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TC233L32F200NACKXUMA1

Infineon Technologies

TC233L32F200NACKXUMA1 by Infineon Technologies

Infineon's TC233L32F200NACKXUMA1 microcontroller features 32-bit architecture, 2097152 ROM words, and 24-Ch 12-Bit ADC channels. Ideal for automotive applications with peripherals like CAN, FLEXRAY, and PWM support. Operating temperature ranges from -40 to 125 °C with low power mode enabled.

Median Price

$15.270

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 973 parts In-Stock

1+ parts

$15.270

100+ parts

$10.390

1k+ parts

$9.720

10k+ parts

-

973

$15.270

$10.390

$9.720

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Mouser Electronics

USA . 651 parts In-Stock

1+ parts

$17.450

100+ parts

$11.200

1k+ parts

$9.230

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-

651

$17.450

$11.200

$9.230

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Element14

Singapore . 973 parts In-Stock

1+ parts

$57.420

100+ parts

$45.310

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-

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973

$57.420

$45.310

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RS (Exports)

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

$35.913

1k+ parts

$32.428

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3,000

-

$35.913

$32.428

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Rochester

USA . 1,301 parts In-Stock

1+ parts

-

100+ parts

$8.500

1k+ parts

$7.610

10k+ parts

$7.160

1,301

-

$8.500

$7.610

$7.160

Verical

USA . 1,301 parts In-Stock

1+ parts

-

100+ parts

$10.625

1k+ parts

$9.512

10k+ parts

$8.950

1,301

-

$10.625

$9.512

$8.950

Farnell

UK . 973 parts In-Stock

1+ parts

-

100+ parts

$8.440

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-

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973

-

$8.440

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 136 parts In-Stock

1+ parts

$8.978

100+ parts

-

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-

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136

$8.978

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$30.316

100+ parts

-

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500

$30.316

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Chip Stock

USA . 6,500 parts In-Stock

1+ parts

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6,500

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Rutronik

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

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$9.250

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5,000

-

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$9.250

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Cyclops Electronics Ltd

UK . 4,000 parts In-Stock

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4,000

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Vyrian

USA . 1,152 parts In-Stock

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Bristol Electronics

USA . 1,118 parts In-Stock

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1,118

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Martec Srl

Italy . 394 parts In-Stock

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394

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Distributors (Availability)

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Semicontronic

India . 1,335 parts In-Stock

1+ parts

$8.030

100+ parts

$7.829

1k+ parts

$7.789

10k+ parts

-

1,335

$8.030

$7.829

$7.789

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Corphita

USA . 554 parts In-Stock

1+ parts

$8.505

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-

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-

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554

$8.505

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Modulus Dynamics

Lithuania . 311 parts In-Stock

1+ parts

$13.601

100+ parts

$13.057

1k+ parts

$12.513

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311

$13.601

$13.057

$12.513

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Corohmni

South Africa . 115 parts In-Stock

1+ parts

$13.601

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115

$13.601

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Aztec Data Supply Inc.

USA . 1,916 parts In-Stock

1+ parts

$15.580

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$15.580

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Ampacity Inc.

Singapore . 1,414 parts In-Stock

1+ parts

$17.480

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1,414

$17.480

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Continental Prestige Electronics

USA . 975 parts In-Stock

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$27.450

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975

$27.450

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$29.710

100+ parts

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$28.522

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$29.710

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$28.522

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Microchip USA

USA . 1,420 parts In-Stock

1+ parts

$60.858

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$60.858

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iodParts Technologies Inc.

India . 5,000 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Argo Parts USA

USA . 2,243 parts In-Stock

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Overview

Unlock the potential of your automotive applications with the TC233L32F200NACKXUMA1 microcontroller by Infineon Technologies. With a maximum clock frequency of 40 MHz and an integrated cache, this high-quality product offers unparalleled performance and reliability. Designed with advanced technology and a wide range of peripherals including ADC channels and PWM channels, this microcontroller is ideal for a variety of automotive systems. Trust in Infineon Technologies to deliver cutting-edge solutions for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to external elements, making the product suitable for various environments.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the microcontroller.

Maximum Supply Voltage: 1.43 V

The higher maximum supply voltage allows flexibility in power supply options.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width allows for faster data processing and storage.

Package Shape: SQUARE

The square package shape allows for efficient use of space on PCBs.

Bit Size: 32

A 32-bit architecture provides better performance and data handling capabilities compared to lower bit sizes.

No. of Terminals: 100

Having a higher number of terminals allows for more connectivity options and peripheral interfaces.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product offers integrated peripherals and processing capabilities in a single chip.

Maximum Clock Frequency: 40 MHz

The high clock frequency enables fast and efficient execution of instructions and tasks.

ADC Channels: YES

Having analog-to-digital converter channels allows for interfacing with analog sensors and signals.

Technical Specifications

Microcontrollers TC233L32F200NACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TC23X

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

78

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.55SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

196608

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

200 rpm

Maximum Supply Current:

215 mA

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

131072

Connectivity:

ASCLIN(2), CAN(6), FLEXRAY, I2S, QSPI(4), SENT(4)

Peripherals:

DMA(16), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TC233L32F200NACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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