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SPW17N80C3A

Infineon Technologies

SPW17N80C3A by Infineon Technologies

SPW17N80C3A by Infineon is a N-CHANNEL Power FET with 800V DS Breakdown Voltage. It has a max ID of 17A and 0.29 ohm Drain-Source On Resistance, making it ideal for SWITCHING applications. Operating in ENHANCEMENT MODE, this transistor can handle up to 51A IDM and has an EAS rating of 670mJ at a max temp of 150°C.

Median Price

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4

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1k+

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Vyrian

USA . 8,347 parts In-Stock

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Digiode

USA . 643 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Cogito LLC

Ukraine . 3 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,861 parts In-Stock

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$0.430

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$0.430

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Modulus Dynamics

Lithuania . 8,455 parts In-Stock

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$1.467

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$1.408

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$1.350

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Corohmni

South Africa . 1,014 parts In-Stock

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Semicontronic

India . 786 parts In-Stock

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$14.050

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$13.699

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$13.628

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AZTECH Wire

Italy . 381 parts In-Stock

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$15.465

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Ampacity Inc.

Singapore . 197 parts In-Stock

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$40.050

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QUARKTWIN TECHNOLOGY LTD

USA . 23,008 parts In-Stock

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Argo Parts USA

USA . 4,822 parts In-Stock

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Continental Prestige Electronics

USA . 4,640 parts In-Stock

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Microchip USA

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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Authorized Procurement Solutions

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Bastille Electronics

Australia . 500 parts In-Stock

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Corphita

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Overview

Unlock the power of efficiency and reliability with the SPW17N80C3A by Infineon Technologies. Manufactured with the highest quality standards, this N-CHANNEL Power Field Effect Transistor is designed for switching applications, offering a breakthrough in performance and durability. With a maximum drain current of 17A and a minimum DS breakdown voltage of 800V, this transistor provides unmatched value and benefits to customers looking for superior electronic components. Upgrade your projects with the SPW17N80C3A and experience the difference Infineon Technologies can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection to the transistor, making it suitable for harsh environments.

Polarity or Channel Type: N-CHANNEL

N-channel type allows for efficient switching characteristics and enhanced performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and provides reverse current protection, making it convenient for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in controlling power flow.

Minimum DS Breakdown Voltage: 800 V

High breakdown voltage allows for operation in high voltage circuits, ensuring safety and reliability.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into circuit boards, saving space and providing a neat appearance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables easy and secure soldering onto circuit boards, ensuring a reliable connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers fast and efficient switching characteristics, improving overall performance.

Maximum Pulsed Drain Current (IDM): 51 A

High pulsed drain current rating allows for handling of high current spikes, ensuring reliability in demanding conditions.

Avalanche Energy Rating (EAS): 670 mJ

Avalanche energy rating indicates the ability to withstand high energy spikes, making it suitable for rugged applications.

No. of Terminals: 3

Three terminals provide easy and secure connections, ensuring proper integration into circuitry.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for easy mounting on heat sinks, improving thermal dissipation and overall performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low noise operation, enhancing overall performance.

Maximum Operating Temperature: 150 °C

High maximum operating temperature rating ensures reliability in a wide range of operating conditions.

Transistor Element Material: SILICON

Silicon material provides high thermal conductivity and reliability, making it suitable for high-power applications.

Maximum Drain Current (ID): 17 A

High maximum drain current rating allows for handling of high currents, ensuring reliable operation in power circuits.

Maximum Drain-Source On Resistance: 0.29 ohm

Low drain-source on resistance minimizes power losses and improves efficiency in power switching applications.

Terminal Position: SINGLE

Single terminal position simplifies installation and ensures proper orientation in circuit boards.

Technical Specifications

Power Field Effect Transistors (FET) SPW17N80C3A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH VOLTAGE

Avalanche Energy Rating (EAS):

670 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.29 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

51 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPW17N80C3A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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