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SPW11N60CFD

Infineon Technologies

SPW11N60CFD by Infineon Technologies

SPW11N60CFD by Infineon Technologies is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It features a max IDM of 28A and EAS of 340mJ, making it ideal for SWITCHING applications. With a package style of FLANGE MOUNT and operating temperature up to 150°C, this MOSFET offers reliable performance in various power electronics systems.

Median Price

$1.890

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1 parts In-Stock

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$1.020

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$1.020

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Rochester

USA . 391 parts In-Stock

1+ parts

$1.910

100+ parts

$1.800

1k+ parts

$1.620

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391

$1.910

$1.800

$1.620

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DigiKey

USA . 391 parts In-Stock

1+ parts

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$1.890

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391

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$1.890

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 102 parts In-Stock

1+ parts

$0.969

100+ parts

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102

$0.969

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.638

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300

$1.638

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Zilex Electronics Inc.

Canada . 240 parts In-Stock

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240

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Vyrian

USA . 26 parts In-Stock

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R&J Components

USA . 20 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 150 parts In-Stock

1+ parts

$0.870

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150

$0.870

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Corphita

USA . 813 parts In-Stock

1+ parts

$0.918

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813

$0.918

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Modulus Dynamics

Lithuania . 10,880 parts In-Stock

1+ parts

$1.668

100+ parts

$1.601

1k+ parts

$1.535

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10,880

$1.668

$1.601

$1.535

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Microchip USA

USA . 6,512 parts In-Stock

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$11.375

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6,512

$11.375

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AZTECH Wire

Italy . 668 parts In-Stock

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$18.069

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A-Z Elektronik GmbH

Germany . 2,172 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Kepictronics

USA . 90 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$1.605

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$1.556

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$1.523

50

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$1.605

$1.556

$1.523

Overview

Discover the power of the SPW11N60CFD by Infineon Technologies, a high-quality N-channel Power Field Effect Transistor with a built-in diode for enhanced performance in switching applications. Infineon Technologies, known for its cutting-edge technology, delivers a product that offers reliability, efficiency, and durability. Ideal for various electrical systems, this transistor provides a maximum drain current of 11A and an impressive minimum DS breakdown voltage of 600V. Upgrade your projects with the SPW11N60CFD and experience the difference in performance and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the FET, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and lower resistance, making them ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient current flow and easy integration into circuits, reducing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power consumption, making it ideal for energy-efficient devices.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications, ensuring safety and reliability in demanding conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into circuit boards, making it a versatile choice for various designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, ensuring stable performance in harsh environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage to turn on, offering precise control and allowing for efficient power management in applications.

Maximum Pulsed Drain Current (IDM): 28 A

The high pulsed drain current capability allows for handling sudden power surges, making this FET suitable for high-power applications.

Avalanche Energy Rating (EAS): 340 mJ

The high avalanche energy rating ensures the FET can withstand transient voltage spikes, offering protection against voltage surges.

Maximum Drain Current (Abs) (ID): 11 A

With a high maximum drain current, this FET can handle large current loads, making it suitable for power-intensive applications.

No. of Terminals: 3

The three-terminal design allows for easy interfacing with other components, simplifying circuit design and assembly.

Maximum Power Dissipation (Abs): 125 W

The high power dissipation rating allows the FET to handle heat effectively, ensuring long-term reliability and performance in demanding conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount style provides secure mechanical mounting, ensuring stability and reliability in applications where vibration or shock is a concern.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers low power consumption and fast switching speeds, making this FET suitable for high-efficiency applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, ensuring reliable performance in harsh environments.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability and performance, making this FET a dependable choice for various applications.

Maximum Drain-Source On Resistance: 0.44 ohm

The low on-resistance minimizes power loss and heat dissipation, making this FET efficient for high-current switching applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and assembly, making it easy to integrate this FET into various applications.

Technical Specifications

Power Field Effect Transistors (FET) SPW11N60CFD attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

340 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.44 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPW11N60CFD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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