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TC237LP32F200NACLXUMA1

Infineon Technologies

TC237LP32F200NACLXUMA1 by Infineon Technologies

Infineon's TC237LP32F200NACLXUMA1 is a 32-bit microcontroller with 292 terminals, operating at -40 to 125°C. It features 196KB RAM, CAN connectivity, and DMA(16) peripherals for automotive applications. With flash ROM programmability and PWM channels, it offers high-speed performance in a low-profile square package.

Median Price

$14.315

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,702 parts In-Stock

1+ parts

-

100+ parts

$13.300

1k+ parts

$11.900

10k+ parts

$11.200

2,702

-

$13.300

$11.900

$11.200

Verical

USA . 2,702 parts In-Stock

1+ parts

-

100+ parts

$16.625

1k+ parts

$14.875

10k+ parts

$14.000

2,702

-

$16.625

$14.875

$14.000

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$14.315

10k+ parts

-

1,000

-

-

$14.315

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 500 parts In-Stock

1+ parts

$14.032

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$14.032

-

-

-

Vyrian

USA . 6,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,140

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,306 parts In-Stock

1+ parts

$12.550

100+ parts

-

1k+ parts

-

10k+ parts

-

1,306

$12.550

-

-

-

Corphita

USA . 924 parts In-Stock

1+ parts

$13.293

100+ parts

-

1k+ parts

-

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-

924

$13.293

-

-

-

Corohmni

South Africa . 8 parts In-Stock

1+ parts

$15.669

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$15.669

-

-

-

Microchip USA

USA . 1,853 parts In-Stock

1+ parts

$60.860

100+ parts

$59.800

1k+ parts

$59.270

10k+ parts

$58.740

1,853

$60.860

$59.800

$59.270

$58.740

Modulus Dynamics

Lithuania . 2,065 parts In-Stock

1+ parts

$79.963

100+ parts

$76.764

1k+ parts

$73.566

10k+ parts

-

2,065

$79.963

$76.764

$73.566

-

Argo Parts USA

USA . 5,093 parts In-Stock

1+ parts

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5,093

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Continental Prestige Electronics

USA . 2,296 parts In-Stock

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2,296

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-

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Component Stockers USA

USA . 1,200 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$24.370

10k+ parts

-

1,200

-

-

$24.370

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Aranea Global

USA . 50 parts In-Stock

1+ parts

-

100+ parts

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50

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Overview

Unleash the power of innovation with the TC237LP32F200NACLXUMA1 microcontroller by Infineon Technologies. This cutting-edge device boasts top-of-the-line quality and reliability, making it the perfect choice for a wide range of applications in the automotive industry. With advanced features like ADC and DMA channels, PWM capabilities, and connectivity options such as CAN, this microcontroller offers unmatched performance and versatility. Experience seamless operation and exceptional efficiency with the TC237LP32F200NACLXUMA1 - the ultimate solution for your next project. Elevate your designs to new heights with this superior product from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and efficient soldering onto circuit boards.

Bit Size: 32

32-bit architecture provides enhanced performance and processing capabilities.

No. of Terminals: 292

High number of terminals allow for versatile connectivity options with other components.

Maximum Operating Temperature: 125 °C

High maximum operating temperature makes this microcontroller suitable for automotive applications or other environments with elevated temperatures.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is designed for embedded systems and offers a wide range of integrated peripherals for easy system integration.

RAM Bytes: 196608

Large RAM capacity enables efficient data storage and processing within the microcontroller.

Peripheral DMA Channels: YES

DMA channels help offload data transfer tasks from the CPU, improving overall system performance.

Technology: CMOS

CMOS technology offers low power consumption, making this microcontroller energy-efficient.

Connectivity: CAN(6)

CAN connectivity allows for communication with a variety of devices and systems, making this microcontroller suitable for automotive and industrial applications.

Technical Specifications

Microcontrollers TC237LP32F200NACLXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

24 A/D INPUT LINES; 2 NUMBER OF ADC MODULES

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

196608

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

200 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6)

Peripherals:

DMA(16), RTC, WDT

Trade Compliance

TC237LP32F200NACLXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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