers in a single integrated circuit, making it a versatile and efficient solution for various embedded system applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for long-term operation.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V makes this microcontroller compatible with a wide range of electronic devices and systems, providing flexibility in design and integration.

Connectivity: CAN(6)

The Controller Area Network (CAN) connectivity with 6 channels allows for efficient communication in automotive and industrial applications, making this microcontroller suitable for networking and data exchange.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this microcontroller can withstand high-temperature environments without degradation or performance issues, ensuring reliability in harsh conditions.

Technical Specifications

Microcontrollers TC237LP32F200NACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

24 A/D INPUT LINES; 2 NUMBER OF ADC MODULES

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

196608

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

200 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6)

Peripherals:

DMA(16), RTC, WDT

Trade Compliance

TC237LP32F200NACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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