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IKFW60N60DH3EXKSA1

Infineon Technologies

IKFW60N60DH3EXKSA1 by Infineon Technologies

IKFW60N60DH3EXKSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max VCEsat of 2.7V and a max collector current (IC) of 53A. It is commonly used for power control applications due to its high power dissipation of 141W and fast nominal turn on time (ton) of 60ns.

Median Price

$5.368

Lifecycle Status

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7

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1k+

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Chip1Stop

Japan . 240 parts In-Stock

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$5.830

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$4.040

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240

$5.830

$4.040

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Mouser Electronics

USA . 62 parts In-Stock

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$6.000

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$3.190

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62

$6.000

$3.190

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Verical

USA . 240 parts In-Stock

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$4.040

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240

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$4.040

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RS (Exports)

UK . 28 parts In-Stock

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$4.907

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$4.700

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28

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$4.907

$4.700

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Digiode

USA . 785 parts In-Stock

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$4.000

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785

$4.000

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Nova Conductors

Japan . 50 parts In-Stock

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$4.348

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50

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Vyrian

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5,872

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Ampacity Inc.

Singapore . 237 parts In-Stock

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$3.270

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237

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Corphita

USA . 368 parts In-Stock

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$3.789

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368

$3.789

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Modulus Dynamics

Lithuania . 24,044 parts In-Stock

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$4.135

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$3.970

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$3.804

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24,044

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Argo Parts USA

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Netroflash

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$4.261

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Continental Prestige Electronics

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AZTECH Wire

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Microchip USA

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Perfect Parts

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iodParts Technologies Inc.

India . 240 parts In-Stock

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Overview

Discover the power of the IKFW60N60DH3EXKSA1 by Infineon Technologies, a high-quality Insulated Gate Bipolar Transistor (IGBT) that offers unparalleled performance and reliability. With its N-CHANNEL polarity and SINGLE configuration with built-in diode, this transistor is perfect for power control applications. Its maximum collector-emitter voltage of 600V and maximum gate-emitter voltage of 20V ensure efficient power management. Experience the benefits of its low VCEsat of 2.7V, fast turn-on time of 60ns, and impressive maximum operating temperature of 175°C. Trust Infineon Technologies to deliver superior products, and unlock new possibilities in your projects with the IKFW60N60DH3EXKSA1.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides durability and protection for the internal components of the product, making it suitable for various environments.

Polarity or Channel Type:

N-CHANNEL. This polarity allows for efficient power control and improved performance in electronic circuits.

Configuration:

SINGLE WITH BUILT-IN DIODE. Having a built-in diode simplifies circuit design and saves space, making this product convenient for power control applications.

Transistor Application:

POWER CONTROL. Designed specifically for power control, this product can handle high currents and voltages effectively.

Maximum VCEsat:

2.7 V. With a low saturation voltage, this IGBT minimizes power loss and enhances energy efficiency in power control applications.

Package Shape:

RECTANGULAR. The rectangular shape of the package facilitates easy mounting and ensures compatibility with standard electronic equipment.

Terminal Form:

THROUGH-HOLE. Through-hole terminals provide secure and reliable connections, making installation and maintenance hassle-free.

No. of Elements:

1. This IGBT contains a single element, simplifying circuit assembly and reducing complexity.

Nominal Turn Off Time (toff):

219 ns. With a fast turn-off time, this IGBT enables precise control over power switching, ensuring efficient operation.

No. of Terminals:

3. The presence of three terminals allows for easy integration into electronic circuits with common three-terminal device configurations.

Maximum Power Dissipation (Abs):

141 W. This high power dissipation capability ensures the IGBT can handle demanding power control tasks without overheating.

Package Style (Meter):

FLANGE MOUNT. The flange mount package style enables secure mounting and offers stability for reliable operation in industrial applications.

Maximum Operating Temperature:

175 °C. With a high maximum operating temperature, this IGBT can withstand demanding environments, ensuring long-term reliability.

Maximum Collector-Emitter Voltage:

600 V. The high collector-emitter voltage rating provides versatility for various power control applications, accommodating a wide range of voltage levels.

Transistor Element Material:

SILICON. Made of silicon, this IGBT offers excellent performance, reliability, and compatibility with existing electronic systems.

Maximum Gate-Emitter Voltage:

20 V. The high gate-emitter voltage rating allows for precise control and efficient switching in power control circuits.

Minimum Operating Temperature:

40 °C. With a low minimum operating temperature, this IGBT is suitable for use in extreme cold environments.

Maximum Collector Current (IC):

53 A. The high collector current capability makes this IGBT ideal for power control applications that require handling high currents.

Maximum Gate-Emitter Threshold Voltage:

5.7 V. The gate-emitter threshold voltage provides a suitable voltage range to ensure proper functioning and reliable operation.

Terminal Finish:

TIN. The tin terminal finish offers corrosion resistance and provides a solid connection for improved performance and longevity.

Terminal Position:

SINGLE. With a single terminal position, this IGBT simplifies installation and reduces the chances of wiring errors.

Case Connection:

ISOLATED. The isolated case connection prevents electrical interference and improves the safety and performance of the device.

Nominal Turn On Time (ton):

60 ns. The fast turn-on time ensures quick response and efficient power switching, allowing for precise power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKFW60N60DH3EXKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

219 ns

Nominal Turn On Time (ton):

60 ns

Maximum VCEsat:

2.7 V

Trade Compliance

IKFW60N60DH3EXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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