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FF400R06KE3

Infineon Technologies

FF400R06KE3 by Infineon Technologies

Infineon Technologies' FF400R06KE3 is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements, built-in diode, and VCEsat of 1.9V. Ideal for POWER CONTROL applications, it has a max IC of 500A, Ptot of 1250W, and Tjmax of 175°C. With fast turn-off time (toff) of 600ns and turn-on time (ton) of 190ns, it ensures efficient power management in various systems.

Median Price

$198.430

Lifecycle Status

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7

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1k+

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Mouser Electronics

USA . 195 parts In-Stock

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Forefront Electronics and Design

USA . 6 parts In-Stock

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$122.500

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Digiode

USA . 945 parts In-Stock

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$135.328

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Vyrian

USA . 605 parts In-Stock

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Sensible Micro Corp

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Nova Conductors

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Lantek

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Aztec Data Supply Inc.

USA . 436 parts In-Stock

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$0.550

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Modulus Dynamics

Lithuania . 20,831 parts In-Stock

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$1.545

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$1.483

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$1.421

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AZTECH Wire

Italy . 281 parts In-Stock

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$10.251

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Andel Nordic

Denmark . 4,795 parts In-Stock

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$44.190

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$30.934

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Ampacity Inc.

Singapore . 676 parts In-Stock

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$121.080

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Corphita

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Infinite Electronics LLP (Excess)

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Argo Parts USA

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Authorized Procurement Solutions

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Advanced Electronics

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Continental Prestige Electronics

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Perfect Parts

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Bastille Electronics

Australia . 700 parts In-Stock

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Kepictronics

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Experience unparalleled power control with the FF400R06KE3 by Infineon Technologies. As a leading manufacturer in the industry, Infineon brings you top-of-the-line Insulated Gate Bipolar Transistors (IGBT) that are perfect for a wide range of applications. With its N-CHANNEL polarity and innovative design featuring series connected, center tap, 2 elements with built-in diode configuration, this transistor offers superior performance and reliability. The FF400R06KE3 is designed to handle high power dissipation, making it ideal for demanding tasks. Trust Infineon to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-state voltage drop and higher current capability, making them suitable for high-power applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for improved efficiency and reliability in power control applications.

Maximum VCEsat: 1.9 V

The low VCEsat value indicates minimal power dissipation during operation, enhancing energy efficiency.

Maximum Power Dissipation (Abs): 1250 W

With a high maximum power dissipation rating, this IGBT can handle large amounts of power without failure.

Maximum Collector-Emitter Voltage: 600 V

The high VCE rating allows for operation in high voltage applications, increasing the versatility of this IGBT.

Maximum Collector Current (IC): 500 A

The high maximum collector current rating makes this IGBT suitable for high-power applications that require high current handling capability.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF400R06KE3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X7

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

7

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

600 ns

Nominal Turn On Time (ton):

190 ns

Maximum VCEsat:

1.9 V

Trade Compliance

FF400R06KE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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