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IPD90N04S4-03

Infineon Technologies

IPD90N04S4-03 by Infineon Technologies

IPD90N04S4-03 by Infineon is a N-channel Power FET with 40V DS breakdown voltage and 360A pulsed drain current. Ideal for applications requiring high power dissipation, it features a built-in diode, 0.0032 ohm max on-resistance, and operates in enhancement mode.

Median Price

$1.930

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,021 parts In-Stock

1+ parts

$1.930

100+ parts

$0.814

1k+ parts

$0.584

10k+ parts

$0.530

4,021

$1.930

$0.814

$0.584

$0.530

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 661 parts In-Stock

1+ parts

$1.159

100+ parts

-

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661

$1.159

-

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Vyrian

USA . 8 parts In-Stock

1+ parts

$1.220

100+ parts

-

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8

$1.220

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Freelance Electronics

USA . 15 parts In-Stock

1+ parts

$2.950

100+ parts

$3.098

1k+ parts

$2.920

10k+ parts

-

15

$2.950

$3.098

$2.920

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Rutronik

Germany . 37,500 parts In-Stock

1+ parts

-

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$0.859

37,500

-

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$0.859

Cyclops Electronics Ltd

UK . 27,445 parts In-Stock

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27,445

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Elcom Components

USA . 2,500 parts In-Stock

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2,500

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ComSIT Distribution GmbH

Germany . 965 parts In-Stock

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965

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Distributors (Availability)

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Corphita

USA . 622 parts In-Stock

1+ parts

$1.098

100+ parts

-

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622

$1.098

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Modulus Dynamics

Lithuania . 15,662 parts In-Stock

1+ parts

$1.672

100+ parts

$1.605

1k+ parts

$1.538

10k+ parts

-

15,662

$1.672

$1.605

$1.538

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Andel Nordic

Denmark . 91 parts In-Stock

1+ parts

$32.430

100+ parts

-

1k+ parts

$22.704

10k+ parts

$22.704

91

$32.430

-

$22.704

$22.704

Authorized Procurement Solutions

USA . 60,000 parts In-Stock

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60,000

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ChipstoGo Electronic ltd

UK . 39,611 parts In-Stock

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Lixinc

USA . 18,036 parts In-Stock

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18,036

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Perfect Parts

USA . 11,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,250 parts In-Stock

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7,250

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Kepictronics

USA . 4,320 parts In-Stock

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4,320

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Infinite Electronics LLP (Excess)

. 2,508 parts In-Stock

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2,508

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Futuretech Components

Singapore . 2,500 parts In-Stock

1+ parts

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2,500

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

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1,500

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Overview

Infineon Technologies 20V to 40V N-Channel Automotive MOSFETs are AEC-Q101 qualified for automotive applications, and available in a wide range of package types, including D-PAK, TOLL (HSOF-8),  TOLG (HSOG-8), and SSO8 (TDSON-8). These MOSFETs address broad range of applications, including EPS motor control, 3-phase and H-bridge motors, HVAC fan control, and electric pumps in combination with PWM control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and faster switching speeds, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide additional protection against reverse current flow.

Surface Mount: YES

Surface mount packaging allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this FET can handle a wide range of voltages, making it versatile and reliable in different circuit applications.

Maximum Pulsed Drain Current (IDM): 360 A

The high pulsed drain current rating indicates that this FET can handle large transient currents, making it suitable for applications with high power demands.

Maximum Power Dissipation (Abs): 94 W

The high power dissipation capability ensures that the FET can handle significant amounts of power without overheating, making it reliable in high-power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate in harsh environments and high-temperature conditions without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) IPD90N04S4-03 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

185 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

90 A

Maximum Drain Current (ID):

90 A

Maximum Drain-Source On Resistance:

.0032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

360 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPD90N04S4-03 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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