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IPP048N04NGXKSA1

Infineon Technologies

IPP048N04NGXKSA1 by Infineon Technologies

Infineon's IPP048N04NGXKSA1 is a N-CHANNEL FET with 40V DS Breakdown Voltage, 0.0048 ohm RDS(on), and 70A ID. Ideal for SWITCHING applications, it features a 400A IDM and 35mJ EAS rating. The PLASTIC/EPOXY package with BUILT-IN DIODE suits ENHANCEMENT MODE operations in various industries.

Median Price

$0.898

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 500 parts In-Stock

1+ parts

$0.748

100+ parts

-

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$0.741

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500

$0.748

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$0.741

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Mouser Electronics

USA . 84 parts In-Stock

1+ parts

$1.550

100+ parts

$1.030

1k+ parts

$0.815

10k+ parts

$0.805

84

$1.550

$1.030

$0.815

$0.805

Rochester

USA . 12,359 parts In-Stock

1+ parts

-

100+ parts

$0.882

1k+ parts

$0.732

10k+ parts

$0.652

12,359

-

$0.882

$0.732

$0.652

Verical

USA . 7,000 parts In-Stock

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$0.915

10k+ parts

$0.816

7,000

-

-

$0.915

$0.816

Chip1Stop

Japan . 500 parts In-Stock

1+ parts

-

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$0.804

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$0.580

10k+ parts

-

500

-

$0.804

$0.580

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RS (Exports)

UK . 230 parts In-Stock

1+ parts

-

100+ parts

$1.051

1k+ parts

$0.854

10k+ parts

-

230

-

$1.051

$0.854

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Distributors (In-Stock)

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Digiode

USA . 224 parts In-Stock

1+ parts

$0.711

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224

$0.711

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Vyrian

USA . 4,716 parts In-Stock

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4,716

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Distributors (Availability)

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Corphita

USA . 465 parts In-Stock

1+ parts

$0.673

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465

$0.673

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Modulus Dynamics

Lithuania . 1,606 parts In-Stock

1+ parts

$0.977

100+ parts

$0.938

1k+ parts

$0.899

10k+ parts

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1,606

$0.977

$0.938

$0.899

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Microchip USA

USA . 432 parts In-Stock

1+ parts

$6.219

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432

$6.219

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Perfect Parts

USA . 5,107 parts In-Stock

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5,107

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Overview

Looking to power up your electronic devices with efficiency and reliability? Look no further than the IPP048N04NGXKSA1 by Infineon Technologies. Made with cutting-edge technology and high-quality materials, this N-CHANNEL Power Field Effect Transistor is perfect for switching applications. With a maximum drain current of 70A and a low drain-source on resistance of 0.0048 ohm, this transistor offers top-notch performance and durability. Whether you're working on industrial equipment or automotive systems, the IPP048N04NGXKSA1 will provide the power and efficiency you need. Upgrade your projects today with this high-performance component from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and faster switching speeds, making this transistor a good choice for applications that require quick response times.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle higher voltages without compromising its performance, making it suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps prevent damage from voltage spikes and reverse currents, increasing the reliability and longevity of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor ensures efficient power management and control.

Maximum Pulsed Drain Current (IDM): 400 A

With a high pulsed drain current rating, this FET can handle sudden spikes in current without overheating or failing, making it suitable for demanding applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong and reliable connection, ensuring secure mounting and easy integration into electronic circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and efficiency, making this transistor a reliable choice for various applications.

Maximum Drain Current (ID): 70 A

With a maximum drain current of 70A, this FET can handle high power loads, making it suitable for applications that require a high current-carrying capacity.

Maximum Drain-Source On Resistance: 0.0048 ohm

The low on-resistance of 0.0048 ohm ensures minimal power loss and efficient operation, making this transistor an energy-efficient choice.

Technical Specifications

Power Field Effect Transistors (FET) IPP048N04NGXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

35 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

70 A

Maximum Drain-Source On Resistance:

.0048 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP048N04NGXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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