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PTVA123501FCV1R0

Infineon Technologies

PTVA123501FCV1R0 by Infineon Technologies

Infineon's PTVA123501FCV1R0 is an N-CHANNEL RF Power FET with 105V DS Breakdown Voltage and 16.5dB Power Gain, ideal for AMPLIFIER applications in L BAND frequencies. It features a CERAMIC/METAL-SEALED COFIRED package, operates in ENHANCEMENT MODE at up to 225°C, and has a RECTANGULAR shape with FLAT terminals for easy surface mounting.

Median Price

$362.470

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 91 parts In-Stock

1+ parts

$362.470

100+ parts

$347.162

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91

$362.470

$347.162

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Distributors (In-Stock)

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$321.238

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700

$321.238

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Digiode

USA . 574 parts In-Stock

1+ parts

$385.330

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574

$385.330

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Vyrian

USA . 836 parts In-Stock

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836

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Modulus Dynamics

Lithuania . 5,401 parts In-Stock

1+ parts

$1.705

100+ parts

$1.637

1k+ parts

$1.569

10k+ parts

-

5,401

$1.705

$1.637

$1.569

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AZTECH Wire

Italy . 1,660 parts In-Stock

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$18.783

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1,660

$18.783

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Aranea Global

USA . 50 parts In-Stock

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$314.813

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$302.220

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50

$314.813

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$302.220

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Microchip USA

USA . 9,619 parts In-Stock

1+ parts

$327.660

100+ parts

$318.920

1k+ parts

$314.560

10k+ parts

$310.190

9,619

$327.660

$318.920

$314.560

$310.190

Corphita

USA . 461 parts In-Stock

1+ parts

$365.049

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461

$365.049

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Ampacity Inc.

Singapore . 91 parts In-Stock

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$750.380

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91

$750.380

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QUARKTWIN TECHNOLOGY LTD

USA . 9,948 parts In-Stock

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9,948

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the PTVA123501FCV1R0 from Infineon Technologies. As a leader in RF Power Field Effect Transistors, Infineon guarantees top-notch quality and performance. Ideal for amplifier applications in the L band, this N-channel transistor offers a minimum DS breakdown voltage of 105V and a minimum power gain of 16.5 dB. With a ceramic, metal-sealed cofired package and a maximum operating temperature of 225°C, this product delivers unmatched reliability and efficiency. Elevate your projects with the PTVA123501FCV1R0 and experience the seamless integration and superior functionality it provides.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures excellent durability and reliability, making this product suitable for rugged environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics compared to P-channel, providing superior amplification and efficiency.

Minimum DS Breakdown Voltage: 105 V

With a high breakdown voltage, this FET can handle high voltages effectively, increasing its reliability in demanding applications.

Minimum Power Gain (Gp): 16.5 dB

The high power gain of 16.5 dB ensures efficient amplification of signals, making this FET ideal for use in amplifier circuits.

Terminal Form: FLAT

The flat terminal form simplifies the connection process and ensures stable connections, contributing to the overall performance of the transistor.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the flow of current, allowing for precise amplification and signal processing.

Highest Frequency Band: L BAND

Operating in the L-band frequency spectrum ensures compatibility with a wide range of wireless communication applications, making this FET versatile and suitable for various uses.

Maximum Operating Temperature: 225 °C

The high maximum operating temperature of 225°C allows this FET to withstand elevated temperatures without compromising performance, making it reliable in challenging operating conditions.

Technical Specifications

RF Power Field Effect Transistors (FET) PTVA123501FCV1R0 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

105 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-CDFP-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Polarity or Channel Type:

Minimum Power Gain (Gp):

16.5 dB

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PTVA123501FCV1R0 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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