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IPA60R125P6XKSA1

Infineon Technologies

IPA60R125P6XKSA1 by Infineon Technologies

Infineon's IPA60R125P6XKSA1 is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for switching applications. Featuring 87A IDM and 0.125ohm RDS(on), it operates in enhancement mode with 636mJ EAS rating. The transistor has a plastic/epoxy body, single configuration with built-in diode, and through-hole terminals.

Median Price

$2.586

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 864 parts In-Stock

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$4.180

100+ parts

$1.980

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$1.680

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864

$4.180

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$1.680

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Verical

USA . 450 parts In-Stock

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$1.430

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$1.249

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$1.430

$1.249

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RS (Exports)

UK . 268 parts In-Stock

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$3.712

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$3.511

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268

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$3.511

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Rochester

USA . 3 parts In-Stock

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$1.460

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$1.310

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$1.230

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$1.460

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Distributors (In-Stock)

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Digiode

USA . 666 parts In-Stock

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$1.890

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Vyrian

USA . 4,861 parts In-Stock

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Rutronik

Germany . 1,500 parts In-Stock

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$1.640

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$1.330

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$1.640

$1.330

Bristol Electronics

USA . 99 parts In-Stock

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$2.300

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99

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$2.300

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 23,432 parts In-Stock

1+ parts

$1.558

100+ parts

$1.496

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$1.433

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23,432

$1.558

$1.496

$1.433

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Corphita

USA . 954 parts In-Stock

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$1.791

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954

$1.791

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Component Stockers USA

USA . 564 parts In-Stock

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$2.730

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$4.490

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564

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$4.490

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Microchip USA

USA . 6,405 parts In-Stock

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$15.400

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QUARKTWIN TECHNOLOGY LTD

USA . 6,461 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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iodParts Technologies Inc.

India . 400 parts In-Stock

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Perfect Parts

USA . 34 parts In-Stock

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Overview

Power up your applications with the IPA60R125P6XKSA1 Power Field Effect Transistor by Infineon Technologies. Designed with top-notch quality and reliability, this N-CHANNEL transistor offers seamless switching performance for a variety of applications. With a high breakdown voltage of 600V and a maximum pulsed drain current of 87A, this transistor is perfect for enhancing the efficiency and performance of your designs. Trust in the expertise of Infineon Technologies to deliver cutting-edge technology that exceeds expectations. Upgrade your systems today with the IPA60R125P6XKSA1 and experience the difference in power and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to impact, making the product suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and lower resistance compared to P-channel FETs, making them more efficient for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient control of reverse current flow, protecting the circuit and increasing overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and high efficiency, making it ideal for power control applications.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage rating of 600V ensures reliable operation in high voltage applications, providing protection against voltage surges and spikes.

Maximum Pulsed Drain Current (IDM): 87 A

With a maximum pulsed drain current of 87A, this FET can handle high current loads, making it suitable for power-intensive applications.

Avalanche Energy Rating (EAS): 636 mJ

The high avalanche energy rating of 636mJ indicates the ability of the FET to withstand high energy pulses, enhancing its ruggedness and reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low leakage currents, high input impedance, and fast switching speeds, making this FET efficient and reliable for various applications.

Minimum Operating Temperature: -55 °C

The FET can operate efficiently in low-temperature environments down to -55°C, making it suitable for industrial and automotive applications where temperature variations occur.

Maximum Drain-Source On Resistance: 0.125 ohm

The low drain-source on resistance of 0.125 ohm minimizes power loss and improves efficiency during conduction, making it an energy-efficient choice for power switching.

Technical Specifications

Power Field Effect Transistors (FET) IPA60R125P6XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

636 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

87 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPA60R125P6XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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