Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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SoC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: HLFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel;
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Microchip USA
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Other Function uPs,uCs & Peripheral ICs S6J32FEKSNSE20000 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies
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S6J32FEKSNSE20000 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H743ZIT6
STMicroelectronics
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
SMBJ18CA
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
Thinking Electronic Industrial
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
2N7002
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
LL4148
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
Comchip Technology
Synsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CC0603KRX7R9BB103
Yageo
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
International Semiconductor
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
1N5819HW-7-F
Diodes Incorporated
1N5819HW-7-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 1A output current, and 0.75V forward voltage. It's a surface mount device in a small outline package ideal for efficiency applications at temperatures ranging from -65 to 125°C.
LTC4263CS#PBF
Analog Devices
LTC4263CS#PBF by Analog Devices is a CMOS microprocessor circuit with 14 terminals, operating b/w 0-70°C. It has a supply voltage range of 4.5-5.5V and peak reflow temperature of 260°C. Ideal for various applications requiring small outline surface mount packages.
OMAPL138EZWTA3E
OMAPL138EZWTA3E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It is ideal for industrial applications requiring I2C, SPI, UART, and USB bus compatibility. This low-profile IC operates b/w -40 to 105 °C with a supply voltage range of 1.25V to 1.35V.
MCIMX6S5DVM10AC
NXP Semiconductors
MCIMX6S5DVM10AC by NXP Semiconductors is a SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage range of 1.35-1.5V. With 624 terminals in a low profile grid array package, it's ideal for applications requiring high performance and compact design.
DS2408S/TR
Dallas Semiconductor
Other uPs/uCs/Peripheral ICs;
163PC01D36
Honeywell Sensing And Control
MCIMX356AJQ5C
MCIMX356AJQ5C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.33V to 1.47V, making it ideal for industrial applications requiring low profile, fine pitch ICs in a grid array package style.
FT800Q-T
FTDI
FTDI's FT800Q-T is a 48-terminal peripheral IC with a square package style. It operates b/w -40 to 85°C, with supply voltage ranging from 2.97V to 3.63V. Ideal for industrial applications requiring a CMOS microprocessor circuit in a compact chip carrier form factor.
XCZU4CG-1SFVC784I
Xilinx
XCZU4CG-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with a supply voltage of 0.85 V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
AM4372BZDNA60
AM4372BZDNA60 by Texas Instruments is a System on Chip with 491 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with supply voltage range of 1.056V to 1.144V. Ideal for industrial applications requiring high performance and reliability in compact designs.
MIMXRT1021CAG4A
The NXP Semiconductors MIMXRT1021CAG4A is an SoC with a peak reflow temperature of 260°C and industrial-grade temperature tolerance. It has a max time at peak reflow temperature of 40s, making it suitable for applications requiring high-performance processing in harsh environments.
1436
Ndk America
ESP32-S3-WROOM-1-N8R2
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1-N8R2 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage of 3-3.6 V. Ideal for IoT applications due to its compact MICROELECTRONIC ASSEMBLY package style and surface mount capability.
TDA8029HL/C207,151
TDA8029HL/C207,151 by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 32 terminals in a SQUARE package. It operates b/w -40 to 90 °C and supports power supplies of 1.8/5,3/5 V. Ideal for industrial applications requiring high temperature tolerance and surface mount compatibility.
CY8C4247LQI-BL483
Infineon Technologies
CY8C4247LQI-BL483 by Infineon is a PROGRAMMABLE SoC with NICKEL PALLADIUM GOLD finish. It can withstand peak reflow temp of 260°C for 30s, suitable for INDUSTRIAL applications. MSL level of 3 makes it ideal for Other Function uPs,uCs & Peripheral ICs.
MC13213R2
MC13213R2 by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 2-3.4 V. Ideal for industrial applications requiring a compact GRID ARRAY package with 71 terminals and very thin profile.
ST33HTPH2X32AHD8
ST33HTPH2X32AHD8 by STMicroelectronics is a 32-terminal cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105 °C, in a square chip carrier package style. Ideal for secure applications requiring a nominal voltage of 1.8 V and very thin profile design.
AX8052F143-3-TX30
Onsemi
AX8052F143-3-TX30 by Onsemi is a 40-terminal System on Chip with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 1.8V to 3.6V. Ideal for industrial applications requiring a compact, low-profile chip carrier package style.
STSPIN32F0601TR
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
MCIMX6Q5EYM12AD
MCIMX6Q5EYM12AD by NXP Semiconductors is a System on Chip with 624 terminals, operating at -20 to 105 °C. It features a low profile grid array package style and CMOS technology, suitable for various applications requiring high performance and low power consumption.
ST33HTPH2E28AHD0
ST33HTPH2E28AHD0 by STMicroelectronics is a 28-terminal IC with CMOS technology, operating b/w -40 to 105°C. It's a cryptographic authenticator with 1.8V supply voltage, suitable for secure applications requiring compact design and surface mount compatibility.
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S6J32GEKSNSE20000
SoC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: HLFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
S6J32EEKSNSE20000
SoC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: HLFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
S6J32EELSNSC20000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel;
S6J32EELTMSC2000A
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G216;
S6J32EELTPSC20000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
S6J32FELSNSC20000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Maximum Seated Height: 1.7 mm;
S6J32FELTNSC20000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
S6J32GEKSMSE2000A
SoC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: HLFQFP; Package Shape: SQUARE; Length: 28 mm;
S6J32GELSNSC20000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
S6J32GELTNSC20000
S6J32GELTPSC20000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 1.3 V;
S6J32HELTNSC20000
S6J32HELTNSC2D000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Package Equivalence Code: QFP216,1.02SQ,16;
S6J32JEKSNSE20000
SoC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: HLFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH;
S6J32JELSNSC20000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Width: 24 mm;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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