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SPW15N60CFD

Infineon Technologies

SPW15N60CFD by Infineon Technologies

SPW15N60CFD by Infineon is a N-CHANNEL FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 33A IDM, 460mJ EAS, and 0.33ohm RDS(on). Operates in ENHANCEMENT MODE with max temp of 150°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Zilex Electronics Inc.

Canada . 1,334 parts In-Stock

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Vyrian

USA . 1,186 parts In-Stock

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Digiode

USA . 810 parts In-Stock

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Bristol Electronics

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Nova Conductors

Japan . 10 parts In-Stock

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Aztec Data Supply Inc.

USA . 452 parts In-Stock

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$0.294

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Modulus Dynamics

Lithuania . 24,207 parts In-Stock

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$0.522

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$0.501

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$0.480

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AZTECH Wire

Italy . 509 parts In-Stock

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$10.896

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Ampacity Inc.

Singapore . 1,343 parts In-Stock

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$38.050

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A-Z Elektronik GmbH

Germany . 7,478 parts In-Stock

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Advanced Electronics

New Zealand . 2,868 parts In-Stock

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Microchip USA

USA . 2,251 parts In-Stock

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Kepictronics

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Argo Parts USA

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Continental Prestige Electronics

USA . 602 parts In-Stock

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Corphita

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Aranea Global

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Overview

Unlock the power of innovation with the SPW15N60CFD by Infineon Technologies. Crafted with precision and expertise, this Power Field Effect Transistor offers unparalleled performance and reliability for a wide range of applications. From switching to enhancement mode operation, this N-channel transistor with a built-in diode provides superior functionality and efficiency. With a high DS breakdown voltage and a maximum pulsed drain current of 33A, the SPW15N60CFD is designed to meet the demands of today's dynamic technological landscape. Experience the value and benefits this product brings, revolutionizing the way you work and creating endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides excellent protection for the transistor, ensuring its longevity and reliability.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this transistor a convenient choice for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers efficient performance and high-speed switching capabilities.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this transistor can handle high voltage applications safely and reliably.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control and higher efficiency compared to depletion mode transistors, making this product a suitable choice for a wide range of applications.

Maximum Power Dissipation (Abs): 156 W

With a high power dissipation rating, this transistor can handle high power loads without overheating, ensuring stable performance under heavy loads.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures, this transistor is suitable for applications that require elevated temperature operation.

Technical Specifications

Power Field Effect Transistors (FET) SPW15N60CFD attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

460 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

13.4 A

Maximum Drain Current (ID):

13.4 A

Maximum Drain-Source On Resistance:

.33 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

33 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPW15N60CFD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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