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S6J32GEKSNSE20000

Infineon Technologies

S6J32GEKSNSE20000 by Infineon Technologies

Infineon's S6J32GEKSNSE20000 is a SoC with CMOS technology, operating b/w -40 to 105 °C. It has 208 terminals in a flatpack package style, suitable for automotive applications due to AEC-Q100 screening and TS 16949 compliance. With a supply voltage range of 1.1V to 1.3V, it offers high performance in a compact form factor.

Median Price

$28.337

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 360 parts In-Stock

1+ parts

$29.120

100+ parts

$22.660

1k+ parts

-

10k+ parts

-

360

$29.120

$22.660

-

-

Rochester

USA . 131 parts In-Stock

1+ parts

-

100+ parts

$22.660

1k+ parts

$20.270

10k+ parts

$19.080

131

-

$22.660

$20.270

$19.080

Verical

USA . 131 parts In-Stock

1+ parts

-

100+ parts

$28.337

1k+ parts

$25.350

10k+ parts

$23.863

131

-

$28.337

$25.350

$23.863

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 764 parts In-Stock

1+ parts

$23.921

100+ parts

-

1k+ parts

-

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764

$23.921

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-

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$31.723

100+ parts

-

1k+ parts

-

10k+ parts

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750

$31.723

-

-

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Vyrian

USA . 9 parts In-Stock

1+ parts

-

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-

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9

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 622 parts In-Stock

1+ parts

$9.617

100+ parts

-

1k+ parts

-

10k+ parts

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622

$9.617

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-

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Ampacity Inc.

Singapore . 207 parts In-Stock

1+ parts

$21.400

100+ parts

-

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207

$21.400

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Corphita

USA . 195 parts In-Stock

1+ parts

$22.662

100+ parts

-

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195

$22.662

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$31.089

100+ parts

-

1k+ parts

$29.845

10k+ parts

-

50

$31.089

-

$29.845

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Continental Prestige Electronics

USA . 1,843 parts In-Stock

1+ parts

$31.723

100+ parts

-

1k+ parts

-

10k+ parts

$31.089

1,843

$31.723

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-

$31.089

Microchip USA

USA . 2,968 parts In-Stock

1+ parts

$63.479

100+ parts

-

1k+ parts

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10k+ parts

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2,968

$63.479

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Modulus Dynamics

Lithuania . 3,723 parts In-Stock

1+ parts

$84.327

100+ parts

$80.954

1k+ parts

$77.581

10k+ parts

-

3,723

$84.327

$80.954

$77.581

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Argo Parts USA

USA . 4,841 parts In-Stock

1+ parts

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4,841

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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100+ parts

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1,000

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Overview

Unleash the power of innovation with the S6J32GEKSNSE20000 by Infineon Technologies. Crafted with precision and quality, this product offers unmatched reliability and performance in the realm of Other Function uPs,uCs & Peripheral ICs. Designed to exceed expectations, this device is AEC-Q100 and TS 16949 certified, ensuring top-notch quality for automotive applications. With a sleek design and advanced technology, the S6J32GEKSNSE20000 provides customers with exceptional value and benefits, making it the ultimate choice for cutting-edge solutions in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and cost-effective, making this product a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy installation and efficient use of PCB space.

Maximum Supply Voltage: 1.3 V

The high maximum supply voltage allows for flexibility in power requirements.

Screening Level: AEC-Q100; TS 16949

The AEC-Q100 and TS 16949 screening certifications ensure high quality and reliability for automotive and industrial applications.

Package Shape: SQUARE

The square package shape allows for easy placement and alignment on the PCB.

No. of Terminals: 208

With a high number of terminals, this product can accommodate a wide range of connections and functionalities.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The variety of package styles offer flexibility in design and integration options.

Minimum Supply Voltage: 1.1 V

The low minimum supply voltage allows for efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme cold conditions.

Terminal Position: QUAD

The quad terminal position enables efficient connection to external devices and components.

Maximum Seated Height: 1.7 mm

The low seated height allows for a compact and space-saving design.

Width: 28 mm

The 28mm width provides a good balance between compact size and ease of handling.

Length: 28 mm

The 28mm length offers a square form factor for easy integration into designs.

Peripheral IC Type: SoC

The System-on-Chip (SoC) design integrates multiple functions into a single IC, reducing the need for external components and improving overall system efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product suitable for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliability in PCB soldering connections.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V ensures stable and efficient operation in typical operating conditions.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting and compact PCB designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs S6J32GEKSNSE20000 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PQFP-G208

Length:

28 mm

No. of Terminals:

208

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

SoC

Trade Compliance

S6J32GEKSNSE20000 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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