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IKFW50N60ETXKSA1

Infineon Technologies

IKFW50N60ETXKSA1 by Infineon Technologies

IKFW50N60ETXKSA1 by Infineon: N-Channel IGBT with VCEsat of 2V, toff of 378ns, and Pdiss of 164W. Ideal for high-power applications like motor drives and renewable energy systems due to its max VCE of 600V and IC of 73A. Operating temp range from -40°C to 175°C ensures reliability in various environments.

Median Price

$4.710

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 189 parts In-Stock

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$3.685

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Chip1Stop

Japan . 189 parts In-Stock

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$4.510

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DigiKey

USA . 240 parts In-Stock

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$10.170

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$6.028

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$4.707

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240

$10.170

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$4.707

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Rochester

USA . 307 parts In-Stock

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$4.710

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$4.220

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$3.970

307

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Verical

USA . 270 parts In-Stock

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$5.888

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$5.275

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$4.963

270

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$4.963

Distributors (In-Stock)

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Digiode

USA . 752 parts In-Stock

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$4.284

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Vyrian

USA . 6,363 parts In-Stock

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TME

Poland . 2 parts In-Stock

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$5.340

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 1,837 parts In-Stock

1+ parts

$0.507

100+ parts

$0.487

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$0.466

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1,837

$0.507

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Corphita

USA . 865 parts In-Stock

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$4.059

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Microchip USA

USA . 4,591 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Perfect Parts

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Overview

Unlock the potential of your electronic applications with the IKFW50N60ETXKSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers high-quality Insulated Gate Bipolar Transistors (IGBT) that offer reliable performance and efficiency. Whether you're looking to enhance power supplies, motor control systems, or renewable energy solutions, this N-Channel transistor provides superior power dissipation and temperature resistance for optimal operation. Experience the value and benefits of Infineon Technologies' IGBTs and take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-Channel

N-Channel type provides high efficiency and fast switching capabilities, making it suitable for various applications.

Maximum VCEsat: 2 V

Low saturation voltage results in lower power dissipation and increased efficiency in operation.

Nominal Turn Off Time (toff): 378 ns

Fast turn off time allows for quick switching and improved performance of the transistor.

Maximum Power Dissipation (Abs): 164 W

High power dissipation capability ensures reliable operation under demanding conditions.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows for use in various environments and applications.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating provides for safe and efficient operation in high voltage applications.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability for the IGBT transistor.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating allows for reliable control and switching of the transistor.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme cold conditions.

Maximum Collector Current (IC): 73 A

High collector current rating enables the transistor to handle large current loads effectively.

Maximum Gate-Emitter Threshold Voltage: 5.7 V

Optimal gate-emitter threshold voltage ensures proper turn-on of the transistor for efficient operation.

Terminal Finish: TIN

TIN terminal finish provides good solderability and conductivity for reliable connections.

Case Connection: ISOLATED

Isolated case connection offers improved safety and protection against electrical hazards.

Nominal Turn On Time (ton): 62 ns

Fast turn on time results in quick response and effective switching of the transistor.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKFW50N60ETXKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Terminal Finish:

TIN

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

378 ns

Nominal Turn On Time (ton):

62 ns

Maximum VCEsat:

2 V

Trade Compliance

IKFW50N60ETXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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