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IKFW75N60ETXKSA1

Infineon Technologies

IKFW75N60ETXKSA1 by Infineon Technologies

Infineon IKFW75N60ETXKSA1 is an N-Channel IGBT with VCEsat of 2V, toff of 417ns, and Pmax of 178W. Ideal for high-power applications like motor drives and inverters due to its max VCE of 600V, IC of 80A, and operating temp range from -40°C to 175°C.

Median Price

$6.890

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 200 parts In-Stock

1+ parts

$11.720

100+ parts

$7.028

1k+ parts

$5.664

10k+ parts

-

200

$11.720

$7.028

$5.664

-

Rochester

USA . 1,752 parts In-Stock

1+ parts

-

100+ parts

$5.660

1k+ parts

$5.070

10k+ parts

$4.770

1,752

-

$5.660

$5.070

$4.770

Verical

USA . 1,200 parts In-Stock

1+ parts

-

100+ parts

$7.075

1k+ parts

$6.338

10k+ parts

$5.963

1,200

-

$7.075

$6.338

$5.963

Avnet

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$6.706

1k+ parts

$6.049

10k+ parts

-

600

-

$6.706

$6.049

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 661 parts In-Stock

1+ parts

$8.265

100+ parts

-

1k+ parts

-

10k+ parts

-

661

$8.265

-

-

-

Vyrian

USA . 3,854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,854

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 22,099 parts In-Stock

1+ parts

$1.738

100+ parts

$1.668

1k+ parts

$1.599

10k+ parts

-

22,099

$1.738

$1.668

$1.599

-

Corphita

USA . 34 parts In-Stock

1+ parts

$7.830

100+ parts

-

1k+ parts

-

10k+ parts

-

34

$7.830

-

-

-

Microchip USA

USA . 6,246 parts In-Stock

1+ parts

$23.099

100+ parts

-

1k+ parts

-

10k+ parts

-

6,246

$23.099

-

-

-

Overview

Unlock the power of efficient energy management with the IKFW75N60ETXKSA1 by Infineon Technologies. As a leading manufacturer in insulated gate bipolar transistors, Infineon delivers unmatched quality and reliability in every product. Ideal for various applications, this N-Channel transistor offers a maximum collector-emitter voltage of 600V and a maximum collector current of 80A. With a nominal turn-off time of 417ns and a turn-on time of 79ns, this transistor ensures optimal performance and efficiency. Experience the value and benefits that Infineon brings to customers through cutting-edge technology and superior engineering.

Feature Benefit Bullets

Polarity or Channel Type

N-Channel IGBTs are known for their higher input impedance and faster switching speed compared to P-Channel IGBTs, making them suitable for high power applications.

Maximum VCEsat

Low VCEsat indicates minimal energy loss during operation, leading to higher efficiency and better performance.

Nominal Turn Off Time (toff)

Faster turn-off time allows for better control and switching capabilities in applications requiring precise timing.

Maximum Power Dissipation (Abs)

High power dissipation capability ensures the IGBT can handle demanding loads without overheating or performance degradation.

Maximum Operating Temperature

High maximum operating temperature tolerance ensures the IGBT can operate reliably in a wide range of environments without overheating.

Maximum Collector-Emitter Voltage

High maximum VCE voltage rating allows the IGBT to handle high voltage applications without breakdown or damage.

Transistor Element Material

Silicon is a common and reliable material for IGBTs, providing good thermal conductivity and electrical properties for efficient performance.

Maximum Gate-Emitter Voltage

High maximum gate-emitter voltage rating allows for better control over the switching characteristics of the IGBT.

Minimum Operating Temperature

Wide range of minimum operating temperature ensures the IGBT can also operate in extreme cold environments without performance issues.

Maximum Collector Current (IC)

High maximum collector current rating allows the IGBT to handle high current loads without overheating or failing.

Maximum Gate-Emitter Threshold Voltage

Proper gate-emitter threshold voltage ensures reliable and stable operation of the IGBT in various switching conditions.

Terminal Finish

Tin terminal finish ensures good electrical conductivity and corrosion resistance for long-term reliability.

Case Connection

Isolated case connection helps in preventing short circuits and improves the overall safety and reliability of the IGBT.

Nominal Turn On Time (ton)

Fast turn-on time allows for quick response and high-speed switching capabilities in applications requiring rapid switching.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKFW75N60ETXKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Terminal Finish:

TIN

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

417 ns

Nominal Turn On Time (ton):

79 ns

Maximum VCEsat:

2 V

Trade Compliance

IKFW75N60ETXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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