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FS900R08A2P2B32BOSA1

Infineon Technologies

FS900R08A2P2B32BOSA1 by Infineon Technologies

Infineon's FS900R08A2P2B32BOSA1 IGBT features 750V VCE, 6.5V VGE, and 1546W Ptot. Ideal for high-power applications with N-Channel polarity, it operates b/w -40°C to 150°C efficiently with fast turn-on/off times of 500ns and 820ns respectively.

Median Price

$837.240

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 3 parts In-Stock

1+ parts

$691.600

100+ parts

$650.100

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$608.610

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3

$691.600

$650.100

$608.610

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DigiKey

USA . 120 parts In-Stock

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$837.240

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120

$837.240

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Verical

USA . 3 parts In-Stock

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$864.500

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$812.625

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$760.763

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3

$864.500

$812.625

$760.763

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Distributors (In-Stock)

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Digiode

USA . 611 parts In-Stock

1+ parts

$764.788

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611

$764.788

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Vyrian

USA . 4,031 parts In-Stock

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Flip Electronics

USA . 720 parts In-Stock

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720

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 25,760 parts In-Stock

1+ parts

$1.320

100+ parts

$1.267

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$1.214

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25,760

$1.320

$1.267

$1.214

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Corphita

USA . 651 parts In-Stock

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$724.536

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651

$724.536

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Microchip USA

USA . 398 parts In-Stock

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$850.047

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398

$850.047

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Northwest PG Solutions

USA . 2,229 parts In-Stock

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Native Components

USA . 66 parts In-Stock

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Overview

Unlock the power of advanced technology with the FS900R08A2P2B32BOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like this one, designed for maximum performance and reliability. Whether you're looking to enhance motor control systems, renewable energy inverters, or industrial applications, this N-Channel IGBT offers superior efficiency and power dissipation, ensuring optimal functionality even in challenging conditions. Experience the innovation and value Infineon brings to the table with the FS900R08A2P2B32BOSA1.

Feature Benefit Bullets

Polarity or Channel Type: N-Channel

N-Channel IGBTs typically have lower conduction losses and higher efficiency compared to P-Channel IGBTs, making them a good choice for high power applications.

Maximum VCEsat: 6.5 V

Low VCEsat value indicates low voltage drop across the collector-emitter junction when conducting, leading to higher efficiency and reduced power losses.

Nominal Turn Off Time (toff): 820 ns

Fast turn off time allows for efficient switching and helps in reducing switching losses in high frequency applications.

Maximum Power Dissipation (Abs): 1546 W

High power dissipation capability allows the IGBT to handle large amounts of power without getting damaged, making it suitable for high power applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance ensures reliability and stability of the device even in harsh operating conditions.

Maximum Collector-Emitter Voltage: 750 V

High voltage rating enables the IGBT to be used in high voltage applications, offering versatility and flexibility in design.

Transistor Element Material: SILICON

Silicon-based IGBTs offer high performance, reliability, and efficiency, making them a preferred choice for many applications.

Maximum Gate-Emitter Voltage: 20 V

Higher gate-emitter voltage rating provides better control and stability during switching operations, ensuring proper functioning of the IGBT.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the IGBT to operate in extreme cold conditions without any performance degradation.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Low gate-emitter threshold voltage ensures easy turn-on and turn-off of the IGBT, improving efficiency and reducing power losses.

Case Connection: ISOLATED

Isolated case connection provides better thermal management and electrical isolation, enhancing safety and reliability of the device.

Nominal Turn On Time (ton): 500 ns

Fast turn on time allows for quick switching and efficient operation, improving overall performance of the IGBT in high-speed applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS900R08A2P2B32BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

750 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

820 ns

Nominal Turn On Time (ton):

500 ns

Maximum VCEsat:

6.5 V

Trade Compliance

FS900R08A2P2B32BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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